Next-generation valve design for copper CMP: addressing agglomeration, shear forces, contamination and waste: the movement from aluminum to copper seeding and the attending challenges of copper CMP have placed tremendous responsibility on slurry delivery systems. New designs, new thinking begin to emerge

Copper physical vapor deposition (PVD) seeding and subsequent fill by electroplating has become the process of choice for microchip fabrication. As line widths shrink, aluminum becomes insufficiently effective as a [...]