90 results on '"Cao, Xi"'
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2. Additional file 1 of IFN-γ-STAT1-mediated CD8+ T-cell-neural stem cell cross talk controls astrogliogenesis after spinal cord injury
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Wang, Jingyu, Xu, Lintao, Peng, Deqing, Zhu, Yongjian, Gu, Zhaowen, Yao, Ying, Li, Heyangzi, Cao, Xi, Fu, Chun-yan, Zheng, Mingzhi, Song, Xinghui, Ding, Yueming, Shen, Yueliang, Zhong, Jinjie, Chen, Ying-ying, Hu, Jue, and Wang, Lin-lin
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Additional file 1: Table S1. Primers. Table S2. Primers.
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- 2023
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3. Fast superconducting qubit control with sub-harmonic drives
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Xia, Mingkang, Zhou, Chao, Liu, Chenxu, Patel, Param, Cao, Xi, Lu, Pinlei, Mesits, Boris, Mucci, Maria, Gorski, David, Pekker, David, and Hatridge, Michael
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Quantum Physics ,FOS: Physical sciences ,Quantum Physics (quant-ph) - Abstract
Increasing the fidelity of single-qubit gates requires a combination of faster pulses and increased qubit coherence. However, with resonant qubit drive via a capacitively coupled port, these two objectives are mutually contradictory, as higher qubit quality factor requires a weaker coupling, necessitating longer pulses for the same applied power. Increasing drive power, on the other hand, can heat the qubit's environment and degrade coherence. In this work, by using the inherent non-linearity of the transmon qubit, we circumvent this issue by introducing a new parametric driving scheme to perform single-qubit control. Specifically, we achieve rapid gate speed by pumping the transmon's native Kerr term at approximately one third of the qubit's resonant frequency. Given that transmons typically operate within a fairly narrow range of anharmonicity, this technique is applicable to all transmons. In both theory and experiment, we show that the Rabi rate of the process is proportional to applied drive amplitude cubed, allowing for rapid gate speed with only modest increases in applied power. In addition, we demonstrate that filtering can be used to protect the qubit's coherence while performing rapid gates, and present theoretical calculations indicating that decay due to multi-photon losses, even in very strongly coupled drive lines, will not limit qubit lifetime. We demonstrate $\pi/2$ pulses as short as tens of nanoseconds with fidelity as high as 99.7\%, limited by the modest coherence of our transmon. We also present calculations indicating that this technique could reduce cryostat heating for fast gates, a vital requirement for large-scale quantum computers.
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- 2023
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4. Gut microbiota and acylcarnitine metabolites connect the beneficial association between estrogen and lipid metabolism disorders in ovariectomized mice
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Cao, Xi, Guo, Mengmeng, Ji, De, Xiong, H, Wu, Yujiang, Zhang, Ting, Suo, Langda, Pan, Menghao, Brugger, Daniel, Chen, Yulin, Zhang, Ke, Ma, Baohua, University of Zurich, and Guo, Mengmeng
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Microbiology (medical) ,Infectious Diseases ,630 Agriculture ,General Immunology and Microbiology ,Ecology ,Physiology ,Genetics ,570 Life sciences ,biology ,Cell Biology ,10227 Institute of Animal Nutrition - Abstract
Our findings establish a role for gut microbes in the progression of estrogen deficiency-induced lipid metabolism disorders and reveal key target bacteria that may have the potential to regulate acylcarnitine synthesis. These findings suggest a possible route for the use of microbes or acylcarnitine to regulate disorders of lipid metabolism induced by estrogen deficiency.
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- 2023
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5. Additional file 1 of Dynamic changes of CSF clusterin levels across the Alzheimer’s disease continuum
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Tang, Lian, Wang, Zhi-Bo, Ma, Ling-Zhi, Cao, Xi-Peng, Tan, Lan, and Tan, Meng-Shan
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Additional file 1: Supplementary Fig. 1. CSF clusterin normal Quantile-Quantile Plot, Supplementary Fig. 2. Association of CSF clusterin with age, Supplementary Fig. 3. CSF clusterin in groups defined only by CSF Aβ42 and p-tau, Supplementary Fig. 4. CSF clusterin in groups defined only by CSF Aβ42 and t-tau, Supplementary Table 1. Association of CSF clusterin and CSF core biomarkers, Supplementary Table 2. Association of CSF clusterin and CSF core biomarkers containing outliers.
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- 2023
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6. Additional file 2 of Syndecan-1 as an immunogene in Triple-negative breast cancer: regulation tumor-infiltrating lymphocyte in the tumor microenviroment and EMT by TGFb1/Smad pathway
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Zhong, Ying, Li, Fangyuan, Zhang, Sumei, Yang, Zhenli, Ren, Xinyu, Cao, Xi, Xu, Yali, Guo, Dan, Zhou, Yidong, Mao, Feng, Shen, Songjie, and Sun, Qiang
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Additional file 2: Table S2. List of primers for RT-qPCR.
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- 2023
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7. Additional file 1 of The association between physical symptoms and self-care behaviours in heart failure patients with inadequate self-care behaviours: a cross-sectional study
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Liu, Xu, Liu, Li, Li, Yan, and Cao, Xi
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Additional file 1: Table S1. Participants’ socio-demographic and clinical characteristics, physical symptoms, and self-care behaviours in the parental study. Table S2. Item score of physical symptoms measured by the Heart Failure Somatic Perception Scale.
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- 2023
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8. Additional file 1 of Syndecan-1 as an immunogene in Triple-negative breast cancer: regulation tumor-infiltrating lymphocyte in the tumor microenviroment and EMT by TGFb1/Smad pathway
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Zhong, Ying, Li, Fangyuan, Zhang, Sumei, Yang, Zhenli, Ren, Xinyu, Cao, Xi, Xu, Yali, Guo, Dan, Zhou, Yidong, Mao, Feng, Shen, Songjie, and Sun, Qiang
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Additional file 1: Table S1. SDC1 overexpression.
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- 2023
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9. Evidence-based assessment of acupuncture skills using a newly developed simulation-based test:A validation study
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XIE, Su jun, WANG, Zheng, ZHOU, Ying fang, KONGE, Lars, WAN, Lai siqi, CAO, Xi jun, WAN, Xing, HU, Yun, FANG, Fang, HUANG, Kang bai, ZHANG, Liang, and ZHUANG, Xun
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Mastery learning ,Acupuncture ,Assessment ,Simulation ,Validity - Abstract
Objective: Acupuncture is an efficient treatment modality for many different training, but the technique can be challenging to master. Identification of the different acupuncture points can now be practiced in a standardized and patient-safe simulation-based environment. We aim to gather additional evidence regarding simulation-based training of acupuncture skills and hope that the simulation-based test developed and will be used for simulation-based mastery learning in future develop. Methods: The aim of this study was to develop a test of acupuncture skills using the TCM (Traditional Chinese Medicine) Meridians & Acupoints Anatomy Teaching Platform and gather validity evidence using Messick's framework. Novice medical students without prior experience in acupuncture (n = 43), intermediate medical students who had finished the mandatory acupuncture course (n = 24), and skilled acupuncture doctors (n = 17) were included in the study. One-hundred and seven acupuncture points were presented to the participants in identical randomized order and they were asked to identify each point by touching the correct anatomical location on the simulator. The simulator automatically registered the accuracy of participants’ answers. Results: The reliability of the final test (66 acupuncture points) was at a high level with a Cronbach's alpha of 0.98 and only 16 acupuncture points were needed to ensure a reliability of 0.90. The test could discriminate significantly between all three groups and a credible pass/fail-score of 34 points was determined which resulted in eight out of 43 (19%) novices passing the test and only two out of 17 (12%) experienced failing the test. These consequences were statistically significant (P < 0.001). Conclusion: Based on Messick's framework we demonstrated strong validity evidence for a newly developed simulation-based test of acupuncture points localization skills. The test can be used as an aid to decide when trainees are ready to progress to more advanced training and clinical practice. Compared with the traditional point-point test, the point-point evaluation of the simulator can be more objective and reduce the effort of teachers.
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- 2022
10. Association between the alteration of serum N-glycan profile and the change of glycosyltransferase expression in liver tissue in patients with hepatitis B virus-related hepatocellular carcinoma
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CAO Xi
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RC799-869 ,Diseases of the digestive system. Gastroenterology ,digestive system diseases - Abstract
ObjectiveTo investigate the potential mechanism of serum N-glycan alterations in patients with hepatitis B virus (HBV)-related hepatocellular carcinoma (HCC) by measuring serum N-glycan profile and comparing glycosyltransferase gene expression between HCC tissue and adjacent tissue. MethodsThe samples of HCC tissue, adjacent tissue, and normal liver tissue were collected from 34 patients with HBV-related HCC who were admitted to Chinese PLA General Hospital, and serum samples were also collected. Among these 34 patients, 8 were randomly selected and their serum samples were established as HCC experimental group, and the serum samples of 20 healthy adults were established as control group. DNA sequencer-aided fluorophore-assisted carbohydrate electrophoresis was used to analyze serum N-glycan profile in the HCC experimental group and the control group. Quantitative real-time PCR was used to measure the mRNA expression of 8 glycosyltransferase genes (FUT3, FUT4, FUT6, FUT7, FUT8, Gn-TIII, Gn-TIVa, and Gn-TV) in the HCC tissue and adjacent tissue of 34 patients with HBV-related HCC, and Western blot was used to measure the expression of corresponding proteins. The independent samples t-test was used for comparison of continuous data between two groups. ResultsCompared with the control group, the HCC experimental group had a significant increase in the abundance of N-glycan peak9 (NA3Fb) in serum(t=-2.514,P<0.05). There were significant differences in the mRNA expression of FUT8, Gn-TIVa, and Gn-TV between HCC tissue and adjacent tissue, and the mRNA and protein expression levels of FUT8 and Gn-TV in HCC tissue were significantly higher than those in adjacent tissue (FUT8 mRNA: 1.50±0.34 vs 0.65±0.11, t=-2.354,P=0.022; Gn-TV mRNA: 3.57±0.64 vs 1.33±016, t=-3.384,P=0001; FUT8 protein: 0.70±0.11 vs 0.083±0.017, t=9.555,P=0.001; Gn-TV protein: 1.33±0.19 vs 0.60±0.15, t=5.097,P=0.007). The mRNA expression level of Gn-TIVa in HCC tissue was significantly higher than that in adjacent tissue (2.90±0.47 vs 1.68±0.19, t=-2.403,P=0.019), but there was no significant difference in the protein expression level of Gn-TIVa between HCC tissue and adjacent tissue (052±0.24 vs 0.24±0.11,t=1.833, P=0.141). The changes of glycosyltransferase gene expression in HCC tissue were consistent with the alteration of serum N-glycan profile. ConclusionSerum N-glycan alterations in patients with HBV-related HCC may be closely associated with the upregulated expression of the glycosyltransferase genes FUT8, Gn-TIVa, and Gn-TV in HCC tissue.
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- 2021
11. Overview of Subsynchronous Oscillation in Grid-connected Wind Farm
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Cao Xi-Min, Lu Yong-Geng, and Xu Pei-Zhen
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Control theory ,Computer science ,Oscillation ,020209 energy ,020208 electrical & electronic engineering ,0202 electrical engineering, electronic engineering, information engineering ,02 engineering and technology ,Electrical and Electronic Engineering ,Grid ,Electronic, Optical and Magnetic Materials - Abstract
Background: Over the past few years, the subsynchronous oscillation (SSO) caused by the grid-connected wind farm had a bad influence on the stable operation of the system and has now become a bottleneck factor restricting the efficient utilization of wind power. How to mitigate and suppress the phenomenon of SSO of wind farms has become the focus of power system research. Methods: This paper first analyzes the SSO of different types of wind turbines, including squirrelcage induction generator based wind turbine (SCIG-WT), permanent magnet synchronous generator- based wind turbine (PMSG-WT), and doubly-fed induction generator based wind turbine (DFIG-WT). Then, the mechanisms of different types of SSO are proposed with the aim to better understand SSO in large-scale wind integrated power systems, and the main analytical methods suitable for studying the SSO of wind farms are summarized. Results: On the basis of results, using additional damping control suppression methods to solve SSO caused by the flexible power transmission devices and the wind turbine converter is recommended. Conclusion: The current development direction of the SSO of large-scale wind farm grid-connected systems is summarized and the current challenges and recommendations for future research and development are discussed.
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- 2020
12. Additional file 1 of The value of urinary gonadotropins in the diagnosis of central precocious puberty: a meta-analysis
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Xu, Dan, Zhou, Xueying, Wang, Junfei, Cao, Xi, and Liu, Tao
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Additional file 1. Supplement 1.
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- 2022
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13. Additional file 2 of The value of urinary gonadotropins in the diagnosis of central precocious puberty: a meta-analysis
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Xu, Dan, Zhou, Xueying, Wang, Junfei, Cao, Xi, and Liu, Tao
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Additional file 2. Supplement 2.
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- 2022
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14. Additional file 3 of The value of urinary gonadotropins in the diagnosis of central precocious puberty: a meta-analysis
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Xu, Dan, Zhou, Xueying, Wang, Junfei, Cao, Xi, and Liu, Tao
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Additional file 3. Supplement 3.
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- 2022
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15. Additional file 4 of The value of urinary gonadotropins in the diagnosis of central precocious puberty: a meta-analysis
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Xu, Dan, Zhou, Xueying, Wang, Junfei, Cao, Xi, and Liu, Tao
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Additional file 4. Supplement 4.
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- 2022
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16. Computational Intelligence Based Psychometric Assessment Development for Cognitive Diagnosis Models
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Cao, Xi
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FOS: Psychology ,Applied Computer Science ,170109 Personality, Abilities and Assessment - Abstract
Submitted in total fulfilment of the requirements for the degree of Doctor of Philosophy to the School of Computing, Engineering and Mathematical Sciences, La Trobe University, Victoria.
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- 2022
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17. An Energy-Efficient and High Throughput in-Memory Computing Bit-Cell With Excellent Robustness Under Process Variations for Binary Neural Network
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Zhewei Jiang, Sanjay Parihar, Gobinda Saha, M. A. Karim, Cao Xi, and Jack M. Higman
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In-memory computing ,Bit cell ,General Computer Science ,Computer science ,business.industry ,Deep learning ,General Engineering ,Binary number ,SRAM ,Computational science ,XNOR gate ,Robustness (computer science) ,In-Memory Processing ,nonideality ,binary neural network ,General Materials Science ,Artificial intelligence ,lcsh:Electrical engineering. Electronics. Nuclear engineering ,business ,process variation ,lcsh:TK1-9971 ,MNIST database ,Efficient energy use - Abstract
In-memory computing (IMC) is a promising approach for energy cost reduction due to data movement between memory and processor for running data-intensive deep learning applications on the computing systems. Together with Binary Neural Network (BNN), IMC provides a viable solution for running deep neural networks at the edge devices with stringent memory and energy constraints. In this paper, we propose a novel 10T bit-cell with a back-end-of-line (BEOL) metal-oxide-metal (MOM) capacitor laid on pitch for in-memory computing. Our IMC bit-cell, when arranged in a memory array, performs binary convolution (XNOR followed by Bit-count operations) and binary activation generation operations. We show, when binary layers of BNN are mapped into our IMC arrays for MNIST digit classification, 98.75% accuracy with energy efficiency of 2193 TOPS/W and throughput of 22857 GOPS can be obtained. We determine the memory array size considering the word-line and bit-line nonidealities and show how these impact classification accuracy. We analyze the impact of process variations on classification accuracy and show how word-line pulse tunability provided by our design can be used to improve the robustness of classification under process variations.
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- 2020
18. Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous Integration
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Sze Pei Lim, Cheng-Ta Ko, Henry Yang, Tony Chen, Cao Xi, Eric Kuah, Zhang Li, Hsing-Hui Wu, Jeffery C. C. Lo, Yu-Hua Chen, Chieh-Lin Chang, Jhih-Yuan Pan, Kim Hwee Tan, John H. Lau, Mian Tao, Junfen Lin, Nelson Fan, Ning Cheng Lee, Iris Xu, Penny Lo, Marc Lin, Margie Li, Ming Li, Ricky Lee, Rozalia Beica, Chia-Hung Lin, and Curry Lin
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010302 applied physics ,Fabrication ,Materials science ,Computer Networks and Communications ,business.industry ,020208 electrical & electronic engineering ,Fan-out ,Dielectric ,Epoxy ,02 engineering and technology ,Photoresist ,Chip ,01 natural sciences ,Electronic, Optical and Magnetic Materials ,Conductor ,Printed circuit board ,visual_art ,0103 physical sciences ,Automotive Engineering ,visual_art.visual_art_medium ,0202 electrical engineering, electronic engineering, information engineering ,Optoelectronics ,Electrical and Electronic Engineering ,business - Abstract
The design, materials, process, and fabrication of a heterogeneous integration of four chips by a fan-out panel-level packaging (FOPLP) method are investigated in this study. Emphasis is placed on (1) the application of a dry-film epoxy molding compound for molding the chips and (2) the application of a special assembly process called uni-substrate-integrated package for fabricating the redistribution layers (RDLs) of the FOPLP. The Ajinomoto build-up film is used as the dielectric of the RDLs and is built up by the semiadditive process. Electroless Cu is used to make the seed layer, laser direct imaging is used for opening the photoresist, and printed circuit board (PCB) Cu plating is used for making the conductor wiring of the RDLs. The panel dimensions are 508 × 508 mm. The package dimensions of the FOPLP are 10 × 10 mm. The large chip size and the small chip sizes are, respectively, 5 × 5 mm and 3 × 3 mm. The uniqueness of this study is that all the processes are carried out by using the PCB equipment.
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- 2018
19. Additional file 1 of Anaemia and cerebrospinal fluid biomarkers of Alzheimer���s pathology in cognitively normal elders: the CABLE study
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Yang, Xin-Yu, Hou, Xiao-He, Bi, Yan-Lin, Hu, Hao, Cao, Xi-Peng, Tan, Lan, Yang, Jiu-Long, and Yu, Jin-Tai
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hemic and lymphatic diseases ,macromolecular substances - Abstract
Additional file 1: Table S1. Associations between anaemia and AD biomarkers. Table S2. Associations between the severity of anaemia and AD biomarkers. Table S3. Association of anemia with CSF A��42. Table S4. Association of anemia with CSF A��40. Table S5. Association of anemia with CSF t-tau. Table S6. Association of anemia with CSF p-tau. Table S7. Association of anemia with CSF t-tau/A��42 ratio. Table S8. Association of anemia with CSF p-tau/A��42 ratio. Table S9. Association of anemia with CSF A��42/A��40 ratio. Table S10. Associations between the severity of anaemia and CSF A��42. Table S11. Associations between the severity of anaemia and CSF A��40. Table S12. Associations between the severity of anaemia and CSF t-tau. Table S13. Associations between the severity of anaemia and CSF p-tau. Table S14. Associations between the severity of anaemia and t-tau/A��42 ratio. Table S15. Associations between the severity of anaemia and p-tau/A��42 ratio. Table S16. Associations between the severity of anaemia and A��40/A��42 ratio.
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- 2021
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20. Paclitaxel-Loaded Macrophage Membrane Camouflaged Albumin Nanoparticles for Targeted Cancer Therapy
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Cao,Xi, Tan,Tingfei, Zhu,Dongchun, Yu,Haixia, Liu,Yaru, Zhou,Haiyun, Jin,Yong, and Xia,Quan
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International Journal of Nanomedicine - Abstract
Xi Cao,1,2 Tingfei Tan,1,2 Dongchun Zhu,1,2 Haixia Yu,1,2 Yaru Liu,1,2 Haiyun Zhou,1,2 Yong Jin,3,4 Quan Xia1,2 1Department of Pharmacy, The First Affiliated Hospital of Anhui Medical University, Hefei, People’s Republic of China; 2The Grade 3 Pharmaceutical Chemistry Laboratory of State Administration of Traditional Chinese Medicine, Hefei, People’s Republic of China; 3Key Laboratory of Anti-Inflammatory and Immune Medicines, Ministry of Education, School of Pharmacy, Anhui Medical University, Hefei, People’s Republic of China; 4The Key Laboratory of Major Autoimmune Diseases, Anhui Province, Anhui Institute of Innovative Drugs, School of Pharmacy, Anhui Medical University, Hefei, People’s Republic of ChinaCorrespondence: Quan Xia Tel +86 551 62922154Email xiaquan2010@163.comBackground: Melanoma is the most common symptom ofaggressive skin cancer, and it has become a serious health concern worldwide in recent years. The metastasis rate of malignant melanoma remains high, and it is highly difficult to cure with the currently available treatment options. Effective yet safe therapeutic options are still lacking. Alternative treatment options are in great demand to improve the therapeutic outcome against advanced melanoma. This study aimed to develop albumin nanoparticles (ANPs) coated with macrophage plasma membranes (RANPs) loaded with paclitaxel (PTX) to achieve targeted therapy against malignant melanoma.Methods: Membrane derivations were achieved by using a combination of hypotonic lysis, mechanical membrane fragmentation, and differential centrifugation to empty the harvested cells of their intracellular contents. The collected membrane was then physically extruded through a 400 nm porous polycarbonate membrane to form macrophage cell membrane vesicles. Albumin nanoparticles were prepared through a well-studied nanoprecipitation process. At last, the two components were then coextruded through a 200 nm porous polycarbonate membrane.Results: Using paclitaxel as the model drug, PTX-loaded RANPs displayed significantly enhanced cytotoxicity and apoptosis rates compared to albumin nanoparticles without membrane coating in the murine melanoma cell line B16F10. RANPs also exhibited significantly higher internalization efficiency in B16F10 cells than albumin nanoparticles without a membrane coating. Next, a B16F10 tumor xenograft mouse model was established to explore the biodistribution profiles of RANPs, which showed prolonged blood circulation and selective accumulation at the tumor site. PTX-loaded RANPs also demonstrated greatly improved antitumor efficacy in B16F10 tumor-bearing mouse xenografts.Conclusion: Albumin-based nanoscale delivery systems coated with macrophage plasma membranes offer a highly promising approach to achieve tumor-targeted therapy following systemic administration.Keywords: macrophage membrane, albumin nanoparticles, melanoma, paclitaxel, tumor-targeted therapy
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- 2020
21. Additional file 1 of Effectiveness of exercise intervention on fall-related fractures in older adults: a systematic review and meta-analysis of randomized controlled trials
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Wang, Qiang, Jiang, Xiaowei, Yingchao Shen, Yao, Ping, Chen, Jun, Zhou, Yuan, Yunfeng Gu, Zhiyuan Qian, and Cao, Xi
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Additional file 1. Supplemental 1 Search Strategy For Pubmed
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- 2020
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22. On the existence of optimal stationary policies for average Markov decision processes with countable states
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Xia, Li, Guo, Xianping, and Cao, Xi-Ren
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Optimization and Control (math.OC) ,FOS: Mathematics ,Mathematics - Optimization and Control - Abstract
For a Markov decision process with countably infinite states, the optimal value may not be achievable in the set of stationary policies. In this paper, we study the existence conditions of an optimal stationary policy in a countable-state Markov decision process under the long-run average criterion. With a properly defined metric on the policy space of ergodic MDPs, the existence of an optimal stationary policy can be guaranteed by the compactness of the space and the continuity of the long-run average cost with respect to the metric. We further extend this condition by some assumptions which can be easily verified in control problems of specific systems, such as queueing systems. Our results make a complementary contribution to the literature in the sense that our method is capable to handle the cost function unbounded from both below and above, only at the condition of continuity and ergodicity. Several examples are provided to illustrate the application of our main results., Comment: 25 pages
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- 2020
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23. Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration
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Wu Kai, Iris Xu, Ji Hao, Tony Chen, Margie Li, Qing Xiang Yong, Ming Li, Zhang Li, Henry Yang, Zhong Cheng, Sze Pei Lim, Ricky Lee, Koh Sau Wee, Curry Lin, Hsing-Hui Wu, Cheng-Ta Ko, Yiu Ming Cheung, Rozalia Beica, Kim Hwee Tan, Jeffery C. C. Lo, Jiang Ran, Cao Xi, Eric Kuah, John H. Lau, Marc Lin, Yu-Hua Chen, Ning-Cheng Lee, Mian Tao, Nelson Fan, Jhih-Yuan Pan, Chieh-Lin Chang, Eric Ng, and Jin Lin
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Materials science ,Fabrication ,Mechanical engineering ,Hardware_PERFORMANCEANDRELIABILITY ,02 engineering and technology ,Temperature cycling ,Photoresist ,01 natural sciences ,Industrial and Manufacturing Engineering ,law.invention ,Printed circuit board ,Reliability (semiconductor) ,law ,Plating ,0103 physical sciences ,Hardware_INTEGRATEDCIRCUITS ,0202 electrical engineering, electronic engineering, information engineering ,Electrical and Electronic Engineering ,010302 applied physics ,business.industry ,020208 electrical & electronic engineering ,Fan-out ,021001 nanoscience & nanotechnology ,Chip ,Electronic, Optical and Magnetic Materials ,Capacitor ,Resist ,Optoelectronics ,0210 nano-technology ,business - Abstract
The design, materials, process, fabrication, and reliability of a heterogeneous integration of 4 chips and 4 capacitors by a FOPLP (fan-out panel-level packaging) method are investigated in this study. Emphasis is placed on the application of a special assembly process called Uni-SIP (Uni-substrate-integrated-package) for fabricating the RDLs (redistribution layers) of the FOPLP. The ABF (Ajinomoto build-up film) is used as the dielectric of the RDLs and is built up by the SAP (semi-additive process). The electroless Cu is used to make the seed layer, the LDI (laser direct imaging) is used for opening the photoresist, and the PCB (printed circuit board) Cu plating is used for making the conductor wiring of the RDLs. Reliability assessments such as the thermal cycling test is also performed.
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- 2018
24. Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)
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Jeffery C. C. Lo, Jiang Ran, Yiu Ming Cheung, Thomas Taylor, Ning-Cheng Lee, Rozalia Beica, Cheng-Ta Ko, Sze Pei Lim, Wu Kai, Nelson Fan, Koh Sau Wee, Ming Li, Yao-Der Chen, Ricky Lee, Margie Li, John H. Lau, Zhang Li, Cao Xi, Eric Kuah, Iris Xu, Qingxiang Yong, Kim Hwee Tan, Mian Tao, Henry Yang, Tony Chen, and Ji Hao
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010302 applied physics ,Materials science ,Computer Networks and Communications ,business.industry ,Compression molding ,Fan-out ,02 engineering and technology ,Epoxy ,021001 nanoscience & nanotechnology ,Chip ,01 natural sciences ,Electronic, Optical and Magnetic Materials ,visual_art ,0103 physical sciences ,visual_art.visual_art_medium ,Optoelectronics ,Wafer dicing ,Wafer ,Redistribution layer ,Electrical and Electronic Engineering ,0210 nano-technology ,business ,Wafer-level packaging - Abstract
This study is for fan-out wafer-level packaging with chip-first (die face-up) formation. Chips with Cu contact-pads on the front side and a die attach film on the backside are picked and placed face-up on a temporary-glass-wafer carrier with a thin layer of light-to-heat conversion material. It is followed by compression molding with an epoxy molding compound (EMC) and a post-mold cure on the reconstituted wafer carrier and then backgrinding the molded EMC to expose the Cu contact-pads of the chips. The next step is to build up the redistribution layers (RDLs) from the Cu contact-pads and then mount the solder balls. This is followed by the debonding of the carrier with a laser and then the dicing of the whole reconstituted wafer into individual packages. A 300-mm reconstituted wafer with a package/die ratio = 1.8 and a die-top EMC cap = 100 μm has also been fabricated (a total of 325 test packages on the reconstituted wafer). This test package has three RDLs; the line width/spacing of the first RDL is 5 μm/5 μm, of the second RDL is 10 μm/10 μm, and of the third RDL is 15 μm/15 μm. The dielectric layer of the RDLs is fabricated with a photosensitive polyimide and the conductor layer of the RDLs is fabricated by electrochemical Cu deposition (ECD).
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- 2017
25. Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging
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Kim Hwee Tan, Zhang Li, Sze Pei Lim, Koh Sau Wee, Thomas Taylor, Yu-Hua Chen, Dewen Tian, Cao Xi, Cheng-Ta Ko, Eric Kuah, Ji Hao, Yiu Ming Cheung, John H. Lau, Margie Li, Jiang Ran, Wu Kai, Henry Yang, Qingxiang Yong, Ming Li, Nelson Fan, Ning Cheng Lee, and Rozalia Beica
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010302 applied physics ,Engineering drawing ,Materials science ,Wafer-scale integration ,Fabrication ,Thermal resistance ,Compression molding ,02 engineering and technology ,Molding (process) ,Epoxy ,021001 nanoscience & nanotechnology ,Chip ,01 natural sciences ,Industrial and Manufacturing Engineering ,Electronic, Optical and Magnetic Materials ,visual_art ,0103 physical sciences ,visual_art.visual_art_medium ,Electrical and Electronic Engineering ,Composite material ,0210 nano-technology ,Wafer-level packaging - Abstract
In this paper, the warpage and thermal performances of fan-out wafer-level packaging (FOWLP) are investigated. Emphasis is placed on the characterization of the effects of FOWLP important parameters, such as chip size, chip thickness, package/chip area ratio, epoxy molding compound (EMC), chip EMC cap, reconstituted carrier material and thickness, and die-attach film, on the warpage after postmold cure and backgrinding of the EMC. The simulation results are compared to the experimental measurements. Also, the thermal performance (junction-to-ambient thermal resistance) of FOWLP with various chip thicknesses is characterized. Finally, some FOWLP important parameters affecting the warpage and thermal performances are recommended.
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- 2017
26. Characterizations of Fan-out Wafer-Level Packaging
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Wu Kai, Iris Xu, Jiang Ran, Henry Yang, Zhang Li, Sze Pei Lim, Nelson Fan, Rozalia Beica, Cao Xi, Kim Hwee Tan, Eric Kuah, Ken Cheung, Qingqian Li, Cheng-Ta Ko, John H. Lau, Dong Chen, and Ming Li
- Subjects
010302 applied physics ,Engineering drawing ,Fabrication ,Materials science ,business.industry ,020208 electrical & electronic engineering ,Compression molding ,02 engineering and technology ,01 natural sciences ,Grinding ,Die preparation ,0103 physical sciences ,Automotive Engineering ,0202 electrical engineering, electronic engineering, information engineering ,Optoelectronics ,Wafer testing ,Wafer ,business ,Lithography ,Wafer-level packaging - Abstract
The calling for smaller form factor, higher I/O density, higher performance and lower cost has made fan-out wafer level packaging (FOWLP) technology the trend. Good control of die position accuracy and molded wafer warpage are some of the keys to achieve high-yield production for FOWLP. In this study, 10mm×10mm test chips were fabricated and attached (chip-first and die face-up) onto 12 inch glass wafer carriers using die-attach-film (DAF). These reconfigured wafers were compression-molded with selected epoxy molding compounds (EMC). Cu bumps (contact-pads) were revealed by grinding, and redistribution layers (RDLs) were fabricated by lithography and electroplating process. The fan-out wafers were evaluated and characterized after each process step with main focus on the die-misplacement/die shift, re-configured wafer warpage, compression molding defects and RDL fabrication defects. The root causes of these defects were investigated and analyzed, while the possible solutions to overcome the defects were proposed and discussed.
- Published
- 2017
27. Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution-Layers (RDLs)
- Author
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John Lau, Ming Li, Nelson Fan, Eric Kuah, Zhang Li, Kim Hwee Tan, Tony Chen, Iris Xu, Margie Li, Y. M. Cheung, Wu Kai, Ji Hao, Rozalia Beica, Tom Taylor, CT Ko, Henry Yang, YH Chen, Sze Pei Lim, NC Lee, Jiang Ran, Koh Sau Wee, Qingxiang Yong, Cao Xi, Mian Tao, Jeffery Lo, and Ricky Lee
- Subjects
010302 applied physics ,020208 electrical & electronic engineering ,0103 physical sciences ,Automotive Engineering ,0202 electrical engineering, electronic engineering, information engineering ,02 engineering and technology ,01 natural sciences - Abstract
This study is for fan-out wafer-level packaging (FOWLP) with chip-first (die face-up) formation. The chips with Cu contact-pads on the front-side and a die attach film (DAF) on the backside are picked and placed face-up on a temporary glass wafer carrier with a thin layer of light-to-heat conversion (LTHC) material. It is followed by compression molding with epoxy molding compound (EMC) and post mold cure (PMC) on the reconstituted wafer carrier, and then backgrinding the molded EMC to expose the Cu contact-pads of the chips. The next step is to build up the redistribution layers (RDLs) from the Cu contact-pads and then mount the solder balls. Next comes the de-bonding of the carrier with a laser, and then the dicing of the whole reconstituted wafer into individual packages. A 300mm reconstituted wafer with a package/die ratio = 1.8 and a die-top EMC cap = 100μm has also been fabricated (a total of 325 test packages on the reconstituted wafer.) This test package has three RDLs; the line width/spacing of the first RDL is 5μm/5μm, of the second RDL is 10μm/10μm, and of the third RDL is 15μm/15μm. The dielectric layer of the RDLs is fabricated with a photosensitive polyimide (PI) and the conductor layer of the RDLs is fabricated by electrochemical Cu deposition (ECD).
- Published
- 2017
28. Coordinating self-healing control of bulk power transmission system based on a hierarchical top-down strategy
- Author
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Cao Xi, Vladimir Terzija, Hongtao Wang, Yutian Liu, and Rasoul Azizipanah-Abarghooee
- Subjects
Decision support system ,Engineering ,Operations research ,Process (engineering) ,020209 energy ,Distributed computing ,Blackout ,Energy Engineering and Power Technology ,02 engineering and technology ,Electric power system ,Coordination mechanism ,0202 electrical engineering, electronic engineering, information engineering ,medicine ,Electrical and Electronic Engineering ,Operations security ,Power transmission ,business.industry ,020208 electrical & electronic engineering ,Control reconfiguration ,Bi-level optimization ,Power system restoration ,medicine.symptom ,business ,Decision model - Abstract
Top-down power system restoration following a widespread blackout begins with energization of the backbone transmission network. All interconnected regions will be restored as a whole, which needs collaboration of multiple operators. The parallel control and integrated restoration planning issues have to be addressed. In order to conduct an efficient top-down restoration process and guarantee the operational security, a hierarchical coordination mechanism and an online decision support system-based self-healing approach are proposed. Considering the multiple decision-making problems involved, an associated bi-level optimization model is built, which integrates the planning problems of backbone reconfiguration, sub-transmission system restoration, and non-black-start units start-up. Then, a solution methodology is developed to provide online decisions based on the model. Simulation results of Shandong Power System in China show that the restoration performance is significantly improved using the proposed control approach. Additionally, the decision method is proved to be efficient enough for online applications.
- Published
- 2017
29. Output Far Field Characteristics of High Power Fiber Coupling Diode Lasers Based on Single Emitter Devices
- Author
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乔忠良 Qiao Zhong-liang, 许留洋 Xu Liu-yang, 曹曦文 Cao Xi-wen, 王宪涛 Wang Xian-tao, 高 欣 Gao Xin, 薄报学 Bo Bao-xue, and 夏晓宇 Xia Xiao-yu
- Subjects
Radiation ,Materials science ,business.industry ,Near and far field ,Condensed Matter Physics ,Laser ,Fiber coupling ,Electronic, Optical and Magnetic Materials ,law.invention ,Power (physics) ,law ,Optoelectronics ,business ,Diode ,Common emitter - Published
- 2017
30. Magnetic biochar combining adsorption and separation recycle for removal of chromium in aqueous solution
- Author
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Chen Jia-wei, Ouyang Xin, Cao Xi, and Han Yitong
- Subjects
Chromium ,Environmental Engineering ,Arachis ,Inorganic chemistry ,02 engineering and technology ,010501 environmental sciences ,Corncob ,Zea mays ,01 natural sciences ,symbols.namesake ,Adsorption ,Desorption ,Specific surface area ,Spectroscopy, Fourier Transform Infrared ,Biochar ,Recycling ,Biomass ,0105 earth and related environmental sciences ,Water Science and Technology ,Aqueous solution ,Chemistry ,Temperature ,Spectrometry, X-Ray Emission ,Langmuir adsorption model ,021001 nanoscience & nanotechnology ,Solutions ,Charcoal ,symbols ,0210 nano-technology ,Pyrolysis ,Water Pollutants, Chemical ,Nuclear chemistry - Abstract
Biochar has been developed in recent years for the removal of contaminants such as Cr (VI) in water. The enhancement of the adsorption capacity of biochar and its recyclable use are still challenges. In this study, magnetic biochar derived from corncobs and peanut hulls was synthesized under different pyrolysis temperatures after pretreating the biomass with a low concentration of 0.5 M FeCl3 solution. The morphology, specific surface area, saturation magnetization and Fourier transform infrared spectroscopy (FT-IR) spectra were characterized for biochar. The magnetic biochar performed well in combining adsorption and separation recycle for the removal of Cr (VI) in water. The Cr (VI) adsorbance of the biochar was increased with the increase in pyrolysis temperature, and the magnetic biochar derived from corncobs showed better performance for both magnetization and removal of Cr (VI) than that from peanut hulls. The Langmuir model was used for the isothermal adsorption and the maximum Cr (VI) adsorption capacity of corncob magnetic biochar pyrolyzed at 650 °C reached 61.97 mg/g. An alkaline solution (0.1 M NaOH) favored the desorption of Cr (VI) from the magnetic biochar, and the removal of Cr (VI) still remained around 77.6% after four cycles of adsorption-desorption. The results showed that corncob derived magnetic biochar is a potentially efficient and recoverable adsorbent for remediation of heavy metals in water.
- Published
- 2016
31. Feasibility Study of Fan-Out Panel-Level Packaging for Heterogeneous Integrations
- Author
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N. C. Lee, Jeffery C. C. Lo, Jhih-Yuan Pan, Mian Tao, John H. Lau, Sze Pei Lim, Ming Li, R. So, Tony Chen, Eric Ng, Ricky Lee, Hsing-Hui Wu, Marc Lin, Zhang Li, Yiu Ming Cheung, Henry Yang, Kim Hwee Tan, Penny Lo, Cheng-Ta Ko, Chieh-Lin Chang, Y. H. Chen, Cao Xi, Eric Kuah, Rozalia Beica, Curry Lin, Iris Xu, and Nelson Fan
- Subjects
010302 applied physics ,Materials science ,Fabrication ,020208 electrical & electronic engineering ,Mechanical engineering ,Fan-out ,02 engineering and technology ,Epoxy ,01 natural sciences ,Line width ,Printed circuit board ,visual_art ,0103 physical sciences ,0202 electrical engineering, electronic engineering, information engineering ,visual_art.visual_art_medium - Abstract
The design, materials, process, and fabrication of a heterogeneous integration of 4 chips by a FOPLP (fan-out panel-level packaging) with chip-first and dies face-down formation are investigated in this study. Emphasis is placed on the application of a new assembly process and materials for fabricating the RDLs (redistribution layers) of the FOPLP. The panel size is 508mm x 508mm. The epoxy molding compound (EMC) is a dry-film material and is molded by lamination method. The minimum metal line width and spacing is 10µm and they are fabricated by printed circuit board (PCB) method and equipment.
- Published
- 2019
32. Feasibility Study of Fan-Out Wafer-Level Packaging for Heterogeneous Integrations
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John Lau, Ming Li, Iris Xu, Tony Chen, Kim Hwee Tan, Zhang Li, Nelson Fan, Eric Kuah, Raymond So, Penny Lo, Y. M. Cheung, Cao Xi, Rozalia Beica, Sze Pei Lim, N.C. Lee, Cheng-Ta Ko, Henry Yang, Y.H. Chen, Mian Tao, Jeffery Lo, and Ricky Lee
- Published
- 2019
33. Identification of Time-varying in situ Signals in Quantum Circuits
- Author
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Cao, Xi, Liu, Yu-xi, and Wu, Rebing
- Subjects
Quantum Physics ,FOS: Physical sciences ,Quantum Physics (quant-ph) - Abstract
The identification of time-varying \textit{in situ} signals is crucial for characterizing the dynamics of quantum processes occurring in highly isolated environments. Under certain circumstances, they can be identified from time-resolved measurements via Ramsey interferometry experiments, but only with very special probe systems can the signals be explicitly read out, and a theoretical analysis is lacking on whether the measurement data are sufficient for unambiguous identification. In this paper, we formulate this problem as the invertibility of the underlying quantum input-output system, and derive the algebraic identifiability criterion and the algorithm for numerically identifying the signals. The criterion and algorithm can be applied to both closed and open quantum systems, and their effectiveness is demonstrated by numerical examples.
- Published
- 2019
- Full Text
- View/download PDF
34. Additional file 1: of Helicobacter pylori infection as a risk factor for serum bilirubin change and less favourable lipid profiles: a hospital-based health examination survey
- Author
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Zhao, Miao-Miao, Krebs, Jeremy, Cao, Xi, Cui, Jing, Chen, Dong-Ning, Li, Yu, Hua, Lin, Mann, Jim, and Jin-Kui Yang
- Subjects
cardiovascular diseases ,circulatory and respiratory physiology - Abstract
Table S1. Primary baseline characteristics classified by H. pylori infection. SBP, systolic blood pressure; DBP, diastolic blood pressure. Data are meanâ Âąâ SD; Student t-test. (DOCX 365 kb)
- Published
- 2019
- Full Text
- View/download PDF
35. Preparation and characterization of ternary composite films of polyvinyl alcohol/sodium alginate/TiO2
- Author
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Wu Haixia, Qi Lian, Xuefang Zheng, Meng Bin, and Cao Xi
- Subjects
Vinyl alcohol ,Chemistry ,General Chemical Engineering ,Composite number ,technology, industry, and agriculture ,02 engineering and technology ,General Chemistry ,010402 general chemistry ,021001 nanoscience & nanotechnology ,01 natural sciences ,Polyvinyl alcohol ,0104 chemical sciences ,chemistry.chemical_compound ,Membrane ,Chemical engineering ,Air permeability specific surface ,Ultimate tensile strength ,Titanium dioxide ,Organic chemistry ,0210 nano-technology ,Ternary operation - Abstract
Nano-TiO2 with anionic surface active agent sodium dodecylsulfate (SDS) modified, the poly(vinyl alcohol)/sodium alginate/TiO2 composite films were prepared by method of solution blending representing. The structure of the films was analyzed by XRD and SEM. In addition, air permeability rate, swelling ratio, light transmittance, mechanical properties, and antibacterial properties were tested. The results showed that in compound membrane there was a strong force between poly(vinyl alcohol)/sodium alginate and TiO2 particles, indicating that there was good compatibility between the sodium alginate and the poly(vinyl alcohol). The mixed membranes were of good water resistance, tensile strength, and closure. When the titanium dioxide content increased appropriately, they had very good mechanical properties. In addition, the antibacterial properties of composite membrane gradually increased with the increase in the TiO2content.
- Published
- 2016
36. Preparation and characterization of temperature response molecularly imprinted membrane with chitosan and methylmethacrylate
- Author
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Xu Zhice, Qi Lian, Xuefang Zheng, Wu Haixia, and Cao Xi
- Subjects
biology ,Scanning electron microscope ,General Chemical Engineering ,Infrared spectroscopy ,02 engineering and technology ,General Chemistry ,Permeation ,010402 general chemistry ,021001 nanoscience & nanotechnology ,01 natural sciences ,0104 chemical sciences ,Chitosan ,chemistry.chemical_compound ,Membrane ,chemistry ,Polymer chemistry ,biology.protein ,Bovine serum albumin ,Methyl methacrylate ,0210 nano-technology ,Molecular imprinting ,Nuclear chemistry - Abstract
In this study, a novel temperature controlled molecularly imprinted membrane (Temp-Ctrl-MIM) made of chitosan and methyl methacrylate was fabricated with bovine serum albumin (BSA) as template molecule. The film was characterized by infrared spectroscopy (IR), X-ray diffraction (XRD), scanning electron microscopy (SEM) and the permeation experiment. The results revealed that the porous structure of the film was as similar as the BSA. Moreover, the membrane had advanced molecular imprinting capability to BSA comparing to pepsin and casein at any temperature and the film demonstrated an excellent ability to identify specific template molecule (BSA) at the synthesis temperature comparing to other temperatures.
- Published
- 2016
37. RF Sulfur-plasma Passivation of GaAs(100) Surface
- Author
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袁绪泽 Yuan Xu-ze, 薄报学 Bo Bao-xue, 高 欣 Gao Xin, 许留洋 Xu Liu-yang, 曹曦文 Cao Xi-wen, 乔忠良 Qiao Zhong-liang, and 夏晓宇 Xia Xiao-yu
- Subjects
Radiation ,Materials science ,chemistry ,Passivation ,business.industry ,chemistry.chemical_element ,Optoelectronics ,Plasma ,Condensed Matter Physics ,business ,Sulfur ,Electronic, Optical and Magnetic Materials - Published
- 2016
38. Nitrogen-plasma Passivation of GaAs Semiconductor Surface
- Author
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夏晓宇 Xia Xiao-yu, 高 欣 Gao Xin, 薄报学 Bo Bao-xue, 乔忠良 Qiao Zhong-liang, 袁绪泽 Yuan Xu-ze, 许留洋 Xu Liu-yang, and 曹曦文 Cao Xi-wen
- Subjects
Surface (mathematics) ,Radiation ,Materials science ,Semiconductor ,Passivation ,business.industry ,Nitrogen plasma ,Optoelectronics ,Condensed Matter Physics ,business ,Electronic, Optical and Magnetic Materials - Published
- 2016
39. Type D personality negatively associated with self-care in Chinese heart failure patients
- Author
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Cao, Xi, Wang, Xiu-Hua, Wong, Eliza ML, Chow, Choi Kai, and Chair, Sek Ying
- Subjects
Symposium: Heart failure management for the elderly ,Heart failure ,Self-care ,Self-efficacy ,Type D personality - Abstract
Background Little is known about the association between type D personality and self-care behaviors in heart failure (HF) patients. We examined the effect of type D personality on self-care behaviors and self-efficacy among Chinese HF patients. Methods A cross-sectional study with a convenience sample was conducted. All participants completed the questionnaires of the self-care of HF index (V6) and type D personality scale. Demographic and clinical variables were obtained from medical records and patient interviews. The methods used for data analysis included descriptive analysis, independent-sample t-test, χ2 test, and multiple linear regression. Results A total of 127 HF patients were included and 61.4% of them were male. The average age for this study sample was 64.9 ± 12.34 years. The majority of the participants were in a New York Heart Association class III or IV (87%), and the average length of living with HF was 38.24 ± 41.1 months. A total of 33.1% of the participants were identified as having type D personality. No significant differences were determined in the demographic and clinical variables between type D and non-type D patients, except for the mean age and the length of living with HF. Type D patients were younger and had a shorter time of living with HF than their non-type D counterparts. Multiple regression demonstrated significant associations between type D personality and self-care maintenance and self-efficacy after adjusting the demographic and clinical factors. However, type D personality was not significantly associated with self-care management behaviors. Conclusions Type D personality was negatively related to self-care maintenance and self-efficacy in Chinese HF patients. Future study is warranted to develop a tailored intervention to improve engagement in self-care behaviors in HF patients with type D personality.
- Published
- 2016
40. New Small Shelly Fossils (Acanthocassis and Xinlispina Gen. Nov.) from the Fortunian Stage (Early Cambrian) in Southern China
- Author
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Li Yuan, Tang Hanhua, Zhang Yanan, HE Huahua, Zheng Panlin, Zhang Huaqiao, HU Jiaxi, Shao Tiequan, Liu Yunhuan, Wang Qi, Zhu Chengyu, and Cao Xi
- Subjects
Main branch ,Paleontology ,Sponge spicule ,Southern china ,Stage (stratigraphy) ,New materials ,Geology ,Ornaments - Abstract
We describe new material of three-dimensionally phosphatized small shelly fossils Acanthocassis and Xinlispina gen. nov. from the Fortunian Stage (early Cambrian) of southern Shaanxi and northern Sichuan Provinces. The new materials allow description of the delicate morphology of these skeletons, and also their skeletogenesis. Acanthocassis and Xinlispina have comparable morphological features: a main branch and radially arranged sub-branches. They differ from each other in many details, e.g., the presence of a single central branch only in Xinlispina, and the presence of small nodes only in Acanthocassis. Acanthocassis cannot be a naked anthopolyp or hydropolyp because of the more-or-less stiffened cuticle and the absence of a mouth. Acanthocassis and Xinlispina differ from coeval sponge spicules and chancelloriid sclerites and rosettes of crossed pedicellariae of echinoderms, and might be cuticular ornaments of animals of unclear affinities. They occur in the first small shelly fossil assemblage zone, and could be adopted as auxiliary fossils for biostratigraphic correlation in southern China.
- Published
- 2015
41. Fan-Out Wafer-Level Packaging for Heterogeneous Integration
- Author
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Cheng-Ta Ko, Qing Xiang Yong, Ming Li, Ricky Lee, Tony Chen, Jeffery C. C. Lo, Zhong Cheng, Nelson Fan, Yiu Ming Cheung, Wu Kai, Penny Lo, Ji Hao, Henry Yang, Eric Ng, Cao Xi, Iris Xu, Eric Kuah, Kim Hwee Tan, Mian Tao, Rozalia Beica, Margie Li Qingqian, Sze Pei Lim, Koh Sau Wee, Zhang Li, Yu-Hua Chen, John H. Lau, N. C. Lee, and Jiang Ran
- Subjects
010302 applied physics ,Materials science ,Fabrication ,Computer science ,Electromagnetic compatibility ,Fan-out ,Mechanical engineering ,Hardware_PERFORMANCEANDRELIABILITY ,Temperature cycling ,02 engineering and technology ,021001 nanoscience & nanotechnology ,01 natural sciences ,Drop test ,Industrial and Manufacturing Engineering ,Electronic, Optical and Magnetic Materials ,law.invention ,Capacitor ,law ,0103 physical sciences ,Hardware_INTEGRATEDCIRCUITS ,Electrical and Electronic Engineering ,0210 nano-technology ,Wafer-level packaging - Abstract
The design, materials, process, fabrication, and reliability of a heterogeneous integration of four chips and four capacitors by a fan-out wafer-level packaging (FOWLP) method are investigated in this paper. Emphasis is placed on the application of a new assembly process for fabricating the redistribution layers of the FOWLP. Reliability assessments, such as the thermal cycling and drop test, are also performed.
- Published
- 2018
42. Reliability of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Re-Distributed Layers
- Author
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Eric Ng, Rozalia Beica, Sze Pei Lim, Jeffery C. C. Lo, Zhong Cheng, Henry Yang, Koh Sau Wee, Qing Xiang Yong, Zhang Li, Ricky Lee, Lei Yang, Wu Kai, Cao Xi, Eric Kuah, Ming Li, Tony Chen, Margie Li, Ji Hao, Cheng-Ta Ko, John H. Lau, Kim Hwee Tan, Yiu Ming Cheung, Nelson Fan, Penny Lo, Y. H. Chen, Iris Xu, Mian Tao, N. C. Lee, and Jiang Ran
- Subjects
010302 applied physics ,Materials science ,Electric shock ,Electromagnetic compatibility ,Fan-out ,Failure rate ,02 engineering and technology ,021001 nanoscience & nanotechnology ,medicine.disease ,01 natural sciences ,Printed circuit board ,Soldering ,0103 physical sciences ,medicine ,Composite material ,0210 nano-technology ,Wafer-level packaging ,Weibull distribution - Abstract
In this study, the reliability (thermal-cycling and shock) performances of chip-first and die face-up FOWLP (fan-out wafer-level packaging) with a very large silicon chip (10mmx10mm) embedded in an epoxy molding compound (EMC) package (13.42mmx13.42mm) with three RDLs (redistribution layers) are experimentally determined. Emphasis is placed on the estimation of the Weibull life distribution, characteristic life, and failure rate of the solder joint and RDL of this package. The fan-out wafer-level package is assembled on a printed circuit board (PCB) with 908 (Sn3wt%Ag0.5wt%Cu) solder joints. It is a 6-layer PCB. The sample sizes for the thermal-cycling test and shock test are, respectively, equal to 60 and 24. The failure location and modes of the thermal-cycling test and shock test of the fan-out wafer-level package solder joints and RDLs are provided and discussed. 3-D nonlinear finite element models are constructed and analyzed for the fan-out package during thermal-cycling and shock conditions. The simulation results are correlated to the experimental results. Finally, recommendations on improving the FOWLP solder joints and RDLs under thermal and shock conditions are provided.
- Published
- 2018
43. Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Redistributed Layers
- Author
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Cao Xi, Eric Kuah, Lei Yang, Nelson Fan, Iris Xu, Wu Kai, Tony Chen, Sandy Chen, Janardhanan Pillai Madhukumar, John H. Lau, Kim Hwee Tan, Zhang Li, Cheng-Ta Ko, Rozalia Beica, Qing Xiang Yong, Ming Li, Margie Li, Sze Pei Lim, and Winsons Bao
- Subjects
010302 applied physics ,Surface-mount technology ,Materials science ,Fabrication ,Compression molding ,02 engineering and technology ,Epoxy ,Molding (process) ,021001 nanoscience & nanotechnology ,01 natural sciences ,Industrial and Manufacturing Engineering ,Die (integrated circuit) ,Electronic, Optical and Magnetic Materials ,visual_art ,0103 physical sciences ,visual_art.visual_art_medium ,Wafer dicing ,Electrical and Electronic Engineering ,Composite material ,0210 nano-technology ,Wafer-level packaging - Abstract
In this paper, the warpages of a chip-first and die face-up fan-out wafer-level packaging (FOWLP) with a very large silicon chip (10 mm $\times \,\, 10$ mm $\times \,\, 0.15$ mm) and three redistributed layers are measured and characterized. Emphasis is placed on the measurement and 3-D finite-element simulation of the warpages during the FOWLP fabrication processes, especially for: 1) right after postmold cure; 2) right after backgrinding of the epoxy molding compound to expose the Cu-contact pads; and 3) the individual package (right after the solder ball mounting and dicing) versus surface mount technology reflow temperatures. The simulation results are compared to the measurement results. Some recommendations on controlling the warpages are provided.
- Published
- 2018
44. Modification of an engineered Escherichia coli by a combined strategy of deleting branch pathway, fine-tuning xylose isomerase expression, and substituting decarboxylase to improve 1,2,4-butanetriol production
- Author
-
Xinyao Lu, Jing Peiyuan, Cao Xi, Bin Zhuge, and Hong Zong
- Subjects
0301 basic medicine ,Xylose isomerase ,Carboxy-Lyases ,Butanols ,Mutant ,Bioengineering ,Xylose ,medicine.disease_cause ,Applied Microbiology and Biotechnology ,03 medical and health sciences ,chemistry.chemical_compound ,Biosynthesis ,medicine ,Escherichia coli ,Biomass ,Aldose-Ketose Isomerases ,Organisms, Genetically Modified ,Gene Expression Regulation, Bacterial ,Molecular biology ,Keto Acids ,Antisense RNA ,Titer ,030104 developmental biology ,chemistry ,Metabolic Engineering ,1,2,4-Butanetriol ,Metabolic Networks and Pathways ,Biotechnology - Abstract
1,2,4-Butanetriol (BT) is an important precursor of energetic material 1,2,4-butanetriol trinitrate (BTTN) in military field. Here, the recombinant Escherichia coli was modified by multi-strategy to increase BT production. First, the 2-keto acid reduction pathway was blocked by double deleting the genes yiaE and ycdW, resulting in 19% and 41% increase of BT titer and yield, respectively. Further disruption of xylose branch pathway by deleting xylA gene led to a 24% increase of BT yield, but the biomass and BT titer were decreased by 63% and 55%, respectively. To balance the carbon flux for cell growth and BT biosynthesis, the expression of xylA gene was interfered by antisense RNA. The biomass and BT titers of all the mutants harboring asRNA were restored and the highest BT production was improved by 214 %. Finally, substitute expression of the high efficient decarboxylase KivD led to a 72% increase of BT titer (10.03 g/L), which is significantly higher than previously reported (5.1 g/L). This work provided some effective strategies for improving BT production by balancing the carbon flux redistribution and reducing power regeneration.
- Published
- 2018
45. Motivation as a Complex System: Semester-Long Recursive Dynamics of Expectancy-Value Constructs in Undergraduate Biology
- Author
-
Kaplan, Avi, Cao, Xi Hang, Dai, Ting, Obradovic, Zoran, Perez, Tony, Cromley, Jennifer, Mara, Kyle, and Balsai, Michael
- Published
- 2018
- Full Text
- View/download PDF
46. Learning to Calibrate Quantum Control Pulses by Iterative Deconvolution
- Author
-
Cao, Xi, Chu, Bing, Ding, Haijin, Sun, Luyan, Liu, Yu-xi, and Wu, Rebing
- Subjects
Quantum Physics ,ComputingMethodologies_IMAGEPROCESSINGANDCOMPUTERVISION ,FOS: Physical sciences ,Quantum Physics (quant-ph) - Abstract
In experimental control of quantum systems, the precision is often hindered by imperfect applied electronics that distort control pulses delivered to target quantum devices. To mitigate such error, the deconvolution method is commonly used for compensating the distortion via an identified convolutional model. However, its effectiveness is limited by model inaccuracies (e.g., imprecise parameters or unmodeled distortion dynamics). In this paper, we propose a learning-based scheme to eliminate the residual calibration error by repeatedly applying the deconvolution operations. The resulting iterative deconvolution method is shown to be able to correct both linear and nonlinear model errors to the highest precision allowed by available finite sampling rates. The calibration error induced by finite sampling rates is also analyzed, from which we propose that the inter-sampling error can be suppressed by actively introducing nonlinear components in the control electronics.
- Published
- 2018
- Full Text
- View/download PDF
47. Additional file 1: of Comparative safety and effectiveness of cholinesterase inhibitors and memantine for Alzheimerâ s disease: a network meta-analysis of 41 randomized controlled trials
- Author
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Kai-Xin Dou, Meng-Shan Tan, Tan, Chen-Chen, Cao, Xi-Peng, Hou, Xiao-He, Qi-Hao Guo, Tan, Lan, Mok, Vincent, and Jin-Tai Yu
- Abstract
Supplementary 1. Network meta-analysis model. Supplementary 2. References for included trials. Supplementary 3. Summary of included trials and patient characteristics. Supplementary 4. Risk of bias assessment. Supplementary 5. Results from pairwise meta-analysis for each outcome. Supplementary 6. Results from network meta-analysis for each outcome. Supplementary 7. Network plot for each outcome. Supplementary 8. Treatment ranking and rankograms for each outcome. Supplementary 9. Assessment of inconsistency results for each outcome. Supplementary 10. Comparison-adjusted funnel plot for each outcome from the network meta-analysis. Supplementary 11. Subgroup network meta-analysis for secondary outcomes. Supplementary 12. Sensitivity network meta-analysis for primary outcomes. Supplementary 13. Assessment of heterogeneity results for each outcome. (PDF 2427 kb)
- Published
- 2018
- Full Text
- View/download PDF
48. Additional file 1: of Genome-wide association study identifies two loci influencing plasma neurofilament light levels
- Author
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Jie-Qiong Li, Yuan, Xiang-Zhen, Li, Hai-Yan, Cao, Xi-Peng, Jin-Tai Yu, Tan, Lan, and Chen, Wei-An
- Abstract
Figure S1. Plasma neurofilament light for AD diagnosis. Receiver operating cuves of logistic regression model are controlled for age at baseline, gender, educational level and APOE Îľ4 genotype. (PDF 6 kb)
- Published
- 2018
- Full Text
- View/download PDF
49. Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging
- Author
-
John H. Lau, Sze Pei Lim, Koh Sau Wee, Kim Hwee Tan, Ming Li, Ji Hao, Zhang Li, Ken Cheung, Yu-Hua Chen, Ning Cheng Lee, Margie Li, Cao Xi, Eric Kuah, Rozalia Beica, Cheng-Ta Ko, Nelson Fan, Jiang Ran, Wu Kai, and Dewen Tian
- Subjects
010302 applied physics ,Materials science ,Thermal resistance ,Semiconductor device modeling ,Compression molding ,02 engineering and technology ,Epoxy ,Molding (process) ,021001 nanoscience & nanotechnology ,Chip ,01 natural sciences ,Stress (mechanics) ,visual_art ,0103 physical sciences ,visual_art.visual_art_medium ,Composite material ,0210 nano-technology ,Wafer-level packaging - Abstract
In this study, the warpage and thermal performances of fan-out wafer-level packaging (FOWLP) are investigated. Emphasis is placed on the characterization of the effects of FOWLP important parameters, such as chip size, chip thickness, package/chip area ratio, epoxy molding compound (EMC), chip EMC cap, carrier material and thickness, and die-attach film, on the warpage after post mold cure (PMC) and backgrinding of the EMC. The simulation results are compared with the experimental measurements. Also, the thermal performance (junction-to-ambient thermal resistance) of FOWLP with various chip thicknesses is characterized. Finally, some FOWLP important parameters affecting the warpage and thermal performances are recommended.
- Published
- 2017
50. Extrathyroidal Implantation of Thyroid Hyperplastic/neoplastic Cells after Endoscopic Thyroid Surgery
- Author
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Tao Hong, Wei Liu, Bing-lu Li, Cao Xi, and Xiequn Xu
- Subjects
Adult ,medicine.medical_specialty ,Hyperplasia ,medicine.diagnostic_test ,business.industry ,Thyroid ,Endoscopic surgery ,Endoscopy ,Tumor cells ,General Medicine ,Surgery ,Young Adult ,medicine.anatomical_structure ,Endoscopic thyroidectomy ,medicine ,Humans ,Female ,Thyroid Neoplasms ,Young adult ,Complication ,business ,Subcutaneous tissue - Abstract
Objective To report a case of the implantation of thyroid hyperplastic or neoplastic tissue after endoscopic thyroidectomy and discuss this complication in aspects of prevalence, pathogenesis, protection, and therapies. Methods A systematic search of literature from the PubMed database was conducted for identifying eligible studies on implantation of thyroid hyperplastic or neoplastic cells after endoscopic thyroid surgery. Results Overall, 5 reported cases on patients suffering from endoscopic thyroid surgery with implantation of thyroid hyperplastic or neoplastic cells were included in the systematic review. Conclusions Unskilled surgeons, rough intraoperative surgical treatment, scarification or rupture of tumor, contamination of instruments, chimney effect, aerosolization of tumor cells may be associated with the implantation after endoscopic thyroidectomy. To minimize the risk of such complication, we should be more meticulous and strict the endoscopic surgery indications.
- Published
- 2014
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