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In this paper, we report the use of three pendeo-epitaxy growth approaches as a way of reducing the threading dislocation density (TDD) of 20 × 20 μm2 GaN platelets to be used for the development of micro light-emitting diodes (μLEDs). The method relies on the coalescence of GaN crystallites grown on top of a network of deformable pillars etched into a silicon-on-insulator substrate. Our approach takes advantage of the creeping properties of SiO2 at the usual GaN epitaxial growth temperature, allowing the GaN crystallites to align and reduce the grain boundary dislocations. Furthermore, this bottom-up approach allows to get rid of the dry plasma etching step for μLEDs fabrication, which highly deteriorates sidewalls, reducing the efficiency of future displays. By optimizing the growth conditions and inducing asymmetric nucleation, a TDD of 2.5 × 108 cm−2 has been achieved on the GaN platelets, while keeping a smooth surface. [ABSTRACT FROM AUTHOR]

The growth and characterization of (101¯1) semipolar GaN buffer, InGaN multiple quantum wells (MQWs), and light‐emitting diode (LED) structure on patterned silicon‐on‐insulator (SOI) substrates, implementing the aspect ratio technique (ART), are reported. The early growth stages of GaN result in continuous and uniform stripes with small height variations that cause the formation of chevrons. Three coalescence strategies are tested to improve surface morphology and optical quality. Scanning electron microscopy identifies no crack formation but undulations of the surface. A roughness of ≈10 nm is measured by atomic force microscopy on large areas. The impact of MQW growth temperature shows similar surface morphology in terms of undulations and roughness. Room temperature photoluminescence spectra show wavelength emission redshifting when decreasing the MQW growth temperature. Room‐temperature cathodoluminescence (CL) highlights first the presence of threading dislocations (TDs) in between the coalescence boundary despite the use of the ART technique. Second, CL shows a spatially homogeneous emission wavelength of around 485 nm only perturbed by lower‐wavelength emission (455 nm) arising from the chevrons. Blue LED structures exhibit uniform emission wavelength at 450 nm, having a crack‐free surface, and roughness of ≈5 nm. These results pave the way for the fabrication of semipolar micro‐LEDs on SOI substrates. [ABSTRACT FROM AUTHOR]

In this work, we report on the innovative growth of semipolar "bow-tie"-shaped GaN structures containing InGaN/GaN multiple quantum wells (MQWs) and their structural and luminescence characterization. We investigate the impact of growth on patterned (113) Si substrates, which results in the bow-tie cross section with upper surfaces having the (10 1 ¯ 1) orientation. Room temperature cathodoluminescence (CL) hyperspectral imaging reveals two types of extended defects: black spots appearing in intensity images of the GaN near band edge emission and dark lines running parallel in the direction of the Si stripes in MQW intensity images. Electron channeling contrast imaging (ECCI) identifies the black spots as threading dislocations propagating to the inclined (10 1 ¯ 1) surfaces. Line defects in ECCI, propagating in the [ 1 2 ¯ 10 ] direction parallel to the Si stripes, are attributed to misfit dislocations (MDs) introduced by glide in the basal (0001) planes at the interfaces of the MQW structure. Identification of these line defects as MDs within the MQWs is only possible because they are revealed as dark lines in the MQW CL intensity images, but not in the GaN intensity images. Low temperature CL spectra exhibit additional emission lines at energies below the GaN bound exciton emission line. These emission lines only appear at the edge or the center of the structures where two (0001) growth fronts meet and coalesce (join of the bow-tie). They are most likely related to basal-plane or prismatic stacking faults or partial dislocations at the GaN/Si interface and the coalescence region. [ABSTRACT FROM AUTHOR]

In this study, AlN epilayers were grown by ammonia-assisted molecular beam epitaxy on 3 nm h-BN grown on c-sapphire substrates. Their structural properties were investigated by comparing as-grown and postgrowth annealed layers. The role of annealing on the crystalline quality and surface morphology was studied as a function of AlN thickness and the annealing duration and temperature. Optimum annealing conditions were identified. The results of X-ray diffraction showed that optimization of the annealing recipe led to a significant reduction in the symmetric (0 0 0 2) and skew symmetric (1 0 −1 1) reflections, which was associated with a reduction in edge and mixed threading dislocation densities (TDDs). Furthermore, the impact on the crystalline structure of AlN and its surface was studied, and the results showed a transition from a surface with high roughness to a smoother surface morphology with a significant reduction in roughness. In addition, the annealing duration was increased at 1650 °C to further understand the impact on both AlN and h-BN, and the results showed a diffusion interplay between AlN and h-BN. Finally, an AlN layer was regrown on the top of an annealed template, which led to large terraces with atomic steps and low roughness. [ABSTRACT FROM AUTHOR]

Meltback etching, a deteriorating chemical reaction occurring between gallium and silicon under typical metal organic chemical vapor deposition growth conditions, is a common problem that often limits the development of GaN on silicon substrates, in particular, patterned substrates, and therefore must be circumvented. To further understand this reaction, energy dispersive X-ray spectroscopy was performed in cross-section, and a proposed 2-dimensional model on how meltback etching evolves throughout the growth process is discussed, which indicated an inter-diffusion reaction occurring primarily between gallium and silicon where gallium from GaN diffuses into the silicon substrate while silicon from the substrate diffuses out and incorporates into the GaN crystal. Moreover, we demonstrate an anisotropic behavior of the gallium penetrating the silicon substrate, which has shown to be delimited by the Si f111g planes. Finally, an approach to prevent meltback etching by changing the fractions of nitrogen and hydrogen in the carrier gas is presented and discussed. [ABSTRACT FROM AUTHOR]

In this contribution, we performed the growth of a 3C-SiC/Si/3C-SiC layer stack on a Si(001) substrate by means of chemical vapor deposition. We show that, by tuning the growth conditions, the 3C-SiC epilayer can be grown along either the [111] direction or the [110] direction. The key parameter for the growth of the desired 3C-SiC orientation on the Si(110)/3C-SiC(001)/Si(001) heterostructure is highlighted and is linked to the Si epilayer surface morphology. The epitaxial relation between the layers has been identified using X-ray diffraction and transmission electron microscopy (TEM). We showed that, regardless of the top 3C-SiC epilayer orientation, domains rotated by 90° around the growth direction are present in the epilayer. Furthermore, the difference between the two 3C-SiC orientations was investigated by means of high magnification TEM. The results indicate that the faceted Si(110) epilayer surface morphology results in a (110)-oriented 3C-SiC epilayer, whereas a flat hetero-interface has been observed between 3C-SiC(111) and Si(110). The control of the top 3C-SiC growth direction can be advantageous for the development of new micro-electro-mechanical systems. [ABSTRACT FROM AUTHOR]

We have grown (11-22)-oriented GaN/Al0.5Ga0.5N quantum wells (QWs) using molecular beam epitaxy on GaN (11-22)-oriented templates grown by metal-organic vapor phase epitaxy on m-plane oriented sapphire substrates. The performance of epitaxial growth of GaN/Al0.5Ga0.5N heterostructures on the semi-polar orientation (11-22) in terms of surface roughness and structural properties, i.e., strain relaxation mechanisms is discussed. In addition, high resolution transmission electron microscopy reveals very smooth QW interfaces. The photoluminescence of such samples are strictly originating from radiative recombination of free excitons for temperatures above 100 K. At high temperature, the population of localized excitons, moderately trapped (5 meV) at low temperature, is negligible. [ABSTRACT FROM AUTHOR]

We exhibit both experimentally and theoretically a novel growth mode for the epitaxy of AlGaN quantum dots (QD), where they are eventually produced without their usual surrounding wetting layer (WL). If the generic evolution of QD is ruled by the elastic relaxation and capillary effects, evaporation occurs here on a time scale similar to that of growth. Using a dedicated surface diffusion model accounting for elasticity, wetting, and anisotropy, we evidence numerically different kinetic regimes as a function of the evaporation flux, which rationalizes the experimental outcome. The resulting QD are characterized by enhanced optical properties compared to the common QD with a WL. These nanostructures are promising candidates for deep-ultraviolet-light-emitting diodes. [ABSTRACT FROM AUTHOR]

GaN films epitaxially-grown on M-sapphire may have different orientations, either nonpolar and semipolar. In this paper, the different epitaxial relationships are investigated in details thanks to transmission electron microscopy. It is shown that these relationships drastically depend on the nitridation conditions. Mechanisms explaining the different epitaxial relationships are proposed. These mechanisms take into account the formation of a nitridation layer, the lattice mismatches between the growing films, and the substrate, and the surface energies. It is, moreover, shown that the difference of symmetries between the M-sapphire surface and the epitaxial films leads to the formation of growth twins for the [formula] and [formula] orientations. [ABSTRACT FROM AUTHOR]

In this contribution, we present a method to form free-standing cubic silicon carbide (3C-SiC) membranes in-situ during the growth stage. To do so, we exploit the presence of voids in the silicon (Si) epilayer underneath the 3C-SiC membrane, in stark contrast to the conventional view of voids as defects. The shape and the size of the 3C-SiC membranes can be controlled by a preceding patterning step of the Si epilayer. Afterwards, by controlling the expansion of voids in Si, the structured sacrificial layer is consumed during the 3C-SiC growth step. Consequently, the membranes are grown and released simultaneously in a single step process. This straightforward technique is expected to markedly simplify the fabrication process of membranes by reducing the fabrication duration and cost. Furthermore, it helps to overcome several technical issues and presents the cornerstone for micro and nano-electromechanical systems applications, profiting from the outstanding properties of cubic silicon carbide. [ABSTRACT FROM AUTHOR]

Semipolar GaN crystal stripes larger than 100 μm with dislocation densities below 5×106 cm-2 are achieved using a low cost fabrication process. An original sapphire patterning procedure is proposed, enabling selective growth of semipolar oriented GaN stripes while confining the defects to specific areas. Radiative and non-radiative crystalline defects are investigated by cathodoluminescence and can be correlated to the development of crystal microstructure during the growth process. A dislocation reduction mechanism, supported by transmission electron microscopy, is proposed. This method represents a step forward toward low-cost quasi-bulk semipolar GaN epitaxial platforms with an excellent structural quality which will allow for even more efficient III-nitride based devices. [ABSTRACT FROM AUTHOR]

The difference of growth temperatures between InGaN quantum wells and GaN barriers has detrimental effects on the properties of the wells. Different capping processes of InGaN quantum well with a thin AlGaN layer have been investigated to prevent these effects. Both structural and optical properties of the samples, grown on c-plane sapphire substrates by metalorganic vapor phase epitaxy, were studied through transmission electron microscopy (TEM), x-ray diffraction and room temperature photoluminescence. The average quantum well thickness and its indium composition were determined by digital processing of lattice fringes in cross-sectional TEM images. From the analysis of the well thickness distribution, it is shown that AlGaN as a capping layer helps to compensate an unwanted undulation at the upper InGaN QW-barrier interface. Moreover, when deposited at the same temperature as InGaN, the AlGaN layer is effective in avoiding or reducing the evaporation and/or diffusion of indium from InGaN wells, which results in the thinning of the well. It therefore helps to extend the emission wavelength up to 540 nm with a reduced degradation of the room temperature photoluminescence efficiency. [ABSTRACT FROM AUTHOR]

The growth of ZnxMn1-xO thin films by plasma-assisted MBE has been investigated. Mn incorporation results in drastic changes in the surface morphology, the distribution of the atoms at the surface and the epilayer growth rates, which have not been reported so far and have not been observed in any other ZnO-based alloy. These marked changes are readily observable in diluted alloys with Mn content below 1%. It is shown that Mn acts as a catalyst for oxygen incorporation into ZnO. (© 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim) [ABSTRACT FROM AUTHOR]

We report on the influence of a capping layer on the photoluminescence properties of self-assembled GaN quantum dots grown on an Al0.5Ga0.5N template. Self-assembled GaN quantum dots show a large quantum confined Stark shift and long carrier recombination time due to strong built-in spontaneous and piezoelectric polarization fields. Nevertheless, owing to strong carrier localization and suppressed nonradiative processes, these quantum dots have a high-quantum efficiency even at room temperature. Here, we show that the capping thickness has an important role on the optical properties of the GaN quantum dots. The radiative and nonradiative recombination processes of quantum dots are strongly affected by adjusting the capping thickness, and the GaN quantum dots with 12 monolayers-thick Al0.5Ga0.5N capping layer show a remarkably high internal quantum efficiency of more than 80% at room temperature. We also studied photoluminescence quenching and enhancement for surface (uncapped) quantum dots caused by photoadsorption and photodesorption of oxygen. [ABSTRACT FROM AUTHOR]

Monolithic InGaN-based light-emitting diodes (LEDs) using a light converter fully grown by metal organic vapor phase epitaxy are demonstrated. The light converter, consisting of 10–40 InGaN/GaN quantum wells, is grown first, followed by a violet pump LED. The structure and growth conditions of the pump LED are specifically adapted to avoid thermal degradation of the light converter. Electroluminescence analysis shows that part of the pump light is absorbed by the light converter and reemitted at longer wavelength. Depending on the emission wavelength of the light converter, different LED colors are achieved. In particular, for red-emitting light converters, a color temperature of 2100 K corresponding to a tint between warm white and candle light is demonstrated. [ABSTRACT FROM AUTHOR]

Self-assembled GaN quantum dots (QDs) grown on Al0.5Ga0.5N have been used as the active region of light emitting diodes (LEDs). The LED emission wavelength exhibits a strong shift towards higher energies with increasing current density, which allows obtaining an emission in the UV range (down to 375 nm) above 100 A/cm2. Together with this shift, a reduction of the electroluminescence (EL) peak full width at half maximum (FWHM) is observed. These features are a consequence of the quantum confined Stark effect caused by the built-in electric field in the heterostructure. At larger current densities, an opposite behavior (i.e., an increase of the FWHM) is observed concomitant with the appearance of an additional peak on the EL high energy side. This characteristic has been confronted with calculations and attributed to a transition between the lowest electron state and the first excited hole state in the QDs. [ABSTRACT FROM AUTHOR]

Blue light-emitting diodes (LEDs) grown on ZnO substrates were fabricated owing to the monolithic integration of an entire nitride-based LED structure including a GaN p–n junction and an (In,Ga)N/GaN multiple quantum well active region. The surface preparation of the ZnO substrate, as well as the GaN nucleation process, was developed to grow the structures and limit the inter diffusion of O from the substrate, which are the key points for the fabrication of a light-emitting device on ZnO. LEDs with a clear rectification behavior and electroluminescence over the blue range, from 415 to 450 nm, were demonstrated. [ABSTRACT FROM AUTHOR]