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Chipmaker Faces Fines for China Shipments
- Source :
- The New York Times. November 2, 2024, B4
- Publication Year :
- 2024
-
Abstract
- The Biden administration said it had reached a settlement after the U.S. chipmaker voluntarily disclosed that it had shipped products to a firm linked with China's military industrial complex. The [...]
- Subjects :
- GlobalFoundries Inc. -- International trade -- Investigations
Semiconductor wafers -- International trade
Semiconductor industry -- International trade -- Investigations
Compromise and settlement
General interest
News, opinion and commentary
Semiconductor industry
Company legal issue
International trade
Science and technology policy
Investigations
Trade policy
Subjects
Details
- Language :
- English
- ISSN :
- 03624331
- Database :
- Gale General OneFile
- Journal :
- The New York Times
- Publication Type :
- News
- Accession number :
- edsgcl.814473512