Cite
Some practical concerns on isothermal electromigration tests
MLA
Huang, Jun-Cheng Andy, et al. “Some Practical Concerns on Isothermal Electromigration Tests.” IEEE Transactions on Semiconductor Manufacturing, vol. 14, no. 4, Nov. 2001, p. 387. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsggo&AN=edsgcl.80554462&authtype=sso&custid=ns315887.
APA
Huang, J.-C. A., Chien, W.-T. K., & Huang, C. H.-J. (2001). Some practical concerns on isothermal electromigration tests. IEEE Transactions on Semiconductor Manufacturing, 14(4), 387.
Chicago
Huang, Jun-Cheng Andy, Wei-Ting Kary Chien, and Charles Hung-Jia Huang. 2001. “Some Practical Concerns on Isothermal Electromigration Tests.” IEEE Transactions on Semiconductor Manufacturing 14 (4): 387. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsggo&AN=edsgcl.80554462&authtype=sso&custid=ns315887.