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Thermal monitoring and testing of electronic systems

Authors :
Szekely, Vladimir
Rencz, Marta
Pahi, Andras
Courtois, Bernard
Source :
IEEE Transactions on Components and Packaging Technologies. June, 1999, Vol. 22 Issue 2, p231, 7 p.
Publication Year :
1999

Abstract

The authors discuss their method of protecting electronic systems from online overheating, focusing on the use of a thermal sensor and chip to monitor thermal activity. Topics include monitoring temperature changes at the chip and subsystem level, and the need to create excess circuitry to monitor offline thermal testing.

Details

ISSN :
15213331
Volume :
22
Issue :
2
Database :
Gale General OneFile
Journal :
IEEE Transactions on Components and Packaging Technologies
Publication Type :
Periodical
Accession number :
edsgcl.60019686