28 results on '"Kyu Hwan Oh"'
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2. Towards the Commercialization of the All-Solid-State Li-ion Battery: Local Bonding Structure and the Reversibility of SheetStyle Si-PAN Anodes.
3. Effect of the Applied Power of Atmospheric Pressure Plasma on the Adhesion of Composite Resin to Dental Ceramic.
4. Slurry-Coated Sheet-Style Sn-PAN Anodes for All-Solid-State Li-Ion Batteries.
5. Nanostructured Si/C Fibers as a Highly Reversible Anode Material for All-Solid-State Lithium-Ion Batteries.
6. Self-Contained Fragmentation and Interfacial Stability in Crude Micron-Silicon Anodes.
7. Ex Situ Investigation of Anisotropic Interconnection in Silicon-Titanium-Nickel Alloy Anode Material.
8. Optimized Silicon Electrode Architecture, Interface, and Microgeometry for Next-Generation Lithium-Ion Batteries.
9. Tin Networked Electrode Providing Enhanced Volumetric Capacity and Pressureless Operation for All-Solid-State Li-Ion Batteries.
10. INVESTIGATION ON THERMAL PROPERTIES OF Al/SiCp METAL MATRIX COMPOSITE BASED ON FEM ANALYSIS.
11. Thermal reliability & IMC behavior of low cost alternative Au-Ag-Pd wire bonds to Al metallization.
12. A study on early degradation phenomena in Au-Al ball bonds.
13. Derivation of an Iron Pyrite All-Solid-State Composite Electrode with Ferrophosphorus, Sulfur, and Lithium Sulfide as Precursors.
14. An All-Solid-State Li-Ion Battery with a Pre-Lithiated Si-Ti-Ni Alloy Anode.
15. Nanoscale Interface Modification of LiCoO2 by Al2O3 Atomic Layer Deposition for Solid-State Li Batteries.
16. Microstructure and Pattern Size Dependence of Copper Corrosion in Submicron-Scale Features.
17. The effect of plasma polymer coating using atmospheric-pressure glow discharge on the shear bond strength of composite resin to ceramic.
18. Fracture Mechanics of Solder Bumps During Ball Shear Testing: Effect of Bump Size.
19. Contribution of Convex Surfaces to Magnetostatic Interaction in Granular Medium.
20. Wrinkled hard skins on polymers created by focused ion beam.
21. 3D Crystalline Structures of Stress Induced Voiding in Cu Interconnects by Focused Ion Beam and Electron Backscattered Diffraction.
22. Characterization of the crystallographic microstructure of the stress-induced void in Cu interconnects.
23. In situ observation of the grain growth of the copper electrodeposits for ultralarge scale integration.
24. Contribution of Local Incoherency on Gilbert-Damping.
25. Direct growth of Bismuth Telluride nanowires by On-Film Formation of Nanowires for high-efficiency thermoelectric devices.
26. Ultrafast observation of the coexistence of antiferromagnetism and superconductivity in a High-Tc superconductor.
27. Erratum: Tin Networked Electrode Providing Enhanced Volumetric Capacity and Pressureless Operation for All-Solid-State Li-Ion Batteries [J. Electrochem. Soc., 162, A711 (2015)].
28. Inorganic islands on a highly stretchable polyimide substrate.
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