Back to Search Start Over

Stress-strain analysis of a taper-taper adhesive-bonded joint under cylindrical bending

Authors :
Helms, Jack E.
Yang, Chihdar
Pang, Su-Seng
Source :
Journal of Engineering Materials and Technology. July, 1999, Vol. 121 Issue 3, p374, 7 p.
Publication Year :
1999

Abstract

First-order laminated plate theory was used to derive a model of a taper-taper adhesive-bonded joint under cylindrical bending. Transverse shear deformation was accounted for by the use of shear correction factors. The COSMOS/M commercial finite element package was used to develop a finite element model to verify the analytical model for a cross-ply laminate. The analytical model results agreed well with the finite element models.

Details

ISSN :
00944289
Volume :
121
Issue :
3
Database :
Gale General OneFile
Journal :
Journal of Engineering Materials and Technology
Publication Type :
Academic Journal
Accession number :
edsgcl.55343789