Numerical investigations for 3D power supply on chip by coupling of thermal-fluid, circuit, and electromagnetic field simulations

3D power supply on chip (3D power SoC), which integrates Si driver, GaN power device and passive devices realizes high efficiency at high frequency switching and high power density. However, miniaturization makes power supply high temperature, and it causes reduction in efficiency and lifetime of power supply. In this paper, we propose the optimum structure for stacking GaN power device and Si based IC circuit to 3D power SoC. We also discuss the optimum assembly technology through thermal-fluid, circuit, and electromagnetic field simulations.
2021 IEEE International 3D Systems Integration Conference (3DIC 2021), November 15-18, 2021 North Carolina, USA