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'BGA Solder Joint Fracture as a Function of Strain Rate and PCB Rigidity': SMTA International Conference on Soldering and Reliability
- Source :
- Printed Circuit Design & Fab Circuits Assembly. July, 2016, Vol. 33 Issue 7, p48, 1 p.
- Publication Year :
- 2016
-
Abstract
- Authors: Amir Nourani, Saeed Akbari and Jan K. Spelt; spelt@mie.utoronto.ca. Abstract: This study investigated the effect of PCB stiffness on the fracture loads of BGA solder joints over a range [...]
Details
- Language :
- English
- ISSN :
- 19395442
- Volume :
- 33
- Issue :
- 7
- Database :
- Gale General OneFile
- Journal :
- Printed Circuit Design & Fab Circuits Assembly
- Publication Type :
- Periodical
- Accession number :
- edsgcl.459722431