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CEA-Leti's complementary developments in 3D integration technologies

Source :
Dataquest. June 26, 2024
Publication Year :
2024

Abstract

Byline: Pradeep Chakraborty CEA-Leti scientists presented three papers at the IEEE Symposium on VLSI Technology and Circuits detailing the institute's progress on 3D integration technologies, which are a promising approach [...]

Details

Language :
English
Database :
Gale General OneFile
Journal :
Dataquest
Publication Type :
News
Accession number :
edsgcl.799076834