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Fabrication of planarised conductively patterned diamond for bio-applications

Authors :
Tong, W
Fox, K
Ganesan, K
Turnley, AM
Shimoni, O
Tran, PA
Lohrmann, A
McFarlane, T
Ahnood, A
Garrett, DJ
Meffin, H
O'Brien-Simpson, NM
Reynolds, EC
Prawer, S
Tong, W
Fox, K
Ganesan, K
Turnley, AM
Shimoni, O
Tran, PA
Lohrmann, A
McFarlane, T
Ahnood, A
Garrett, DJ
Meffin, H
O'Brien-Simpson, NM
Reynolds, EC
Prawer, S
Publication Year :
2014

Abstract

The development of smooth, featureless surfaces for biomedical microelectronics is a challenging feat. Other than the traditional electronic materials like silicon, few microelectronic circuits can be produced with conductive features without compromising the surface topography and/or biocompatibility. Diamond is fast becoming a highly sought after biomaterial for electrical stimulation, however, its inherent surface roughness introduced by the growth process limits its applications in electronic circuitry. In this study, we introduce a fabrication method for developing conductive features in an insulating diamond substrate whilst maintaining a planar topography. Using a combination of microwave plasma enhanced chemical vapour deposition, inductively coupled plasma reactive ion etching, secondary diamond growth and silicon wet-etching, we have produced a patterned substrate in which the surface roughness at the interface between the conducting and insulating diamond is approximately 3 nm. We also show that the patterned smooth topography is capable of neuronal cell adhesion and growth whilst restricting bacterial adhesion. © 2014 Elsevier B.V.

Details

Database :
OAIster
Publication Type :
Electronic Resource
Accession number :
edsoai.on1197450426
Document Type :
Electronic Resource