Influence of redeposition on the plasma etching dynamics

The measurement of the degree of redeposition of sputtered species during the etching of platinum (Pt), barium-strontium-titanate (BST), strontium-bismuth-tantalate (SBT), and photoresist (PR) in a high-density argon plasma is reported. The result data shows that depending on the plasma etching conditions, redepostion effect could induce misinterpretation of the etch rate data.