Assembly-level reliability: a methodology for effective manufacturing of IC packages

Assembly level reliability (ALR) is a 4-step method which combines various techniques to produce synergistic effects for integrated circuit manufacture. Development of test chip, characterization and authenticity of the chip functionality, decrease in qualification costs with test chips and using effective reliabilty measuring systems are necessary for the progress of ALR. Such rapid testing with knowledge of failure mechanisms provides faster product qualification for a time-to-market advantage.