Liquid Metal-Based High-Density Interconnect Technology for Stretchable Printed Circuits

MLA

Wang, Bei, et al. Liquid Metal-Based High-Density Interconnect Technology for Stretchable Printed Circuits. 2024. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsoai&AN=edsoai.on1481650261&authtype=sso&custid=ns315887.

APA

Wang, B., Prasad, S., Hellman, O., Li, H., Fridberger, A., & Hjort, K. (2024). Liquid Metal-Based High-Density Interconnect Technology for Stretchable Printed Circuits.

Chicago

Wang, Bei, Sonal Prasad, Oskar Hellman, Hao Li, Anders Fridberger, and Klas Hjort. 2024. “Liquid Metal-Based High-Density Interconnect Technology for Stretchable Printed Circuits.” http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsoai&AN=edsoai.on1481650261&authtype=sso&custid=ns315887.