A forecast on the future of hybrid wafer scale integration technology

Authors :: Fillion, Raymond A.
Source :: IEEE Transactions on Components, Hybrids, and Manufacturing Technology. Nov, 1993, Vol. 16 Issue 7, p615, 11 p.
Publication Year :: 1993
Abstract: A study on the developmental trends in hybrid wafer scale integration technology reveals that future multichip module (MCM) circuits design trends will be on high performance digital MCMs as well as analog mixed signal and microwave MCMs. MCMs will be available in three-dimensional stacked configurations. Present day MCM manufacturing processes are the chip on board and MCM-laminate method, MCM-substrate method and the MCM-ceramic method.

Subjects :: Integrated circuits -- Wafer-scale integration
Circuit design -- Forecasts and trends
Semiconductor chips -- Production processes
Business
Engineering and manufacturing industries
Science and technology

ISSN :: 01486411
Volume :: 16
Issue :: 7
Database :: Gale General OneFile
Journal :: IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Publication Type :: Academic Journal
Accession number :: edsgcl.14971507

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