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BGA sockets attack test, solder-ball issues

Authors :
Rogers, Kathy
Source :
Electronic Engineering Times. Jan 6, 1997, Issue n935, pP16, 2 p.
Publication Year :
1997

Abstract

Ball-grid-array sockets, with their low profiles, cost savings and increased circuit density, are forcing their way into the mainstream. But these tiny packages are facing challenges ranging from high-density routing […]

Subjects

Subjects :
Technology overview
Integrated Circuit Fabrication
Surface-mount technology -- Innovations
Electronic components industry -- Innovations
Circuit components -- Innovations

Details

ISSN :
01921541
Issue :
n935
Database :
Gale General OneFile
Journal :
Electronic Engineering Times
Publication Type :
Periodical
Accession number :
edsgcl.19026927

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