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Electrical modeling and characterization of through silicon via for three-dimensional ICs

Authors :
Katti, G.
Stucchi, M.
De Meyer, K.
Dehaene, W.
Source :
IEEE Transactions on Electron Devices. Jan, 2010, Vol. 57 Issue 1, p256, 7 p.
Publication Year :
2010

Details

Language :
English
ISSN :
00189383
Volume :
57
Issue :
1
Database :
Gale General OneFile
Journal :
IEEE Transactions on Electron Devices
Publication Type :
Academic Journal
Accession number :
edsgcl.216926768