The ultimate dielectric is... nothing: IBM packs wires in vacuum to speed chips and save power

MLA

Adee, Sarah. “The Ultimate Dielectric Is... Nothing: IBM Packs Wires in Vacuum to Speed Chips and Save Power.” IEEE Spectrum, vol. 45, no. 1, Jan. 2008, p. 39. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsggo&AN=edsgcl.175152404&authtype=sso&custid=ns315887.

APA

Adee, S. (2008, January 1). The ultimate dielectric is... nothing: IBM packs wires in vacuum to speed chips and save power. IEEE Spectrum, 45(1), 39.

Chicago

Adee, Sarah. 2008. “The Ultimate Dielectric Is... Nothing: IBM Packs Wires in Vacuum to Speed Chips and Save Power.” IEEE Spectrum, January 1. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsggo&AN=edsgcl.175152404&authtype=sso&custid=ns315887.