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BEIJING YAN DONG MICROELECTRONIC TECHNOLOGY CO., LTD. invites tenders for Yandong Technology's Procurement of 12 Inch Wafer Packaging Equipment
- Source :
- Pivotal Sources. June 24, 2024
- Publication Year :
- 2024
-
Abstract
- BEIJING YAN DONG MICROELECTRONIC TECHNOLOGY CO., LTD., China has invited tenders for Yandong Technology's Procurement of 12 Inch Wafer Packaging Equipment. Tender Notice No: 1289-244024ZB0872 Deadline: July 12, 2024 Copyright [...]
Details
- Language :
- English
- Database :
- Gale General OneFile
- Journal :
- Pivotal Sources
- Publication Type :
- News
- Accession number :
- edsgcl.798852870