11 results on '"Su, Yen-Fu"'
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2. Analysis of LED wire bonding process using arbitrary Lagrangian-Eulerian and equilibrium mesh smoothing algorithm.
3. Determination of the junction temperature of Gallium Nitride (GaN)-based high power LED under thermal with current loading conditions.
4. Structure design and reliability assessment of double-sided with double-chip stacking packaging.
5. Thermal analysis and reliability assessment of power module under power cycling test using global- local finite element method.
6. Acceleration factor analysis of aging test on gallium nitride (GaN)-based high power light-emitting diode (LED).
7. Determination of Initial Crack Strength of Silicon Die Using Acoustic Emission Technique.
8. Analysis of LED wire bonding process using arbitrary Lagrangian-Eulerian and explicit time integration methods.
9. Development of double-sided with double-chip stacking structure using panel level embedded wafer level packaging.
10. A thermal performance assessment of panel type packaging (PTP) technology for high efficiency LED.
11. Evaluation of Die Strength by Using Finite Element Method With Experiment Validation.
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