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Semiconductor Packaging
- Publication Year :
- 2012
- Publisher :
- Taylor & Francis; CRC Press, 2012.
-
Abstract
- In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
- Subjects :
- Circuits and Devices
Electromagnetics and Microwaves
Electronic Packaging
ENG
MATERIALS
ElectricalEngineering
SCI-TECH
STM
array
ball
compound
frame
grid
lead
level
molding
package
wafer
bic Book Industry Communication::T Technology, engineering, agriculture::TJ Electronics & communications engineering::TJF Electronics engineering
bic Book Industry Communication::T Technology, engineering, agriculture::TJ Electronics & communications engineering::TJF Electronics engineering::TJFC Circuits & components
bic Book Industry Communication::T Technology, engineering, agriculture::TG Mechanical engineering & materials::TGM Materials science
Subjects
Details
- Language :
- English
- ISBN :
- 978-0-429-06335-0
0-429-06335-0 - ISBNs :
- 9780429063350 and 0429063350
- Database :
- OAPEN Library
- Notes :
- ONIX_20200921_9781439862070_22, , https://www.taylorfrancis.com/books/9780429063350
- Publication Type :
- eBook
- Accession number :
- edsoap.20.500.12657.41662
- Document Type :
- book
- Full Text :
- https://doi.org/10.1201/b11260