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Three-dimensional integration: technology, use, and issues for mixed-signal applications
- Source :
- IEEE Transactions on Electron Devices. March, 2003, Vol. 50 Issue 3, p601, 9 p.
- Publication Year :
- 2003
-
Abstract
- A low-thermal-budget 3-D fabrication technique for mixed-signal applications is described and discussed.
- Subjects :
- Silicon-on-isolator -- Research
Embedded systems -- Research
Crosstalk -- Research
Semiconductor chips -- Research
Integrated circuits -- Research
Complementary metal oxide semiconductors -- Research
System on a chip
Embedded system
Standard IC
Business
Electronics
Electronics and electrical industries
Subjects
Details
- Language :
- English
- ISSN :
- 00189383
- Volume :
- 50
- Issue :
- 3
- Database :
- Gale General OneFile
- Journal :
- IEEE Transactions on Electron Devices
- Publication Type :
- Academic Journal
- Accession number :
- edsgcl.109227582