Metal foam and finned metal foam heat sinks for electronics cooling in buoyancy-induced convection

MLA

Bhattacharya, A., and R. L. Mahajan. “Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced Convection.” Journal of Electronic Packaging, vol. 128, no. 3, Sept. 2006, p. 259. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsggo&AN=edsgcl.153049738&authtype=sso&custid=ns315887.

APA

Bhattacharya, A., & Mahajan, R. L. (2006). Metal foam and finned metal foam heat sinks for electronics cooling in buoyancy-induced convection. Journal of Electronic Packaging, 128(3), 259.

Chicago

Bhattacharya, A., and R.L. Mahajan. 2006. “Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced Convection.” Journal of Electronic Packaging 128 (3): 259. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsggo&AN=edsgcl.153049738&authtype=sso&custid=ns315887.