Roughness evolution of Cu6Sn5 intermetallic during soldering

The evolution of roughness in the Cu6Sn5 intermetallic compound during the soldering reaction of PbSn on Cu and its effects on wettability has been studied. Results indicate that the root mean square roughness and the average distance between asperites have a parabolic dependence on the soldering time. However the ratio of the root mean square roughness with the average distance was observed to increase gradually for the range of soldering periods examined.