Development of a Low Loss, High Dielectric Strength Microwave Substrate

This work describes a comparison of two candidate materials for pulse forming line fabrication with respect to bulk dielectric breakdown, frequency response of relative permittivity, and dielectric loss. One material is a commercially available microwave substrate material that can be procured in sheet form without a high voltage specification, while the other is a newly developed material that also comes in sheet form that can also be cast between the electrodes.
See also ADM001963. Presented at the IEEE International Power Modulator Symposium (27th) and High-Voltage Workshop held in Washington, DC on 14-18 May 2006. Published in proceedings of the IEEE International Power Modulator Symposium (27th) and High-Voltage Workshop, p291-294, May 2006. The original document contains color images.