Application of gamma distribution in electromigration for submicron interconnects

Authors :: Raghavan, Nagarajan
Roy, Arijit
Source :: Journal of Applied Physics. Nov 15, 2007, Vol. 102 Issue 10, 103703-1-103703-9
Publication Year :: 2007
Abstract: The gamma distribution is better than the lognormal distribution method for analyzing electromigration (EM) failure data for both Al- and Cu-based interconnect technologies. The use of gamma distribution has also changed the field operation lifetime estimates that are obtained from reliability extrapolation.

Subjects :: Electrodiffusion -- Analysis
Aluminum compounds -- Electric properties
Aluminum compounds -- Optical properties
Electric resistance -- Analysis
Physics

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