Modular Packaging Approaches. Volume I.

The objective of the study is to investigate the feasibility, practicality, and implementation of standard electronic modules (SEM) for avionics. Tradeoff studies are used to provide quantitative data to assist the Air Force Engineers in selecting the SEM format(s). The broad spectrum of considerations necessary to characterize standard packaging for a wide class of avionics applications are investigated. In depth quantification is placed primarily on digital signal processing and to a lesser degree on analog circuitry. The work is performed in three tasks whereby Task I evaluates current and past industry and DOD module programs, Task II studies present technology and technology trends for determination of the standard avionics module(s), and Task III is a compilation of industry and DOD data concerning standard module information and concepts. The report describes the details of the study with conclusions made and recommendations for future work to be considered.