Solder creep-fatigue analysis by an energy-partitioning approach

The feasibilty of using an energy-partitioning approach in investigating the creep and fatigue behaviors of solder materials is discussed. The technique, which is based on the Halford-Manson strain-range partitioning method, is capable of examining the factors that affect solder fatigue behavior. It relies on the solder material's stress-strain history in establishing the inelastic work dissipated and elastic strain-energy stored during each temperature cycle. This technique can be very useful in the systematic analysis of solder fatigue behavior.