Effect of Au thickness on laser beam penetration in semiconductor laser packages

MLA

Cheng, Wood-Hi, et al. “Effect of Au Thickness on Laser Beam Penetration in Semiconductor Laser Packages.” IEEE Transactions on Components, Packaging and Manufacturing Technology Part, vol. 20, no. 4, Nov. 1997, p. 396. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsggo&AN=edsgcl.20391295&authtype=sso&custid=ns315887.

APA

Cheng, W.-H., Wang, S.-C., Yang, Y.-D., Chi, S., Sheen, M.-T., & Kuang, J.-H. (1997). Effect of Au thickness on laser beam penetration in semiconductor laser packages. IEEE Transactions on Components, Packaging and Manufacturing Technology Part, 20(4), 396.

Chicago

Cheng, Wood-Hi, Szu-Chun Wang, Yi-Dian Yang, Sien Chi, Maw-Tyan Sheen, and Jao-Hwa Kuang. 1997. “Effect of Au Thickness on Laser Beam Penetration in Semiconductor Laser Packages.” IEEE Transactions on Components, Packaging and Manufacturing Technology Part 20 (4): 396. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsggo&AN=edsgcl.20391295&authtype=sso&custid=ns315887.