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Far-ultraviolet (UV) light sources have attracted much attention for human safe viral inactivation and bacterial disinfection. Due to large optical nonlinearity and transparency to this wavelength region, second harmonic generation (SHG) device made of AlN can be a promising candidate. In this study, a transverse quasi-phase matched AlN channel waveguide with vertical polarity inversion was designed and fabricated. From wavelength spectra and a pump power dependence of an SH intensity, far-UV SHG via a largest nonlinear optical tensor component d 3333 was successfully confirmed under ultrashort pulse laser excitation.

InGaN epitaxial layers were grown on c-plane sapphire substrates using the metalorganic vapour phase epitaxy (MOVPE) system at 760 °C. By varying the total flow rate of group-III sources (TMI+TEG) with a fixed molar ratio of group-III sources [TMI/(TMI+TEG)], the influence of V/III ratio were investigated from 4500 to 20000. The grown N-polar InGaN layers were investigated by atomic force microscopy and it is found that the surface roughness decreases with increasing the V/III ratios. High resolution X-ray diffraction analyses show that the phase separation decreases with increasing the V/III ratios. Photoluminescence measurements reveal that the peak position of the band-edge emission shifted toward the shorter wavelength with increasing the V/III ratios. Reciprocal space mapping (RSM) analyses were carried out on InGaN films. At low V/III ratio, the phase separation can be detected in InGaN films.

The strain relaxation of sputter-deposited AlN (sp-AlN) films on c-plane sapphire substrates before and after face-to-face annealing (FFA) was evaluated. After FFA, the AlN films consisted of a layer with compressive strain and an extremely low dislocation density, which was ascribed to solid-state growth during FFA. In addition, the crystallinity was further improved after the homoepitaxial growth of AlN by metal-organic vapor phase expitaxy (MOVPE). The full widths at half maximum of the X-ray rocking curves of AlN (0 0 0 2) and (1 0 −1 2) for the MOVPE-grown AlN layer on the FFA-sp-AlN film were 15 and 240 arcsec, respectively. The surface morphology of the MOVPE-grown AlN layer on the FFA-sp-AlN film was covered with an atomically flat step-and-terrace structure. The compressive strain of the MOVPE-grown AlN layer was inherited from the underlying FFA-sp-AlN film.

Post-growth high-temperature annealing of sputtered AlN films is a promising approach to realize high-quality AlN templates for deep-ultraviolet light-emitting diode applications. This paper proposes the double-sided sputtering of AlN on double-sided polished sapphire to suppress the wafer bowing caused by high-temperature annealing. Similar to the case of single-sided sputtering, the twist component of the X-ray rocking curve was markedly improved after annealing, yielding rocking curve widths of 256–321 arcsec in (10–12). By varying the backside thickness, the curvature was controlled from −27 km−1 to 29 km−1, while a crack-free surface was maintained on the front side of AlN. The experimentally obtained curvature and in-plane stress agreed well with the calculation based on thermal stress analysis in the multilayer system.

Thin films of AlN, AlGaN, and AlGaN-based device structures of approximately 1 cm2 formed on a sapphire substrate were successfully exfoliated from the substrate by immersion in heated (115 °C) and pressurized (170 kPa) water. These thin films were crystalline, grown on periodically formed AlN nanopillars. The water was permeated through intentional voids formed in the AlGaN or AlN crystalline layers by using periodic AlN nanopillars. The exfoliated AlGaN exhibited clear X-ray diffraction peaks from its (0002) plane diffraction. Transmission electron microscopy (TEM) confirmed that exfoliation introduced few additional dislocations and that the device structure was maintained.

Face-to-face annealed sputter-deposited aluminum nitride (AlN) templates (FFA Sp-AlN) are a promising material for application in deep-ultraviolet light-emitting diodes (DUV-LEDs), whose performance is directly related to the crystallinity of the AlN film. However, the influence of the sputtering conditions and annealing on the crystallinity of AlN films have not yet been comprehensively studied. Accordingly, in this study, we fabricate AlN films on sapphire substrates through sputtering deposition followed by face-to-face high-temperature annealing, and investigate the influence of the sputtering conditions, such as the sputtering gas species and chamber pressure, on the crystallinity of the AlN films before and after annealing. The results revealed that reducing the amount of Ar in the sputtering gas significantly enhances the c-axis oriented growth during the initial stages of sputtering deposition and mitigates the tilt disorder of the layer deposited on the initial layer, resulting in low threading dislocation densities (TDDs) in the annealed AlN films. Decreasing the chamber pressure also effectively improves the crystallinity of the annealed AlN films. Thus, although high-temperature annealing can reduce the TDDs in AlN films, the properties of the as-sputtered AlN films have a significant effect on the crystallinity of FFA Sp-AlN films.

For the realization of highly efficient deep-ultraviolet light-emitting diodes (DUV-LEDs) based on III-nitride semiconductors, it is essential to improve the crystalline quality of the AlN templates for crystal growth of AlGaN. Our group has suggested sputtering deposition and post-deposition high-temperature face-to-face annealing (FFA) as a fabrication method of AlN films with low threading dislocation density (TDD) on sapphire substrates. Although the FFA enables reduction of TDDs, it possibly causes a cracking for AlN films due to a large thermal expansion coefficient mismatch between AlN and sapphire. In this work, we controlled the residual stress in AlN films by modifying the sputtering conditions. Consequently, we achieved crack-free AlN films with low TDDs.

A combination of the sputtering deposition and high-temperature annealing is a promising technique for preparing low-dislocation-density AlN templates. In this talk, MOVPE growth behavior of AlGaN films grown on the annealed AlN templates and on conventional MOVPE-grown AlN templates was comprehensively discussed. The low density of screw- and mixed-type dislocations of the annealed AlN templates invoked the formation of hillock structures. By adjusting the MOVPE growth conditions and utilizing sapphire substrates with appropriate surface off-cut, dislocation-induced hillock structures were suppressed. Improved surface flatness resulted in higher EQE and better wavelength uniformity of the DUV-LED fabricated on the annealed AlN templates.

High-quality AlN templates fabricated by sputtering-deposition and post-deposition high-temperature annealing have great potential for deep ultraviolet light-emitting device applications. In this work, we fabricated AlN films on 6H-SiC substrates by sputtering and face-to-face annealing and characterized the structural quality of the AlN films before and after annealing. As reported in previous studies, to accomplish high-quality AlN films on SiC substrates using conventional methods, such as molecular beam epitaxy or metalorganic vapor phase epitaxy (MOVPE), it is important to grow the AlN on the SiC coherently. However, in this work, although the annealed AlN films were fully relaxed from the SiC substrates, or even had tensile strain, the AlN films indicated high crystallinity. The X-ray rocking curve full width at half maximum (XRC-FWHM) values of the 200-nm-thick annealed AlN film were 17 and 246 arcsec for the AlN (0002) and (10–12) diffraction, respectively. Though the annealed AlN film indicated rough surfaces with bunched step structures, the surface morphology was remarkably improved by MOVPE growth and clear atomic step-and-terrace structures were formed. The XRC-FWHM values of the MOVPE-grown AlN were 90 and 239 arcsec for the AlN (0002) and (10–12) diffraction, respectively.

Regarding deep-ultraviolet optical device applications, face-to-face annealed sputter-deposited AlN (FFA Sp-AlN) is a promising alternative to the conventional metalorganic vapor phase epitaxy (MOVPE)-prepared AlN templates on sapphire substrates. However, FFA Sp-AlN tends to exhibit AlGaN growth-related hillock generation and surface morphology deterioration. In this study, we optimized the sputter-deposition conditions for AlN and MOVPE growth conditions for AlGaN to respectively reduce hillock density and size. After confirming AlGaN surface-flattening, we fabricated 263 nm wavelength UV-C LEDs on the FFA Sp-AlN and achieved maximum external quantum efficiencies of approximately 4.9% and 8.0% without and with silicone encapsulation, respectively.

The centimeter-scale laser lift-off (LLO) of a UVB laser diode structure on nano-patterned AlN was demonstrated by using a 257 nm pulsed laser. The mechanism of this LLO, which can be used for vertical light-emitting device fabrications, was analyzed in detail from the structural and optical properties. The large-area high-yield LLO without cracks was found to be enabled by taking advantage of the intentional in-plane periodic and nanometer-scale inhomogeneous distribution of the AlN molar fraction in the AlGaN layer introduced by growing AlGaN on nano-patterned AlN.

We investigated influences of mask pattern on the emission from InGaN multiple quantum wells through the differences in plane orientation appearing on the multifaceted islands in selective area metalorganic vapor phase epitaxy. Cathodoluminescence mapping confirmed that emission colors changed depending on the crystal plane. Photoluminescence spectroscopy showed that the emission wavelength red-shifted by increasing the mask width. By combining the difference of indium incorporation efficiency depending on the crystal plane and the lateral vapor phase diffusion effect, multiple quantum wells with different emission wavelengths of up to 106 nm were grown simultaneously in the microscale region.

N-polar face-to-face annealed sputtered AlN (FFA Sp-AlN) was fabricated by sputtering with an Al metal target and high-temperature annealing in a face-to-face configuration. The polarities of the FFA Sp-AlN samples fabricated with different sputtering targets (i.e., Al metal or sintered AlN targets) were checked by KOH etching and cross-sectional scanning transmission electron microscope images. As a result, samples sputtered with a sintered AlN target and an Al metal target resulted in Al-polar and N-polar FFA Sp-AlN, respectively. Then, we fabricated FFA Sp-AlN with N-polar AlN on the top-most layers (N-polar FFA Sp-AlN) with different total film thicknesses. The threading dislocation densities (TDDs) of N-polar FFA Sp-AlN were estimated from the full width at half maximum values of the X-ray rocking curves. Consequently, the TDD of N-polar FFA Sp-AlN decreased with increasing AlN film thickness, which was the same trend as that of Al-polar FFA Sp-AlN. The minimum TDD of 1.7 × 108 cm−2 was obtained from N-polar FFA Sp-AlN with a total thickness of 730 nm.

A supercritical ethanol (scEtOH) environment, in which sulfur is highly soluble, can lead to safety improvements and cost reductions in the sulfurization process. In this study, the feasibility of the sulfurization process in scEtOH for the preparation of Cu2ZnSnS4 (CZTS) thin films at low temperature was verified with the purpose of creating a sustainable and cost-effective process for fabricating metal-sulfide solar cells. We found that to promote atomic diffusion of sulfur and achieve sulfurization at a low temperature, the presence of defects in the amorphous oxide thin film was preferable. Moreover, in thin film fabricated by sulfurization under ethanol, the crystal size was strongly affected by ethanol density. The grain size increased up to about 1 μm as the ethanol density increased, and grain growth was remarkable, particularly in the high-density conditions of over 3.0 mol/L. Finally, we fabricated a crystalline CZTS thin film, which exhibited structural and optical properties comparable to those of a film fabricated using conventional vapor-phase sulfurization. For the prepared disordered-kesterite CZTS thin film with a Cu-poor and Zn-rich composition, photoluminescence measurements confirmed that the donor or acceptor defects engage in the emission of about 1.24 eV at 5 K, and UV–Vis measurement revealed a bandgap of 1.38 eV at room temperature.

c-plane sapphire (c-Sap) is most popular substrate for polar (Al, Ga)N growth, where it is known that the m-axes of sapphire and (Al, Ga)N are rotated by 30° to minimize lattice mismatch. On the other hand, it has been reported that the m-axes of sapphire and nitrides can be parallel with each other when grown on an a-plane sapphire. This epitaxial relation is beneficial for the laser cavity formation by cleavage. In this work, we demonstrated c-plane AlN/a-plane sapphire (c-AlN/a-Sap) templates by means of sputtering and high-temperature annealing [4]. X-ray diffraction (XRD) measurements revealed the epitaxial relation of a-Sap [1–100] //c-AlN [1–100] as expected from previous works. As the film thickness increased, the rocking curve width of (10–12) XRD improved, and 214 arcsec was obtained at the crack-free film thickness of 300 nm. These characteristics are attractive as an AlN template applicable for AlGaN-based DUV optical devices.

Diamond is an attractive widegap semiconductor for power devices due to the bandgap of 5.5 eV and high hole conductivity. Quantum sensing by nitrogen-vacancy (NV) centers has also been focused on in recent years. On the other hand, (Al, Ga)N has been extensively studied for deep ultraviolet LEDs and high electron mobility transistors, whereas the poor p-type conductance limits the performance of bipolar devices. Hence, the heterogeneous integration of diamond and (Al, Ga)N is expected to realize efficient carrier injection into widegap bipolar devices.

High-temperature annealing of sputtered AlN (Sp-AlN) using a face-to-face configuration is a novel technique that has attracted considerable attention because it can reduce the threading dislocation density of Sp-AlN to 107 cm−2. However, drawbacks such as cracking, residual stress, and wafer curvature remain because of a high annealing temperature of 1700 °C. We previously developed a thermal strain analysis model that uses an elastic multilayer system to describe the elastic behavior of Sp-AlN on sapphire under high-temperature annealing. In this study, we expand this model to consider in-plane anisotropy. By performing thermal strain analysis of the curvature, strain, stress, and strain energy of c-plane AlN grown on c- and a-plane sapphire, our calculation successfully approximates the experimental results, even for an in-plane anisotropic structure. The proposed model is, therefore, useful for quantitative evaluation of the residual strain and can contribute to strain engineering of AlGaN-based deep-ultraviolet light-emitting diodes.

The metalorganic vapor phase epitaxial (MOVPE) growth of AlN films was performed on face-to-face annealed sputtered AlN templates (FFA Sp-AlN) having a nano-striped pattern with a period of 300 nm and depth of 120 nm. Then, the effect of MOVPE growth conditions on the crystallinity was elucidated. The faceted structure clearly changed with the growth temperature (Tg), following the same trend as the epitaxial lateral overgrowth of GaN film on micro-patterned GaN. High Tg levels enhanced the lateral growth, and thus with a high Tg of 1300 °C, the coalescence in the early growth stage resulted in AlN films with coalesced surfaces and a thickness of 1 µm. For the AlN film grown at a Tg of 1300 °C, the threading dislocation density (TDD) was estimated to be 6.0 × 108 cm−2. This value proved that coalesced AlN films on nano-patterned FFA Sp-AlN templates with low TDDs could be achieved with the appropriate MOVPE growth conditions. The compressive strain in the AlN film on nano-patterned FFA Sp-AlN was lower than that of the film grown on FFA Sp-AlN without a pattern.

Misaligned crystallite growth is found on the sidewalls of dome-shaped patterns which hinders the coalescence of the c-plane AlN layer growing on the c-axis-oriented sapphire plane. In this study, thick AlN layers without cracks were grown by hydride vapor-phase epitaxy on micro-scale patterned sapphire substrates using annealed sputter-deposited AlN with a thickness of 200 nm. It was observed that undesired misaligned AlN growth can be prevented by selecting an appropriate growth temperature. A two-step approach was used to promote the lateral growth and coalescence of AlN. A relatively smooth surface without discontinuities and holes was obtained. The influence of the multi-oriented sapphire facets provided by micro-scale patterned sapphire substrates was investigated. According to the geometry of the misaligned crystallites, the grown AlN deviating from the c-axis on the near sapphire r-plane sidewalls has less influence on the coalescence of AlN, compared to the near n-plane sidewalls.

Face-to-face annealed metalorganic vapor phase epitaxy (MOVPE)- grown AlN templates with sputtered AlN nucleation layers (FFA MOSp-AlN templates) were fabricated on vicinal sapphire substrates. The sputtered thin AlN layer supplies AlN seeds that are well aligned to the c-axis. The MOVPE growth with a relatively thick AlN enlarges crystal grains with a low concentration of impurities. Face-to-face annealing at high temperatures reduces the twist component of AlN films due to recrystallization, and AlN films with low threading dislocation densities are formed. The full width at half maximum (FWHM) of the (10-12) X-ray rocking curves (XRCs) of AlN templates decreased as the thickness of the MOVPE-grown AlN layer increased. The FWHMs for the (0002) and (10-12) XRCs of the 300-nm-thick AlN templates with an off-cut angle of 0.6° were 10 and 337 arcsec, respectively. The concentrations of O, Si, and C impurities in the FFA MOSp-AlN templates were lower than those in the face-to-face annealed sputtered AlN templates. Si doped Al0.7Ga0.3N films, which are typically used as n-type AlGaN layers for UVC LEDs, were grown on the FFA MOSp-AlN templates with various off-cut angles. The AlGaN films with smooth flat surfaces were obtained using the FFA MOSp-AlN template with larger off-cut angles due to the suppression of the large hillock formation

Vacancy-type defects in AlN films were probed by using monoenergetic positron beams. The AlN films were deposited on sapphire substrates by using a radio-frequency sputtering technique. Epitaxial films grown by metalorganic vapor phase epitaxy on the sputtered AlN films were also characterized. For the sputtered AlN, the major defect species was identified to be complexes between Al-vacancy and oxygen atoms located at nitrogen sites. Vacancy clusters were introduced after annealing at 1300 °C in the N2 atmosphere but their concentration decreased with a higher annealing temperature. The vacancy–oxygen complexes, however, still existed in the AlN film after annealing at 1700 °C. For the AlN epitaxial films, the concentration of vacancy clusters increased as the growth temperature increased up to 1300 °C but it decreased with the post-growth annealing at 1700 °C.

AlGaN films were grown on face-to-face annealed sputter-deposited AlN/sapphire (FFA Sp-AlN) templates via metalorganic vapor phase epitaxy (MOVPE), and the growth behavior of the AlGaN films was investigated. The sapphire substrates with small off-cut exhibited poor surface flatness of AlGaN grown on the FFA Sp-AlN templates owing to the formation of large hillock structures. To understand the origin of these hillock structures, the crystallinity and surface morphology of conventional fully MOVPE-grown AlN/sapphire (MOVPE-AlN) templates and the FFA Sp-AlN template were comprehensively studied. The screw- and mixed-type threading dislocation density of the FFA Sp-AlN template was estimated to be approximately 1.8 × 106 cm−2, which was two orders of magnitude lower than that of the MOVPE-AlN template. Consequently, the uniquely observed growth of the hillock structures in the FFA Sp-AlN templates was attributed to their low density of screw- and mixed-type threading dislocations. The large surface off-cut sapphire substrates suppressed the hillock structures on the FFA Sp-AlN templates. The improvement in surface flatness resulted in better optical properties of multiple quantum wells grown on the AlGaN layer. These results demonstrate a promising method for achieving highly efficient and cost effective AlGaN based deep ultraviolet light-emitting diodes.

AlN films with low-dislocation density and flat surfaces were grown by metalorganic vapor phase epitaxy (MOVPE) on nano-patterned sapphire substrates (NPSSs) with face-to-face annealed sputtered AlN (FFA Sp-AlN) as an initial layer. Dislocation annihilation mechanisms and coalescences of AlN layers were studied by transmission electron microscopy (TEM), atomic force microscopy (AFM) and X-ray rocking curve (XRC) measurements. From cross-sectional TEM images, the coalescence thickness was obtained to be 1.2 µm. This thickness is thinner than that for MOVPE-grown AlN films on NPSS without FFA Sp-AlN. AFM images revealed that atomically flat surfaces can be obtained from the samples with thicknesses above 3 μm. From XRC full width at half maximum values, the screw- and edge-dislocation densities of the 5-μm-thick AlN film on FFA Sp-AlN/NPSS were calculated to be 4 × 107 cm−2 and 6 × 108 cm−2, respectively. This edge-dislocation density, i.e., the dominant threading dislocation density, is approximately the same to that of AlN films grown on FFA Sp-AlN/flat-sapphire substrates (FSSs). These results show promise that FFA Sp-AlN is applicable not only for FSSs but also for NPSSs as the method for growing high-crystalline-quality AlN film.

In-composition of N-polar InGaN films on the sapphire substrate with the surface nitridation was investigated. By varying the ratio of the group-III source flow rate from 0.7 to 0.95, the In-composition and the surface morphologies of InGaN films were changed. The In-composition of N-polar InGaN films was affected by the strain relaxation and the surface morphologies.

The impact of a face-to-face annealed sputtered AlN/sapphire (FFA Sp-AlN) template with threading-dislocation densities (TDDs) of 2 × 108 cm−2 and an n-type AlGaN (n-AlGaN) underlayer on optical properties of AlGaN multiple quantum wells (MQWs) with an ultraviolet C (UVC) emission is investigated comprehensively. For comparison of the FFA Sp-AlN template with low TDDs, a conventional MOVPE (metalorganic vapor phase epitaxially)-grown AlN/sapphire (MOVPE-AlN) template with TDDs of 1 × 109 cm−2 was prepared. Consequently, cathodoluminescence (CL), temperature-dependent photoluminescence (PL), and time-resolved PL (TR-PL) measurements verified that both the FFA Sp-AlN template and n-AlGaN underlayer are indispensable for obtaining MQWs with high internal quantum efficiencies, which decrease the TDDs and point defect (PD) densities. Our results revealed that 10-period quantum wells (10QWs)/n-AlGaN/AlN grown on the FFA Sp-AlN template exhibit a lower dark spot density in CL panchromatic intensity maps, a higher integrated emission intensity ratio from the temperature-dependent PL (from 15 to 300 K), and a longer nonradiative lifetime from the TR-PL measurements at 300 K compared with those grown on the MOVPE-AlN template. Moreover, we found that the optical properties of 10QWs/AlN in FFA Sp-AlN and MOVPE-AlN templates do not exhibit a significant difference because of the existence of numerous PDs. Our experimental results demonstrate the favorable impact of the FFA Sp-AlN template for low-TDDs and the n-AlGaN underlayer for low-PDs, which holds promise for highly efficient AlGaN deep-ultraviolet light-emitting devices.

Combination of sputter deposition and high-temperature annealing is a promising technique for preparing AlN templates with a low threading dislocation density (TDD) at a lower film thickness compared to those prepared by the conventional metalorganic vapor phase epitaxy. However, cracking of AlN films during annealing is a critical issue. In this study, we controlled the residual stress of the sputter-deposited AlN films by modifying the sputtering conditions. Consequently, the occurrence of cracking was effectively suppressed. By optimizing the fabricating conditions, a TDD of 2.07 × 108 cm−2 was achieved for the AlN template with a thickness of 480 nm.

A crack-free aluminum nitride (AlN) layer of 9 ± 1 μm thickness was grown on a nanopatterned sapphire substrate (NPSS) with a sputter-deposited AlN buffer layer. The buffer layer was thermally annealed and AlN was regrown by hydride vapor-phase epitaxy (HVPE). The dependence of the crystallinity of HVPE-grown AlN layers on the growth temperature was investigated. It was found that undesired misaligned AlN growth can be prevented by choosing an appropriate growth temperature. The full widths at half maximum of the (0002)- and (10–12)-plane X-ray rocking curves were improved to as low as 102 and 219 arcsec, respectively, by applying an NPSS with a sputter-deposited annealed AlN film. Compared with substrates without nanopatterning, the NPSS was also effective for suppressing cracks owing to the formation of voids at the interface of the HVPE-grown AlN layer and NPSS template.

InGaN films on nitride-sapphire substrates were grown by metalorganic vapor phase epitaxy. Reciprocal space mappings of X-ray diffraction around the asymmetric plane were used to measure the accurate indium composition and in-plane strain of InGaN films. InGaN films with nitridation of sapphire substrates shows higher indium incorporation than without nitridation samples at low molar fraction ratio, TMIn/(TMIn+TEGa), of group-III MO source. However, the high molar fraction ratio region shows relatively low indium composition of InGaN. Most of the InGaN on nitrided sapphire substrates showed narrow FWHM of 2θ –ω and X-ray rocking curves and the surface flatness is improved, which indicates the improvement of crystal quality. (© 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim)

The smooth surface of an N-polar GaN/Al x Ga 1−x N/GaN heterostructure was successfully grown by metalorganic vapor phase epitaxy (MOVPE) on sapphire substrates with a small off-cut angle of 0.8° toward the a-plane. The 2DEG of an N-polar GaN/Al x Ga 1−x N/GaN heterostructure has been confirmed by Hall-effect measurement from 17 to 300 K. The sheet carrier concentration and the 2DEG mobility of this heterostructure were measured to be 1.4 × 1013 cm−2 and 1250 cm2/Vs at room temperature, respectively. The mobility monotonically increased with decreasing temperature and saturated at a value of 3050 cm2/Vs at 17 K. These values obtained in the primitive experimental show the potential of an N-polar GaN HEMT.

Quantum dot optoelectronic devices are very attractive for their low power consumption, temperature stability, and high-speed modulation. We developed a defect-less, top-down fabrication process for sub-12-nm diameter InGaN quantum nanodisks (NDs) embedded in GaN barrier by using a combination of a bio-template and neutral beam etching. We have achieved high density of 2.6 × 1011 cm−2 with 6-nm in diameter and 15-nm-high nanopillars.

The internal electric fields in III-polar (0001), N-polar , and semipolar InGaN/GaN light-emitting diodes were investigated by electroreflectance (ER) spectroscopy. The ER spectra reflected the difference in the direction and strength of internal electric fields. Phase analyses of the ER signal revealed that only III-polar InGaN wells have the opposite direction of the internal electric field at zero bias voltage; this finding is in good agreement with the results of numerical analyses. Quantitative analyses of internal electric fields were conducted by the linewidth analyses of ER spectra. Our experimental results indicate that the absolute value of internal electric fields can be measured from ER spectra.

In this work, we demonstrate homogeneously distributed In0.3Ga0.7N/GaN quantum disks (QDs), with an average diameter below 10 nm and a high density of 2.1 × 10(11) cm(-2), embedded in 20 nm tall nanopillars. The scalable top-down fabrication process involves the use of self-assembled ferritin bio-templates as the etch mask, spin coated on top of a strained In0.3Ga0.7N/GaN single quantum well (SQW) structure, followed by a neutral beam etch (NBE) method. The small dimensions of the iron cores inside ferritin and nearly damage-free process enabled by the NBE jointly contribute to the observation of photoluminescence (PL) from strain-relaxed In0.3Ga0.7N/GaN QDs at 6 K. The large blueshift of the peak wavelength by over 70 nm manifests a strong reduction of the quantum-confined Stark effect (QCSE) within the QD structure, which also agrees well with the theoretical prediction using a 3D Schrödinger equation solver. The current results hence pave the way towards the realization of large-scale III-N quantum structures using the combination of bio-templates and NBE, which is vital for the development of next-generation lighting and communication devices.

To improve the homogeneity of the N-polar (−c-plane) InGaN/GaN multiple quantum wells (MQWs) grown by metalorganic vapor phase epitaxy (MOVPE), the growth of GaN and MQW on two c-plane sapphire substrates with an off-cut angle of 0.8° toward the a-plane (sub-A) and the m-plane (sub-M) was performed. The effects of the off-cut direction on the structural properties and surface morphologies of −c-plane GaN films were elucidated. It was found that the step bunching and meandering of −c-plane GaN were significantly suppressed on sub-A. The spatial homogeneity of the −c-plane InGaN/GaN MQWs along the off-cut direction was observed in the submicrometer scale using microbeam X-ray diffraction. By inhibiting the step bunching of the GaN template using sub-A, the thickness homogeneity of the MQWs on sub-A has been significantly improved in comparison with that on sub-M.

We report on the polarity control of GaN regrown on pulsed-laser-deposition-grown N-polar AlN on a metalorganic-vapor-phase-epitaxy-grown Ga-polar GaN template. The polarity of the regrown GaN, which was confirmed using aqueous KOH solutions, can be inverted from that of AlN by inserting a low-temperature GaN (LT-GaN) buffer layer. We hypothetically ascribe the Ga-polarity selection of GaN on the LT-GaN buffer layer to the mixed polarity of LT-GaN grains and higher growth rate of the Ga-polar grain, which covers up the N-polar grain during the initial stage of the high-temperature growth. The X-ray rocking curve analysis revealed that the edge-dislocation density in the N-polar regrown GaN is 5 to 8 times smaller than that in the Ga-polar regrown GaN. N-polar GaN grows directly on N-polar AlN at higher temperatures. Therefore, nucleus islands grow larger than those of LT-GaN and the area fraction of coalescence boundaries between islands, where edge dislocations emerge, becomes smaller.

The effects of growth conditions such as Mg/Ga and V/III ratios on the properties of N-polar p-type GaN grown by metalorganic vapor phase epitaxy were studied. Photoluminescence spectra from Mg-doped GaN depended on Mg/Ga and V/III ratios. For the lightly doped samples, the band-to-acceptor emission was observed at 3.3 eV and its relative intensity decreased with increasing V/III ratio. For the heavily doped samples, the donor–acceptor pair emission was observed at 2.8 eV and its peak intensity monotonically decreased with V/III ratio. The hole concentration was maximum for the Mg/Ga ratio. This is the same tendency as in group-III polar (0001) growth. The V/III ratio also reduced the hole concentration. The higher V/III ratio reduced the concentration of residual donors such as oxygen by substituting nitrogen atoms. The surface became rougher with increasing V/III ratio and the hillock density increased.

N-polar (−c-plane) InGaN/GaN light-emitting diodes (LEDs) were grown by metalorganic vapor phase epitaxy, and their optoelectronic properties were evaluated by electroreflectance (ER) and electroluminescence (EL) measurements. In −c-plane LEDs, the emission energy was much lower than that in c-plane LEDs. By comparing EL and ER results, we found that the emission energy was also much lower than the transition energy. The transition energy is in good agreement with X-ray diffraction analysis results. These results indicate that −c-plane LEDs exhibit a larger Stokes-like shift than do c-plane LEDs. This Stokes-like shift is due to the strong potential fluctuation, which is possibly caused by the specific growth patterns of −c-plane III–nitrides. The dominant emission centers of the −c-plane LEDs were suggested to be the localized states of InGaN islands.

The metastable zincblende (ZB) phase in N-polar (0001¯) (−c-plane) InGaN/GaN multiple quantum wells (MQWs) grown by metalorganic vapor phase epitaxy is elucidated by the electron backscatter diffraction measurements. From the comparison between the −c-plane and Ga-polar (0001) (+c-plane), the −c-plane MQWs were found to be suffered from the severe ZB-phase inclusion, while ZB-inclusion is negligible in the +c-plane MQWs grown under the same growth conditions. The ZB-phase inclusion is a hurdle for fabricating the −c-plane light-emitting diodes because the islands with a triangular shape appeared on a surface in the ZB-phase domains. To improve the purity of stable wurtzite (WZ)-phase, the optimum conditions were investigated. The ZB-phase is dramatically eliminated with decreasing the V/III ratio and increasing the growth temperature. To obtain much-higher-quality MQWs, the thinner InGaN wells and the hydrogen introduction during GaN barriers growth were tried. Consequently, MQWs with almost pure WZ phase...

N-polar (−c-plane) InGaN light-emitting diodes with emission wavelengths ranging from blue to green to red were fabricated on a c-plane sapphire substrate by metalorganic vapor phase epitaxy. The optimization of growth conditions for −c-plane InGaN/GaN multiple quantum wells was performed. As a result, the extension of the emission wavelength from 444 to 633 nm under a constant current of 20 mA was achieved by changing the growth temperature of quantum wells from 880 to 790 °C.

Indium was introduced as a surfactant during metalorganic vapor phase epitaxial growth of nitrogen-polar GaN on c-plane sapphire tilted from 0.2 to 1.0° toward m-axis. For each sample with different tilted angle, the surfactant effect was confirmed from a scanning electron microscope and an atomic force microscope observations. In particular, for the tilted angle of 0.2°, all the hillocks, which usually exist on the nitrogen-polar GaN films on sapphire substrates with low tilted angles, disappeared. The microscopic terrace width was enlarged, and the surface roughness became small irrespective of the tilted angle, however, for the samples with higher tilted angles, the occurrence of the giant step bunching was rather enhanced. Therefore, it was confirmed that indium introduced during the nitrogen-polar GaN growth surely plays a role as a surfactant.

Nitrogen-polar (N-polar) InGaN films were grown on a GaN template/c-plane sapphire substrate by metal–organic vapor phase epitaxy (MOVPE). The effects of c-plane sapphire substrate miscut angle on the indium (In) content and crystal properties of N-polar InGaN films were investigated. The In content increased with increasing miscut angle in the vicinal region of less than 1.1°. This tendency is different from that of group-III-polar InGaN growth because of the difference in the atomic arrangement on the terraces and at step edges between these two inverted polar surfaces. In the case of N-polar growth, a spontaneous two-dimensional nucleation on terraces is difficult and the intentional introduction of steps is effective compared with group-III-polar growth. Furthermore, by observing the surface morphologies of GaN templates in view of both macroscopic and microscopic scales, a clear relationship between the macroscopic surface structure of GaN template and the In content of InGaN was revealed.

With respect to N-polar GaN grown on a sapphire substrate, the effects of Mg doping on the surface morphology, and the optical, and electrical properties are precisely investigated. By doping Mg, hillocks observed on the surface of GaN can be suppressed, while step bunching becomes severe. The atomic terrace width is extended with increasing Mg/Ga precursor ratio. Mg doping can promote the surface migration of Ga adatoms on a GaN surface during growth. In the case of heavily Mg-doped GaN, atomic steps become wavy. From photoluminescence spectra, the dominant transition was found to change from near-band-edge transition to donor–acceptor-pair transition. Hall-effect measurement shows p-type conduction at room temperature for a sample grown with the Mg/Ga precursor ratio of 4.5 × 10−3. The activation energy is 143 meV, which is comparable to that of Mg in the conventional Ga-polar (0001) GaN.

The accurate alloy composition of a nonpolar InGaN grown on m-plane GaN is estimated from X-ray reciprocal-space maps (RSMs) of (202̄1) and (213̄0) diffractions. In this estimation, the anisotropic residual strain in m-plane is carefully considered. In order to avoide the error which may be generated by the anisotropic strain and tilted domains in the film of InGaN, the lattice constants along m-, a-, and c-directions are determined using a pair of two RSMs normalized to the unit reciprocal vector along m-direction. The indium content of InGaN is derived from RSMs data using Poisson effect and Vegard's law. Based on this method, the incorporation of indium into InGaN is investigated. This incorporation is found to be promoted with the increase in the substrate miscut angle and the growth rate. From the precise analysis of RSMs, some of the InGaN domains on m-plane GaN substrates are found to be tilted toward ±a-direction despite of the substrate miscut toward c-direction.