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Many of today’s stretchable interconnection technologies make extensive use of meandered interconnections, these provide 2-D in-plane springs capable of extending and compressing as the need arises. While a significant quantity of research work exists on these interconnects, few generic methodologies exist to design circuits in a consistent manner. This shortfall leads to questionable design practices, which can negatively affect reliability and performance. Presented within this paper is a method to quickly determine which meander fits within a given area based on common geometric boundary conditions. [ABSTRACT FROM AUTHOR]

This paper presents a novel approach for removing out-of-plane deformation in stretched metal interconnects by adding a fractal structure to the original meander shape and using an optimized fabrication stack. In thermoformed electronics, in cases where copper is used as conductor, the twisting of meander-shaped structures caused by excessive mechanical stress can cause a non-uniform surface, delamination of the metal interconnect from the substrate, and in some cases, a short circuit to the adjacent tracks. Typically, designers of stretchable electronics use various shapes and widths of the copper interconnect to tackle this issue. Using conventional meander shapes such as horseshoes and U-shapes is not universally practical, especially when stretching is higher than 30 percent leading to significant out-of-plane buckling. Limiting this out-of-plane buckling by reducing the track width is not always applicable, as a minimum width is needed from a technology and conductivity perspective. The presented approach is inspired by computational and experimental studies of multiple meander shapes and fabrication methods. A geometry- and fabrication-based approach is presented, reducing the mechanical stress of almost all possible meander shapes by increasing the meander's path length to accommodate the metal track's produced torque during stretching. An analytical approach is provided for calculating the optimal meander parameters and the optimal fabrication stack is achieved based on simulation results. Experiments and finite element modeling for a case study show the improvement in the stress distribution and reduction of out-of-plane buckling. [ABSTRACT FROM AUTHOR]

An impulse-radio ultra-wideband (IR-UWB) cavity-backed slot antenna covering the [5.9803; 6.9989] GHz frequency band of the IEEE 802.15.4a-2011 standard is designed and implemented in an air-filled substrate integrated waveguide (AFSIW) technology for localization applications with an accuracy of at least 3 cm. By relying on both frequency- and time-domain optimization, the antenna achieves excellent IR-UWB characteristics. In free-space conditions, an impedance bandwidth of 1.92 GHz (or 29.4%), a total efficiency higher than 89%, a front-to-back ratio of at least 12.1 dB, and a gain higher than 6.3 dBi are measured in the frequency domain. Furthermore, a system fidelity factor larger than 98% and a relative group delay smaller than 100 ps are measured in the time domain within the 3 dB beamwidth of the antenna. As a result, the measured time-of-arrival of a transmitted Gaussian pulse, for different angles of arrival, exhibits variations smaller than 100 ps, corresponding to a maximum distance estimation error of 3 cm. Additionally, the antenna is validated in a real-life worst-case deployment scenario, showing that its characteristics remain stable in a large variety of deployment scenarios. Finally, the difference in frequency- and time-domain performance is studied between the antenna implemented in AFSIW and in dielectric filled substrate integrated waveguide (DFSIW) technology. We conclude that DFSIW technology is less suitable for the envisaged precision IR-UWB localization application. [ABSTRACT FROM PUBLISHER]

Conventional electronic circuits are made up of electronic components assembled on either rigid substrates like FR4 and ceramic or on flexible substrates based on polymers such as polyimide, PET and PEN foils. The latter type of substrates offers considerable improvements in freedom of motion over its rigid complement although the deformations are still pretty limited due to the inability of common electronic materials, such as metals, to cope with the corresponding deformation. Moreover, the assembly of rigid electronic components can often reduce the circuit’s ability to bend. The current trend towards increased component density on substrates makes the final assembly even less flexible. However, electronic circuits which can fully conform and easily fit in the arbitrary curved surface topologies are of keen interest in various areas of applications. Aside from flexibility, a certain degree of stretching is required for the three-dimensional shaping of electronic systems. Hence, deformability will offer electronics a number of additional features like bendability, conformability shaping and lightweight. Three-dimensional shaped electronics can be obtained either by multi-time (dynamic or elastic) or one time (static, permanent) stretching. In this paper an introduction on deformable and conformable electronics is outlined highlighting the different existing approaches. Some examples of flexible and stretchable electronic applications will be provided in various fields. [ABSTRACT FROM AUTHOR]

The integration of structural electronics in injection-molded parts is a challenging step. The films—comprising of laminated stacks with electronics—are exposed to shear stresses and elevated temperatures by the molten thermoplastic. Hence, molding settings have a significant impact on the successful, damage-free manufacturing of such parts. In this paper, test films with polycarbonate (PC) sheets as outer and two different thermoplastic polyurethanes (TPUs) as middle layers incorporating conductive tracks on a flexible printed circuit board (flexPCB) are manufactured and overmolded with PC. Parameter studies investigating the influence of the melt temperature, mold temperature, injection speed and used TPU layer were performed. The molded parts were inspected visually and compared with a numerical simulation using injection molding software. A shear distortion factor for the TPU layer was derived based on the simulations that linked the shear stresses with the injection time and the softening (melting) of the TPU. The distortion of the films was found to reduce with higher melt temperature, lower mold temperature and faster injection speed. Films using the TPU with the higher melting temperature yielded significantly better results. Moreover, distortion on the films reduced with the increasing distance to the gate and a larger cavity thickness was found to be beneficial. All those relations could be correlated with the shear distortion factor. [ABSTRACT FROM AUTHOR]

Electrical stimulation of gametes and embryos and on-chip manipulation of microdroplets of culture medium serve as promising tools for assisted reproductive technologies (ARTs). Thus far, dielectrophoresis (DEP), electrorotation (ER) and electrowetting on dielectric (EWOD) proved compatible with most laboratory procedures offered by ARTs. Positioning, entrapment and selection of reproductive cells can be achieved with DEP and ER, while EWOD provides the dynamic microenvironment of a developing embryo to better mimic the functions of the oviduct. Furthermore, these techniques are applicable for the assessment of the developmental competence of a mammalian embryo in vitro. Such research paves the way towards the amelioration and full automation of the assisted reproduction methods. This article aims to provide a summary on the recent developments regarding electrically stimulated lab-on-chip devices and their application for the manipulation of gametes and embryos in vitro. [ABSTRACT FROM AUTHOR]

Microvalves are commonly used in microfluidic systems to control precisely the liquid flow. In this paper, the design and fabrication of a normally-closed (NC) all-polymer membrane-type microvalve is described. The microvalve with a diameter and thickness of 5 mm and 3 mm, respectively, is fabricated completely in biocompatible polydimethylsiloxane (PDMS). The opening pressure, which depends on the adhesion between the membrane and the slab, is reduced to the noticeably low value of 3.4 kPa by the surface oxidation of the PDMS layers. This technique in combination with a selective bonding by Polyethylene terephthalate (PET) shadow masking allows for the fabrication of a high reverse pressure microvalve (no flow up to 0.6 MPa reverse pressure). Other major fabrication steps include PDMS doctor-blading and soft lithography in order to fabricate the thin and surface patterned membranes, respectively. The presented microvalve features a minimum flow rate of 1.0 ml~min^-1. \hfill[2012\-0087] [ABSTRACT FROM PUBLISHER]

The development and mechanical characterization of a novel technology for stretchable electronics is presented, which can be used for the realization of wearable textile electronics and biomedical implants. The stretchable devices consist of rigid or flexible component islands interconnected with stretchable meander-shaped copper conductors embedded in a stretchable polymer, polydemethylsiloxane. The technology uses standard printed circuit board manufacturing steps and liquid injection molding techniques to achieve a robust and reliable product. The conductors in the device are designed to accommodate strains up to 10–15%. Spin-on photo-definable polyimide as mechanical support for the stretchable interconnects and the functional flexible islands are introduced. By use of polyimide, the reliability of the stretchable interconnects, the straight interconnects on the flexible islands and the transitions between the stretchable and nonstretchable parts are improved. Long-term endurance behavior of the stretchable interconnects is studied by cyclic elongation at strain ranges of up to 20% while monitoring the electrical connectivity. It's shown that the lifetime of the polyimide supported interconnects is at least two times better compared to the nonsupported. [ABSTRACT FROM AUTHOR]

Flexible materials, today, are being used already as base substrates for electronic assembly. A lot of mounted components could be integrated in flexible polyimide (PI) substrates. Very interesting advantages of integrating components into the flex are compactness and enhanced flexibility; not only the interconnection but also the components themselves can be mechanically flexible. This paper describes a PI-based embedding technology for integrating very thin silicon chips in between two spin-on PI layers, the ultra-thin chip package (UTCP). This paper discusses the different process steps in the UTCP production and also presents the interconnection test results realized with this technology. [ABSTRACT FROM AUTHOR]

Electronic textiles (e-textiles) and wearable computing have been emerging increasingly during the last decade. Since the market interest and predictions have grown, the research into increasing reliability and durability of wearables and e-textiles is developing rapidly. The washability of different integration methods and resistance to mechanical stress are the main obstacles being tackled. However, the freedom of movement and overall comfort is still often overlooked during the development phase. It is essential to see the e-textile product as a whole and consider several aspects of user experience. This work will focus on developing and improving the thermoplastic polyurethane (TPU) lamination integration method for e-textiles. In the work, a stretchable copper-polyimide based circuit was laminated onto knit fabric using various TPU films and stacks. The study shares measurable characteristics to determine which material assembly and design would ensure the highest durability for the electronics part without losing its original textile softness, flexibility and stretchability. [ABSTRACT FROM AUTHOR]

The increasing number of biomedical applications for electronic systems have led to the need for stretchable electronics in order to significantly enhance the comfort of the user. This paper describes the design and manufacturing process of new stretchable high-frequency interconnects with meander-shaped conductors in a coplanar waveguide topology. The novel interconnects are produced based on laser-ablation of a copper foil, which is then embedded in a highly stretchable bio-compatible silicone material. Measurements on prototypes of the designed stretchable high-frequency interconnects revealed a maximal magnitude of -14 dB for the reflection coefficient and a minimal magnitude of -4 dB for the transmission coefficient in the frequency band up to 3 GHz. The influence of stretch on the performance of the high-frequency interconnects was analyzed using a stretch testing machine. The results showed that nor the magnitude, neither the phase of the transmission coefficient was influenced by elongations up to 20%. [ABSTRACT FROM AUTHOR]

In general this reduction of the cell gap improves the electro-optic properties of a polymer dispersed liquid crystal (PDLC) in reflective microdisplays. At the interface between the PDLC film and the silicon backplane or cover glass, the LC molecules have a different alignment from those in the droplets in the interior of the PDLC film. This is shown by microscopic observations and the temperature dependency of the brightness and capacitance of the displays. The influence of this alignment effect increases for smaller cell gaps and has an impact on the properties of the PDLC. During and after the filling of the displays, a compression and expansion of the cell gap takes place, respectively. If the curing of the PDLC takes place before the expansion of the cell gap has stopped, transparent areas in the PDLC film may occur some time after curing. This effect is caused by the expansion of the cell gap after curing resulting in the vertical alignment of LC molecules. This can be concluded from microscopic observations and from measurements of the refractive index and cell gap. [ABSTRACT FROM AUTHOR]

Flexible dielectric sensors received significant interest for real-time in situ cure monitoring of polymeric composites over the past decade. Currently, the state-of-the-art dielectric sensors mainly focus on detecting the distinct stages of the polymeric composite curing process. While low-cost and quantitative monitoring of the thermal, mechanical, and chemical properties of the materials during the cure is of great interest, to date, such a sensor system has not been realized because the existing devices excessively depend on external instrumentations, combined with a lack of an embedded reliable data processing module. Here, a fully integrated dielectric monitoring sensor system (DMS) incorporating dielectric and temperature sensors is developed, capable of monitoring in real-time the temperature, the degree of cure, and the glass transition temperature ($T_{g}$) of polymeric composites. An independent characterization of the cure kinetics was performed using differential scanning calorimetry and Raman spectroscopy. These data enabled associating the main physical and chemical transformations in the polymeric materials with particular features observed in the dielectric measurements. We demonstrate the accurate estimation of the degree of cure and $T_{g}$ of an epoxy resin. The proposed system shows the potential for a new generation of intelligent manufacturing technology of composite materials. [ABSTRACT FROM AUTHOR]

Objectives: In this paper, the effect of the position of the inlet and outlet microchannels on the flow profile and the geometry of the recognition chamber for sample pre-treatment in an electrochemical biosensor to be used in osteoporosis management were investigated. Methods: All numerical computation presented in this work were performed using COMSOL Multiphysics and Fluent. Simulation was performed for a three-dimensional, incompressible Navier–Stokes flow and so explicit biphasic volume of fluid (VOF) equations were used. Results: In the designed microfluidic system, a pressure-driven laminar flow with no-slip boundary condition was responsible for fluid actuation through microchannels in a reproducible approach. Based on the simulation results, the number of outlets was increased and the angel through which the inlets and outlets were attached to the microchamber was changed so that the dead volume would be eliminated and the fluid flow trajectory, the velocity field and pressure were evenly distributed across the chamber. The Re number in the inlets was equal to 4.41, suggesting a laminar flow at this site. Conclusion: The simulation results along with the fact that the design change was tested using laser ablated tape and a color dye at different steps provided the researchers with the opportunity to study the changes in a fast and accurate but cheap method. The absence of backflow helps with the cross-talk concern in the channels and the lack of bubbles and complete coverage of the chamber helps with a better surface modification and thus better sensing performance. [ABSTRACT FROM AUTHOR]

The primary bottleneck of the stretchable mold interconnect (SMI) technology is its reliance on carrier boards. These are necessary to handle the meandered circuit during production and to ensure dimensional stability of the flexible circuit board before encapsulation. However, for all the problems it solves, it also introduces a new major problem by requiring a peeling step—which is difficult to automate. This paper aims to present some of the work that went into eliminating this problem, discussing both unsuccessful and functioning methods to tackle this conundrum and some of the experimental work that went into verifying these techniques. First, alterations to the design to simplify peeling are considered, followed by adhesive-based peeling processes and mechanical pin-based systems. Next, masking and structuring of the carrier board adhesive are considered. Finally, two carrierless methods that circumvent the problems are discussed, a two-step process—which cuts temporary support structures after partial encapsulation—and a technique whereby the frame is designed to fail in a controlled manner during the first use of the circuit, creating a carrierless process feasible for high-volume production. [ABSTRACT FROM AUTHOR]

Drug development is currently hampered by the inability of animal experiments to accurately predict human response. While emerging organ on chip technology offers to reduce risk using microfluidic models of human tissues, the technology still mostly relies on end-point assays and biomarker measurements to assess tissue damage resulting in limited mechanistic information and difficulties to detect adverse effects occurring below the threshold of cellular damage. Here we present a sensor-integrated liver on chip array in which oxygen is monitored using two-frequency phase modulation of tissue-embedded microprobes, while glucose, lactate and temperature are measured in real time using microfluidic electrochemical sensors. Our microphysiological platform permits the calculation of dynamic changes in metabolic fluxes around central carbon metabolism, producing a unique metabolic fingerprint of the liver's response to stimuli. Using our platform, we studied the dynamics of human liver response to the epilepsy drug Valproate (Depakine™) and the antiretroviral medication Stavudine (Zerit™). Using E6/E7LOW hepatocytes, we show TC50 of 2.5 and 0.8 mM, respectively, coupled with a significant induction of steatosis in 2D and 3D cultures. Time to onset analysis showed slow progressive damage starting only 15–20 hours post-exposure. However, flux analysis showed a rapid disruption of metabolic homeostasis occurring below the threshold of cellular damage. While Valproate exposure led to a sustained 15% increase in lipogenesis followed by mitochondrial stress, Stavudine exposure showed only a transient increase in lipogenesis suggesting disruption of β-oxidation. Our data demonstrates the importance of tracking metabolic stress as a predictor of clinical outcome. [ABSTRACT FROM AUTHOR]

Sensor systems capable of in situ , continuous impedance measurements are expected to play an important role for a broad spectrum of applications. However, widespread use of these devices is hindered by their current form of separated sensors from bulky, expensive readout instruments. Moreover, the lack of other relevant sensing functionalities on the same system results in an incomplete understanding of the complex physical and chemical changes taking place. In this paper, a miniaturized sensor patch (MSP) with simultaneous impedance and temperature measurements and fully integrated readout is cleverly designed. By using an on-board microcontroller, sensor signal is read out locally and transmitted digitally, eliminating the noise on the signal over the transmission path. The MSP is stable over a wide temperature range (20–180 °C), and in various dielectric mediums (air, epoxies). Moreover, flexible circuit board technology based device fabrication permits further extended functionalities of the patch with off-the-shelf surface mounted devices. The MSPs were successfully applied for monitoring the polymerization processes of two epoxies, demonstrated the potential of the proposed sensor patch as an integrated and multifunctional sensing solution. [ABSTRACT FROM AUTHOR]

Metal-elastomer interfacial systems, often encountered in stretchable electronics, demonstrate remarkably high interface fracture toughness values. Evidently, a large gap exists between the rather small adhesion energy levels at the microscopic scale (‘intrinsic adhesion’) and the large measured macroscopic work-of-separation. This energy gap is closed here by unravelling the underlying dissipative mechanisms through a systematic numerical/experimental multi-scale approach. This self-containing contribution collects and reviews previously published results and addresses the remaining open questions by providing new and independent results obtained from an alternative experimental set-up. In particular, the experimental studies on Cu-PDMS (Poly(dimethylsiloxane)) samples conclusively reveal the essential role of fibrillation mechanisms at the micro-meter scale during the metal-elastomer delamination process. The micro-scale numerical analyses on single and multiple fibrils show that the dynamic release of the stored elastic energy by multiple fibril fracture, including the interaction with the adjacent deforming bulk PDMS and its highly nonlinear behaviour, provide a mechanistic understanding of the highwork-of-separation. An experimentally validated quantitative relation between the macroscopic work-of-separation and peel front height is established from the simulation results. Finally, it is shown that a micro-mechanically motivated shape of the traction-separation law in cohesive zone models is essential to describe the delamination process in fibrillating metal-elastomer systems in a physically meaningful way. [ABSTRACT FROM AUTHOR]

A novel manufacturing procedure for the fabrication of ultra-wideband cavity-backed substrate integrated waveguide antennas on textile substrates is proposed. The antenna cavity is constructed using a single laser-cut electrotextile patch, which is folded around the substrate. Electrotextile slabs protruding from the laser-cut patch are then vertically folded and glued to form the antenna cavity instead of rigid metal tubelets to implement the vertical cavity walls. This approach drastically improves mechanical flexibility, decreases the antenna weight to slightly more than 1 g and significantly reduces alignment errors. As a proof of concept, a cavity-backed substrate integrated waveguide antenna is designed and realized for ultra-wideband operation in the [5.15–5.85] GHz band. Antenna performance is validated in free space as well as in two on body measurement scenarios. Furthermore, the antenna’s figures of merit are characterized when the prototype is bent at different curvature radii, as commonly encountered during deployment on the human body. Also the effect of humidity content on antenna performance is studied. In all scenarios, the realized antenna covers the entire operating frequency band, meanwhile retaining a stable radiation pattern with a broadside gain above 5 dBi, and a radiation efficiency of at least 70%. [ABSTRACT FROM AUTHOR]

This article explains a step-wise protocol to develop an electrochemical sensor to quantify serum levels of C-telopeptide (CTX) crosslinks also known as crosslaps in a matter of minutes and with high level of accuracy. The technique needs only one-step (incubation) and can thus be used for point of care screening. Due to the excellent electrical properties of the as-prepared immunosensor, CTX levels were successfully measured from 1 to 1000 pg/mL. This is while the normal reference of the marker is 50-450 pg/mL, suggesting that the sensor can acceptably detect CTX. The results also showed a good correlation with ECLIA in measuring serum levels of CTX. [ABSTRACT FROM AUTHOR]

ABSTRACT Interdigital sensors (IDS) have received great attention for production monitoring of polymers over the past decade. However, conventional IDS are limited by high noise to environment due to the dual side access of the sensor, low nominal capacitance, and sensitivity. In this study, a shielded IDS fabricated by flexible circuit board (FCB) technology is presented to overcome these challenges. Compared to conventional sensors, the environmental dependence of the new sensor is minimized by the copper shield. Furthermore, nominal capacitance of at least 350% higher, and an increase of sensitivity per unit area are achieved. To demonstrate the capabilities of the new IDS, a FCB comprising the proposed sensor is fabricated, attached to a mould, and successfully applied for in situ real-time production monitoring of an epoxy resin. The resulting flexible sensor is noninvasive towards the fabricated parts, and measures the key stages along the production process. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2016, 54, 2028-2037 [ABSTRACT FROM AUTHOR]

A novel wearable radio frequency identification (RFID) tag with sensing, processing, and decision-taking capability is presented for operation in the 2.45-GHz RFID superhigh frequency (SHF) band. The tag is powered by an integrated light harvester, with a flexible battery serving as an energy buffer. The proposed active tag features excellent wearability, very high read range, enhanced functionality, flexible interfacing with diverse low-power sensors, and extended system autonomy through an innovative holistic microwave system design paradigm that takes antenna design into consideration from the very early stages. Specifically, a dedicated textile shorted circular patch antenna with monopolar radiation pattern is designed and optimized for highly efficient and stable operation within the frequency band of operation. In this process, the textile antenna’s functionality is augmented by reusing its surface as an integration platform for light-energy-harvesting, sensing, processing, and transceiver hardware, without sacrificing antenna performance or the wearer’s comfort. The RFID tag is validated by measuring its stand-alone and on-body characteristics in free-space conditions. Moreover, measurements in a real-world scenario demonstrate an indoor read range up to 23 m in nonline-of-sight indoor propagation conditions, enabling interrogation by a reader situated in another room. In addition, the RFID platform only consumes 168.3 \mu \textW , when sensing and processing are performed every 60 s. [ABSTRACT FROM PUBLISHER]

This research presents a case study of production monitoring on an aerospace composite component: the hinge arm of the droop nose mechanism on the Airbus A380 wing leading edge. A sensor network composed of Fibre Bragg Gratings, capacitive sensors for cure monitoring and thermocouples was embedded in its fibre reinforced lay-up and measurements were acquired throughout its Resin Transfer Moulding production process. Two main challenges had to be overcome: first, the integration of the sensor lines in the existing Resin Transfer Moulding mould without modifying it; second, the demoulding of the component without damaging the sensor lines. The proposed embedding solution has proved successful. The wavelength shifts of the Fibre Bragg Gratings were observed from the initial production stages, over the resin injection, the complete curing of the resin and the cooling-down prior to demoulding. The sensors proved to be sensitive to detecting the resin flow front, vacuum and pressure increase into the mould and the temperature increase caused by the resin curing. Measurements were also acquired during the post-curing cycle. Residual strains during all steps of the process were derived from the sensors' wavelength shift, showing values up to 0.2% in compression. Moreover, the capacitive sensors were able to follow-up the curing degree during the production process. The sensors proved able to detect the resin flow front, whereas thermocouples could not measure an appreciable increase of temperature due to the fact that the resin had the same temperature as the mould. [ABSTRACT FROM AUTHOR]

Dielectric analysis has attracted great attention in recent years for the monitoring of composite production processes because of its capability to be applied in situ and in real-time. However, to progress from lab to industry level, the sensor system should be as sensitive and reliable as possible, whereas its fabrication should be simple and cost effective. In this study, a dielectric sensor system based on interdigital electrodes was developed. The system was fabricated by flexible circuit board technology, which combines low cost per unit area and high extendibility with off-the-shelf electronic components. The sensor’s geometry was optimized through analytical expressions and finite element method to maximize its sensitivity. Four-wire interconnects were simultaneously fabricated with the sensor to minimize the measurement error. A system with a signal-to-noise ratio better than 55 dB was successfully applied to monitor the production of glass fibre reinforced composites fabricated by vacuum assisted resin infusion process. The obtained data clearly shows the different key stages along the production process, proving the potential of the system. [ABSTRACT FROM AUTHOR]

A high-performance, three-element substrate-integrated-waveguide (SIW) cavity-backed slot antenna array that covers the (5.15–5.85) GHz band is designed for integration inside or underneath the worktop of a desk, to set up a stable, high data-rate ultra-short-range $3 \times 3$ multiple-input multiple-output (MIMO) wireless communication link with a mobile user (MU) positioned on top of that worktop. The antenna topology and array geometry are carefully selected to maximally exploit the multiplexing capabilities of the ultra-short-range $3 \times 3$ MIMO channel over a wide bandwidth, yielding an increased channel capacity and/or reduced power consumption. In addition, special care was taken to guarantee a channel capacity that is less dependent on the relative orientation of the MU. Furthermore, the SIW implementation technology is combined with innovative antenna materials to guarantee a low-profile, low-cost, stable, and high-performance broadband array design that maintains its excellent performance after integration. A prototype of the antenna array was fabricated, integrated according to two different integration scenarios, and validated. Measurements prove that the antenna array allows integration into a worktop with only a minor influence on its return loss and mutual coupling, guaranteeing a bandwidth of at least 1.078 GHz and a minimum isolation between antenna elements of 30 dB within the entire (5.15–5.85) GHz band. [ABSTRACT FROM PUBLISHER]

Microfluidic organ-on-a-chip technology aims to replace animal toxicity testing, but thus far has demonstrated few advantages over traditional methods. Mitochondrial dysfunction plays a critical role in the development of chemical and pharmaceutical toxicity, as well as pluripotency and disease processes. However, current methods to evaluate mitochondrial activity still rely on end-point assays, resulting in limited kinetic and prognostic information. Here, we present a liver-on-chip device capable of maintaining human tissue for over a month in vitro under physiological conditions. Mitochondrial respiration was monitored in real time using two-frequency phase modulation of tissue-embedded phosphorescent microprobes. A computer-controlled microfluidic switchboard allowed contiguous electrochemical measurements of glucose and lactate, providing real-time analysis of minute shifts from oxidative phosphorylation to anaerobic glycolysis, an early indication of mitochondrial stress. We quantify the dynamics of cellular adaptation to mitochondrial damage and the resulting redistribution of ATP production during rotenone-induced mitochondrial dysfunction and troglitazone (Rezulin)-induced mitochondrial stress.We show troglitazone shifts metabolic fluxes at concentrations previously regarded as safe, suggesting a mechanism for its observed idiosyncratic effect. Our microfluidic platform reveals the dynamics and strategies of cellular adaptation to mitochondrial damage, a unique advantage of organ-on-chip technology. [ABSTRACT FROM AUTHOR]

In this paper, we present the developments of a new technology to realize 2.5-/3-D electronic circuits. The starting point is an electronic circuit embedded in a hard thermoplastic material, which is transformed into a 2.5-/3-D shape using a thermoforming process. The electronic circuit consists of stretchable copper interconnections in combination with electronic components. The circuit is produced using conventional printed circuit board process steps: a copper sheet is laminated on a thermoplastic material, such as Polycarbonate (PC) or Polyethylene Terephthalate Glycol (PET-G). The copper is structured using lithography and wet etching, and the electronic components are assembled using conductive adhesives. We investigated the use of different designs for stretchable interconnects to overcome the stretching of the electronic circuit by thermoforming it. A semispherical-shaped mold was used for this purpose where the local strain of the substrate can reach 100% with a sharp bending. It was shown that meander-shaped interconnects could accommodate the gradual deformation during the forming of the substrate either for PC and PET-G. However, at the mold’s edge, the copper-meandered tracks showed a delamination of the copper from the substrate. In the meanwhile, the electrical conductivity of the copper tracks did not show any significant variation. Another meander design based on an elliptical shape (in order to increase the length of the track) is proposed and compared with the first design. [ABSTRACT FROM PUBLISHER]

For future construction of implantable tissue structures, the development of 3-dimensional fluidic microsystems is necessary. In the current work we have developed a unique technology for 3-dimensional microfluidic environments with potential for tissue engineering applications. The microfluidic devices were fabricated out of biodegradable and biocompatible elastomers, such as poly (glycerol-sebacate) and poly (erythritol-sebacate), due to their transparency and thermoset properties suitable for microfabrication technologies. The three-dimensionality of the microfluidic bioreactors was imparted by a porous poly L-lactic acid membrane prepared via electrospinning. Thus obtained membrane has a high surface area-to-volume ratio and is intended to mimic the extracellular matrix that provides physical support and spatial organization. The membrane was cut and placed in between two micro-patterned microfluidic layers during the alignment process, and subsequently bonded to achieve the final bioreactor. The patency of the device network was evaluated and the bond between the microfluidic layers was sufficiently strong to allow perfusion flow rates in the range 0.1-300 μl/min. The herein developed technology comes as solution to the two-dimensionality issue that exists in most microfluidic devices and can relate to a variety of tissue engineering applications. [ABSTRACT FROM AUTHOR]

Measuring the quality of human health and well-being is one of the key growth areas in our society. Preferably, these measurements are done as unobtrusive as possible. These sensoric devices are then to be integrated directly on the human body as a patch or integrated into garments. This requires the devices to be very thin, flexible and sometimes even stretchable. An overview of recent technology developments in this domain and concrete application examples will be discussed. [ABSTRACT FROM AUTHOR]

In this paper the influence of the epoxy roughness, surface modifications and ELD (electroless copper deposition) temperatures on the adhesive strength of the copper is studied. Good adhesion at low roughness values is targeted due to their applicability in high density electronic circuits. Roughened epoxy surfaces are modified with adsorbed polyamines, polydopamine and polyamines grafted to polydopamine. Next the, adhesive strength of ELD copper is determined with peel strength measurements and the interphases are examined with SEM (scanning electron microscopy). Polydopamine and polyamines grafted to polydopamine can lead to increased adhesive strength at lower roughness values compared to the non-modified samples at specific plating temperatures. [ABSTRACT FROM AUTHOR]

Highlights: [•] The surface of an epoxy resin is modified via adsorbed polyamines, polydopamine and polyamines grafted on polydopamine. [•] Introduction of polyamines leads to an increase of Pd(0) species on the surface after catalytic activation. [•] Grafted polyamines on polydopamine result in a higher initial electroless copper deposition. [Copyright &y& Elsevier]

Highlights: [•] The surface of an epoxy resin is modified with polydopamine and subsequent polyamine grafting. [•] The grafted polyamines reveal a high stability toward HCl. [•] Cluster like deposits are present on the surface after polydopamine modification. [•] XPS analysis and TOF-S-SIMS analysis of the modifications are provided. [ABSTRACT FROM AUTHOR]

Getting output of multiple chips within the volume of a single chip is the driving force behind development of this novel 3D integration technology, which has a broad range of industrial and medical electronic applications. This goal is achieved in a two-step approach. Initially, thinned dies are embedded in a polyimide interposer with a fine-pitch metal fanout, resulting in ultrathin chip packages (UTCPs). Next these UTCPs are stacked by lamination. Step height at the chip edge of these UTCPs is the major reason of die cracking during the lamination. This paper contains an approach to solve this issue by the introduction of an additional layer of interposer, which makes it flat at the chip edge and thus the whole package is named as flat-UTCP. In addition to that, randomness in nonfunctional package positions per panel reduces the overall yield of the whole process up to a certain extent. A detailed analysis on these two issues to improve the process yield is presented in this paper. 3D-stacked memory module composed of four electrically erasable programmable read-only memory dies was processed and tested to demonstrate this new concept for enhancing the fabrication yield. [ABSTRACT FROM PUBLISHER]

Purpose -- Ultra-thin chip packaging (UTCP) is one of the flexible assembly technologies, by which thinned dies are encapsulated inside spin-coated dielectric films. For sake of higher density integration and bending stress suppression, two UTCPs can be stacked vertically. The purpose of this paper is to present an improved UTCP process flow to embed thinned chip in a symmetric dielectric sandwich for a flat topography. The UTCP flat top surface is suitable for metallization and further 3D stacking. Design/methodology/approach -- In the new process, a central photosensitive polyimide film is introduced, in which a cavity is made for the embedded chip. The cavity is defined by lithography using the chip itself as a photo-mask. In this way, the cavity size and position is self-aligned to the chip. The chip thickness is compensated by the surrounding central layer, and a UTCP with flat topography (flat UTCP) is realized after top dielectric deposition. Findings -- A batch of daisy chain test vehicles was produced. The feasibility of the process flow is verified by optical and electrical measurements. The result shows 100 percent yield, which is much better than previous work. A thermal humidity test showed no significant degradation of the flat UTCPs after 1,000 hours. Originality/value -- High yield fabrication of flat UTCP is first shown. An innovative self-alignment lithography step is introduced to make a cavity in dielectric for chip thickness compensation by using the chip itself as a photo-mask. [ABSTRACT FROM AUTHOR]

In order to increase the functionality of electronic devices, while reducing the overall size and weight of the electronic chip packages, electronic chip packages can be combined into a 3-D assembly. In this field, we present a technology for stacking multiple chip packages, resulting in total volume almost equal to that of a single bare die. The technology is based on batch-processed ultrathin chip packages (UTCPs) with a fine pitch metal fan-out. Package-on-package technology enables stacking of UTCPs by vacuum lamination, followed by through-hole interconnection technology for making contacts to the metal fan-out of the embedded UTCPs within the stack. The individual chip packages can be tested before stacking. [ABSTRACT FROM AUTHOR]

To study the rhythmical and social synchronization, also known as entrainment, that occurs when people move to music in a social context, novel applications that motivate and measure this behaviour are needed. In this paper, we describe the development of such an application, BeatLED, a social game that uses music, movement and luminescent textile. We analyse the requirements of such a musical social game, as well as the possible application fields, such as musicology research, team-building and health care. We developed novel game dynamics and integrated them into a proof-of-concept implementation, which was evaluated positively by 84% of the test users. [ABSTRACT FROM PUBLISHER]

Abstract: Tactile sensors are often used on irregular or moving surfaces, for example as artificial skin on a robotic hand or inside a prosthetic socket. In addition to tactile sensors able to detect pressure, there is also a need to detect shear stress, associated with slippage or friction. Therefore, this paper demonstrates a technology for fabricating unobtrusive flexible tactile shear sensors using a thin and mechanically strong polyimide substrate. The operation of the sensor is based on the changing optical coupling between a Vertical-Cavity Surface-Emitting Laser (VCSEL) and photodiode. Since this sensor is based on an optical principle, it is less susceptible to environmental influences and electromagnetic interference (EMI). Furthermore, a new design of this sensor was developed and tested to enable the detection of both shear force magnitude and direction (two axis sensor). [Copyright &y& Elsevier]

The article presents research on n-type metal oxide thin-film transistors (TFTs) in flexible active-matrix organic light-emitting diode (AMOLED) displays. It discusses the performance of solution-based oxide n-type TFTs on low-voltage complementary circuitry on flexible polyimide foil. It explores the significance of the hybrid complementary technology on AMOLED displays.

Assembly of thinned die has become common practice to meet the demand for smaller and lighter electronic products. One way to achieve this goal is to embed the thinned die into two dielectric films, which results in a flexible ultrathin chip package (UTCP). This paper describes a new UTCP process flow with microvia formation by standard UV lithography through photosensitive polyimide (PSPI). Such microvia-formation method proved to be more reliable than laser drilling techniques and simpler than a dry etching process. Since the used PSPI is self-priming, a thin layer of potassium chloride was introduced as a release layer. In the end, the polyimide encapsulation of the thinned die can be released from the carrier substrate and becomes a flexible chip package with a total thickness of around 50 \mum. Daisy-chain test dies were encapsulated inside spin-coated polyimide films. Excellent chip-to-package interconnection was demonstrated by electrical daisy chain and contact resistance measurements. Bending tests and thermal cycling tests were also performed on the daisy-chain test vehicles. Desired flexibility and reliability of UTCPs was observed. [ABSTRACT FROM PUBLISHER]

We present a flexible folded slot dipole implantable antenna operating in the Industrial, Scientific, and Medical (ISM) band (2.4–2.4835 GHz) for biomedical applications. To make the designed antenna suitable for implantation, it is embedded in biocompatible Polydimethylsiloxane (PDMS). The antenna was tested by immersing it in a phantom liquid, imitating the electrical properties of the human muscle tissue. A study of the sensitivity of the antenna performance as a function of the dielectric parameters of the environment in which it is immersed was performed. Simulations and measurements in planar and bent state demonstrate that the antenna covers the complete ISM band. In addition, Specific Absorption Rate (SAR) measurements indicate that the antenna meets the required safety regulations. [ABSTRACT FROM AUTHOR]

This paper proposes a novel concept for integrating ultrathin solar cells into modules. It is conceived as a method for fabricating solar panels starting from back-contact crystalline silicon solar cells. However, compared to the current state of the art in module manufacturing for back-contact solar cells, this novel concept aims at improvements in performance, reliability, and cost through the use of an alternative encapsulant, namely silicones as opposed to ethylene vinyl acetate, an alternative deposition technology, being wet coating as opposed to dry lamination; and alternative module-level metallization techniques, as opposed to cell-level tabbing-stringing or conductive foil interconnects. The process flow is proposed, and the materials and fabrication technologies are discussed. As the durability of the module, translated into the module's lifetime, is very important in the targeted application, namely solar cell modules, modeling and reliability testing results and considerations are presented to illustrate how the experimental development process may be guided by experience and theoretical derivations. Finally, feasibility is demonstrated in some first proofs of the concept, and an outlook is given pointing out the direction for further research. [ABSTRACT FROM PUBLISHER]

This paper discusses the optimization of a stretchable electrical interconnection between integrated circuits in terms of stretchability and fatigue lifetime. The interconnection is based on Cu stripes embedded in a polyimide-enhanced (PI-enhanced) layer. Design-of-experiment (DOE) methods and finite-element modeling were used to obtain an optimal design and to define design guidelines, concerning both stripe and layer dimensions and material selection. Stretchable interconnects with a PI-enhanced layer were fabricated based on the optimized design parameters and tested. In situ experimental observations did validate the optimal design. Statistical analysis indicated that the PI width plays the most important role among the different design parameters. By increasing the PI width, the plastic strain in the Cu stripes is reduced, and thus, the stretchability and fatigue lifetime of the system is increased. The experimental results demonstrate that the PI-enhanced stretchable interconnect enables elongations up to 250% without Cu rupture. This maximum elongation is two times larger than the one in samples without PI enhancement refid="ref1"/ . Moreover, the fatigue life at 30% elongation is 470 times higher refid="ref2" . [ABSTRACT FROM PUBLISHER]

Abstract: This paper presents a summary of the modeling and technology developments for flexible and stretchable electronics. These technologies can achieve mechanically bendable and stretchable subsystems by incorporating the electronic circuit into a matrix made of a soft polymer. The base substrate used for the fabrication of flexible circuits is a uniform polyimide layer, while silicones or polyurethanes materials are preferred for the stretchable circuits. The method developed for chip embedding and interconnections is named Ultra Thin Chip Package (UTCP). Extensions of this technology can be achieved by stacking and embedding thin dies in polyimide, providing large benefits in electrical performance and still allowing some mechanical flexibility. These flexible circuits can be converted into stretchable circuits by replacing the polyimide by a soft and elastic silicone material. The integration of ultra thin dies at package level, with thickness in the range of 10–30μm, into flexible and/or stretchable materials are demonstrated. Furthermore, the design and reliability test of stretchable metal interconnections at board level are analyzed by both experiments and finite element modeling. We have shown through finite element modeling and experimental validation that an appropriate thermo-mechanical design is necessary to achieve mechanically reliable circuits and thermally optimized packages. [Copyright &y& Elsevier]

Abstract: In this paper, the effect of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects is presented. Extensive numerical modeling is conducted for mechanical analysis of which the results are correlated with in-situ experimental observations. The numerical results reveal that by adding an encapsulation layer of various thickness (from 0.0 to 0.5mm) on top of the stretchable interconnect, the out-of-plane deformation and in-plane geometrical opening are reduced. Consequently, not only the plastic strain in the metal increases but also the in-plane shear stress at the interconnect/substrate interface. In-situ electromechanical experiments combined with scanning electron micrographs and optical images confirm the numerical analysis. More specifically, it is found that two failure mechanisms are involved during the stretching process: interfacial delamination in a S-shape alongside the metal conductor and metal breakdown at the crests of the metal conductor. The encapsulated stretchable interconnect shows both failure mechanisms at a lower percentage elongation than the non-encapsulated stretchable interconnect. Even so, the onset point of interfacial delamination for the encapsulated stretchable interconnect occurs only at an impressive number of 63% elongation and metal rupture only at 120%. The in-plane shear strain contour, obtained by numerical simulation, agrees well with the delamination failure location observed in the experiment. [ABSTRACT FROM AUTHOR]

This paper describes the fine-pitch interconnection capabilities of the ultra-thin chip packaging (UTCP) technology, a technology under development for embedding thin chips in a flexible polyimide (PI) substrate. It allows for fully flexible electronics, as the rigid chips are thinned down to 20-30 μm, at which point they become truly flexible themselves. This way, instead of just a flexible substrate with rigid components assembled on top, the entire circuitry can be incorporated inside a 30-40 μm thin chip package. The paper briefly introduces the technology's background with a short description of the fabrication process. Building on the developments already achieved, some further optimizations are discussed, and the technology is tested for its fine-pitch interconnection capabilities using test chips with four-point probe and daisy chain patterns, with a pitch down to 40 μm. The possibility to package several chips in the same substrate is investigated, as well, and finally an outlook on future experiments is briefly discussed. [ABSTRACT FROM AUTHOR]

Abstract: One of the major problems with PM displays is that, depending on the used display material, only a limited number of lines can be multiplexed. We developed a new driving technology and display setup that takes care of that problem. We divided the display into several independent parts or modules. Each module acts as an individual display and has its own display driver. With the use of the new ultra-thin chip package (UTCP), these driver chips can be embedded into the (flexible) display itself. This paper explains the setup of the fully modular display and describes the basic structure of the display drivers and its components. [Copyright &y& Elsevier]

These days, a lot of effort is being put in making electronic devices lighter and compacter, as the electronics market is rapidly expanding with all sorts of portable devices for home and everyday use. In this paper, a technology for embedding thin chips in flexible substrates is proposed that could be the next step for further reducing weight, while at the same time enhancing mechanical flexibility of the electronic circuitry. All stages in the technology's development cycle are discussed: from technology flow, test design and actual fabrication, to process optimization and characterization of the results. An outlook on the following steps of this technology is discussed in the conclusion. [ABSTRACT FROM AUTHOR]

Abstract: The trend of microelectronic products in the textile or medical field is toward higher functionality, miniaturization, application of new materials and a necessity for deformable electronic circuits for improving the comfort control. In this work, the design of flexible and stretchable interconnections is presented. These interconnections are done by embedding sinuous electroplated metallic wires in a stretchable substrate material. A silicone material was chosen as substrate because of its low stiffness and high elongation before break. Common metal conductors used in the electronic industry have very limited elastic ranges; therefore a metallization design is crucial to allow stretchability of the conductors going up to 100%. Different configurations were simulated and compared among them and based on these results, a horseshoe like shape was suggested. This design allows a large deformation with the minimum stress concentration. Moreover, the damage in the metal is significantly reduced by applying narrow metallization schemes. In this way, each conductor track has been split in four parallel lines of 15μm and 15μm space in order to improve the mechanical performance without limiting the electrical characteristics. [Copyright &y& Elsevier]

An innovative and cost-effective procedure for building multi-layered planar antennas is presented. The antenna is constructed by defining copper patterns forming the feed plane and the antenna plane on a single flexible polyimide substrate and by folding the flex around a low ℇr and low-loss spacer. By a suitable choice of transfer tape to assemble the different layers, a high alignment accuracy and low substrate losses are ensured. To illustrate our new approach, the design and manufacturing of a coplanar-waveguide aperture-coupled patch antenna covering the complete 2.45 GHz ISM band is described. By means of reflection and transmission measurements, the high gain and high efficiency of the antenna prototypes are demonstrated. © 2007 Wiley Periodicals, Inc. Microwave Opt Technol Lett 49: 1071–1074, 2007; Published online in Wiley InterScience (www.interscience.wiley.com). DOI.10.1002/mop.22355 [ABSTRACT FROM AUTHOR]

This paper presents the results from the evaluation of different types of flexible substrates for high-density flip chip application. In this work four different flexible substrates were used. The flex substrates were Espanex, Upilex and epoxy glass with 80 μm pitch and Upilex with 54 μm pitch. Two different test IC’s were used for both pitches. In test IC1 (80 μm pitch) and IC3 (54 μm pitch) the bumps were in one row and test IC2 (80 μm pitch) and IC4 (54 μm pitch) in two rows. The total amount of contacts in test IC1 was 190, in test IC2 173, in test IC3 293 and in test IC4 270. The anisotropically conductive adhesive that was used in the tests was epoxy based thermosetting adhesive film with conductive particles. The conductive particles in the adhesives were isolated soft metal-coated polymer particles. The contact resistance was measured using Kelvin four-point method and the continuity and series resistance using daisy chain structure. The reliability of the flip chip interconnections was tested in temperature cycling test and environmental test. Cross section samples were made to analyse the possible reason for failures. The results presented in this paper are from FLEXIL development project that is part of European Union IST research program. [Copyright &y& Elsevier]