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CMP road gets rough

Authors :
McCoy, Michael
Source :
Chemical & Engineering News. August 2, 2004, Vol. 82 Issue 31, p20, 4 p.
Publication Year :
2004

Abstract

An increase in the number of companies in the chip-smoothing chemical market involving the chemical mechanical planarization (CMP) slurries is highlighted. CMP is a technique used by chipmakers to smooth or polish the successive layers of circuitry that they deposit on silicon wafers while fabricating a chip.

Subjects

Subjects :
Slurry -- Chemical properties
Slurry -- Mechanical properties
Central processing units -- Maintenance and repair
Microprocessors -- Maintenance and repair
Microprocessor
Microprocessor upgrade
Chemicals, plastics and rubber industries
Engineering and manufacturing industries

Details

Language :
English
ISSN :
00092347
Volume :
82
Issue :
31
Database :
Gale General OneFile
Journal :
Chemical & Engineering News
Publication Type :
Periodical
Accession number :
edsgcl.125969929

Tools

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