Back to Search
Start Over
Thermal monitoring and testing of electronic systems
- Source :
- IEEE Transactions on Components and Packaging Technologies. June, 1999, Vol. 22 Issue 2, p231, 7 p.
- Publication Year :
- 1999
-
Abstract
- The authors discuss their method of protecting electronic systems from online overheating, focusing on the use of a thermal sensor and chip to monitor thermal activity. Topics include monitoring temperature changes at the chip and subsystem level, and the need to create excess circuitry to monitor offline thermal testing.
Details
- ISSN :
- 15213331
- Volume :
- 22
- Issue :
- 2
- Database :
- Gale General OneFile
- Journal :
- IEEE Transactions on Components and Packaging Technologies
- Publication Type :
- Periodical
- Accession number :
- edsgcl.60019686