1. Photosensitive Si3N4 slurry with combined benefits of low viscosity and large cured depth for digital light processing 3D printing.
- Author
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Shen, Minhao, Fu, Renli, Liu, Houbao, Liu, Yunan, Hu, Yunjia, Zhang, Yikun, Liu, Xuhai, Li, Ming, and Zhao, Zhe
- Subjects
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THREE-dimensional printing , *SLURRY , *VISCOSITY , *SILICON nitride , *RHEOLOGY - Abstract
Digital light processing 3D printing can be applied to fabricate complex silicon nitride (Si 3 N 4) components. However, because of the surface hydroxyl groups and large refractive index, it is still a foremost challenge to realize a stable photosensitive Si 3 N 4 slurry with combined benefits of low viscosity and large curing depth. In this study, we propose a new formulation strategy to prepare Si 3 N 4 slurry. Starting from the optimization of monomer ratio, we have systematically optimized powder particle size, dispersant and photoinitiator on the rheological properties and curing properties of Si 3 N 4 slurry. Specifically, we have fabricated a stable photosensitive Si 3 N 4 slurry (48 vol%) with a viscosity of 2.09 Pa s (30 s−1), a critical curing energy of 126.09 mJ/cm2 and a maximum curing depth of 80 µm. Finally, based on this optimized slurry, we have successfully obtained complex Si 3 N 4 green body with no defect, which demonstrates great potential to fabricate arbitrary complex ceramic components for various applications. [ABSTRACT FROM AUTHOR]
- Published
- 2023
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