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Numerical Analysis of Thermal Management for High Power LED Array

Authors :
Shen Yingdong
Dai Junfeng
Wang Yanlong
Source :
E3S Web of Conferences, Vol 257, p 01033 (2021)
Publication Year :
2021
Publisher :
EDP Sciences, 2021.

Abstract

Adequate thermal management to remove and dissipate the heat produced by the LED is one of the main challenges in designing LED applications. In view of the above problems, this paper analyzed a heat sink as a heat exchanger for the LED array via the experiment combined with the numerical simulation. The results show that the heat sink is necessary for the LED array to guarantee reliable and safe operation. Moreover, the influence of the height of heat sink on the heat transfer of the LED array is also analyzed, and the optimized height of the heat sink for the 20W LED array is 20 mm. Considering the heat transfer and the manufacturing cost, increasing the heat sink area blindly is not the best way to reduce the LED junction temperature, and more specific work should be considered.

Subjects

Subjects :
Environmental sciences
GE1-350

Details

Language :
English, French
ISSN :
22671242
Volume :
257
Database :
Directory of Open Access Journals
Journal :
E3S Web of Conferences
Publication Type :
Academic Journal
Accession number :
edsdoj.f71a1ce9b53546c8a5c2227aea6a3188
Document Type :
article
Full Text :
https://doi.org/10.1051/e3sconf/202125701033