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High-performance inter-PCB connectors: analysis of EMI characteristics
- Source :
- IEEE Transactions on Electromagnetic Compatibility. Feb, 2002, Vol. 44 Issue 1, p165, 10 p.
- Publication Year :
- 2002
-
Abstract
- Electromagnetic interference (EMI) coupling associated with inter-board connection is investigated herein. Two experimental techniques, based on |S.sub.21| measurements, including both common-mode current and near-field measurements, are reported. Both methods, as well as finite difference time domain (FDTD) modeling, were used as experimental and numerical tools for inter-printed-circuit-board (inter-PCB) connector evaluation. The EMI performance of a lab-constructed stacked-card connector, and a commercially available module-on-backplane connector were studied. EMI characteristics of the connectors are demonstrated by investigating a few aspects of the design: type of shield/ground blade for signal return, number and length of ground pins, signal pin designation, etc. Good agreement is achieved between the measurements and the FDTD modeled results. Index Terms--Common-mode current, finite-difference time domain (FDTD), inter-printed-circuit-board (inter-PCB) connector, near field, S parameter.
Details
- ISSN :
- 00189375
- Volume :
- 44
- Issue :
- 1
- Database :
- Gale General OneFile
- Journal :
- IEEE Transactions on Electromagnetic Compatibility
- Publication Type :
- Academic Journal
- Accession number :
- edsgcl.84397755