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CMP road gets rough
- Source :
- Chemical & Engineering News. August 2, 2004, Vol. 82 Issue 31, p20, 4 p.
- Publication Year :
- 2004
-
Abstract
- An increase in the number of companies in the chip-smoothing chemical market involving the chemical mechanical planarization (CMP) slurries is highlighted. CMP is a technique used by chipmakers to smooth or polish the successive layers of circuitry that they deposit on silicon wafers while fabricating a chip.
Details
- Language :
- English
- ISSN :
- 00092347
- Volume :
- 82
- Issue :
- 31
- Database :
- Gale General OneFile
- Journal :
- Chemical & Engineering News
- Publication Type :
- Periodical
- Accession number :
- edsgcl.125969929