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2003 high density microelectronics packaging roadmap for space applications
- Publication Year :
- 2002
- Publisher :
- United States: NASA Center for Aerospace Information (CASI), 2002.
-
Abstract
- This roadmap introduces current technologies, related strategic issues, and research reccomendations for space applications.
Details
- Language :
- English
- Database :
- NASA Technical Reports
- Publication Type :
- Report
- Accession number :
- edsnas.20060031002
- Document Type :
- Report