Back to Search
Start Over
Experimental method to thermally deembed pads from R[sub TH] measurements
- Source :
- IEEE Transactions on Electron Devices. Oct, 2006, Vol. 53 Issue 10, p2540, 5 p.
- Publication Year :
- 2006
-
Abstract
- Test structures with various width metal traces between the emitter pad and the device's emitter are fabricated in a 200-GHz InP double heterojunction bipolar transistor (HBT) process. A method of using the measured thermal resistance (R[sub TH]) of these structures and a simple resistive network model to deembed the pads is presented.
Details
- Language :
- English
- ISSN :
- 00189383
- Volume :
- 53
- Issue :
- 10
- Database :
- Gale General OneFile
- Journal :
- IEEE Transactions on Electron Devices
- Publication Type :
- Academic Journal
- Accession number :
- edsgcl.153940732