Modeling of thermal stresses in metal interconnects: effects of line aspect ratio

A series of parallel aluminum lines embedded in silicon dioxide are analyzed using finite element analyses. Numerical results for evolution of thermal stresses are given. Maximum stresses in periodically arranged aluminum lines do not show up when the line width and the line height are about equal. This is not found when the single-line approach is used. Variation of stresses with line aspect ratio is affected by spacing of lines.