CoBRA: Low cost compensation of TSV failures in 3D-NoC

Authors :: Khan, O.
Salamat, R.
Ebrahimi, M.
Bagherzadeh, N.
Verbeek, F.
Khan, O.
Salamat, R.
Ebrahimi, M.
Bagherzadeh, N.
Verbeek, F.
Source :: Khan, O. (ed.), 2016 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT), September 19-20, 2016, University of Connecticut, Storrs, CT USA; 115; 120; 9781509036233; Khan, O. (ed.), 2016 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT), September 19-20, 2016, University of Connecticut, Storrs, CT USA~~115~120~~9781509036233~~~~~
Publication Year :: 2016
Abstract: 2016 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT), September 19-20, 2016, University of Connecticut, Storrs, CT USA<br />Contains fulltext : 161273.pdf (publisher's version ) (Open Access)

Database :: OAIster
Journal :: Khan, O. (ed.), 2016 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT), September 19-20, 2016, University of Connecticut, Storrs, CT USA; 115; 120; 9781509036233; Khan, O. (ed.), 2016 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT), September 19-20, 2016, University of Connecticut, Storrs, CT USA~~115~120~~9781509036233~~~~~
Publication Type :: Electronic Resource
Accession number :: edsoai.on1284150657
Document Type :: Electronic Resource