Evaluation of wafer bonded CMUTs with rectangular membranes featuring high fill factor

Authors :: Wong, Serena H.
Kupnik, Mario
Xuefeng Zhuang
Der-Song Lin
Butts-Pauly, Kim
Khuri-Yakub, Butrus T.
Source :: IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control. Sept, 2008, Vol. 55 Issue 9, p2053, 13 p.
Publication Year :: 2008
Abstract: A study was conducted to evaluate the performance of wafer-bonded, rectangular-shaped capacitive micromachined ultrasonic transducer (CMUT) cells with different fill factors. The data obtained showed the rectangular design to be unsuitable for CW operation in immersion.

Subjects :: Voltage -- Evaluation
Ultrasonic transducers -- Evaluation
Business
Electronics
Electronics and electrical industries

Language :: English
ISSN :: 08853010
Volume :: 55
Issue :: 9
Database :: Gale General OneFile
Journal :: IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control
Publication Type :: Academic Journal
Accession number :: edsgcl.185580827

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