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SCHMID Group Takes Next Step Towards Advanced Packaging for Integrated Circuits with Glass Cores
- Source :
- GlobeNewswire. May 28, 2024
- Publication Year :
- 2024
-
Abstract
- Highlights: Together with partners, the SCHMID Advanced Integrated Circuit (IC) Packaging Lab Solution is currently the sole supplier for full TGV lab with all process steps necessary to turn a [...]
Details
- Language :
- English
- Database :
- Gale General OneFile
- Journal :
- GlobeNewswire
- Publication Type :
- News
- Accession number :
- edsgcl.795491268