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Your search keyword '"Semiconductor chips -- Production processes"' showing total 12 results
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12 results on '"Semiconductor chips -- Production processes"'

1. Enpirion Achieves Quantum Leap in Micro-Fabrication and Materials Technology Introducing the World's First 2-Dimensional Thin-Film Magnetic Cores with New Wafer Level Magnetics Technology

Subjects
Magnetic alloys -- Production processes, Integrated circuits -- Production processes, Circuit components -- Production processes, Semiconductor chips -- Production processes, Standard IC, Semiconductor device, Business, Business, international
Abstract

* Newly developed planar magnetic alloy * Proven cost-effective CMOS compatible mass production process * Enables world's lowest cost highest density DC-DC converters HAMPTON, N.J. -- Enpirion, the leader of [...]

Published
2012

2. X-FAB Releases First 0.18 Micrometer Foundry Solution for Integrated Hall Sensors

Subjects
Measuring instruments -- Production processes, Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Sensors -- Production processes, Standard IC, Business, Business, international
Abstract

High-Performance Hall Sensor Capability Proven to Enable Cost-Effective SoCs ERFURT, Germany -- X-FAB Silicon Foundries, the leading analog/mixed-signal foundry and expert in 'More than Moore' technologies, today announced the industry's [...]

Published
2009

3. CEA/Leti and IBM to Collaborate on Future Nanoelectronics Technology

Subjects
Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Nanotechnology, Computers -- Production processes, Computer industry -- Production processes -- Research agreements, Complementary metal oxide semiconductors -- Production processes, Standard IC, Software/hardware leasing, Microcomputer industry, Computer industry, Business, Business, international
Abstract

CEA/Leti Becomes a Research Associate of IBM and IBM's Semiconductor Joint Development Alliance Ecosystem Centered in Albany GRENOBLE, France -- CEA/Leti (the Electronics and Information Technology Laboratory of the CEA, [...]

Published
2009

4. IBM and Mentor Graphics to Develop 22nm Computational Lithography Solution for the Integrated Circuit Industry

Subjects
Mentor Graphics Corp. -- Production processes, International Business Machines Corp. -- Production processes, Computer software industry -- Production processes, Software -- Production processes, Semiconductor industry -- Production processes, Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Computer industry -- Production processes, Semiconductor industry, Standard IC, Software quality, Microcomputer industry, Computer industry, Business, Business, international
Abstract

ARMONK, N.Y. & WILSONVILLE, Ore. -- IBM (NYSE: IBM) and Mentor Graphics Corporation (Nasdaq: MENT) today announced an agreement to jointly develop and distribute next-generation computational lithography (CL) software solutions [...]

Published
2008

5. X-FAB Sarawak Set to Begin Volume Production of 0.35 Micrometer Analog/Mixed-Signal High-Voltage Technology

Subjects
Analog to digital converters -- Technology application, Analog to digital converters -- Production management, Analog to digital converters -- Production processes, Measuring instruments -- Technology application, Measuring instruments -- Production management, Measuring instruments -- Production processes, Integrated circuits -- Technology application, Integrated circuits -- Production management, Integrated circuits -- Production processes, Semiconductor chips -- Technology application, Semiconductor chips -- Production management, Semiconductor chips -- Production processes, Standard IC, Technology application, Business, Business, international
Abstract

Process Qualification Enables Dual Sourcing by X-FAB UK and X-FAB Sarawak for Ample Capacity ERFURT, Germany -- X-FAB Silicon Foundries, the world's leading foundry for the production of analog/digital integrated [...]

Published
2008

6. austriamicrosystems High-Voltage CMOS Process Design Kit Based on Tanner Tools Available

Subjects
Semiconductor industry -- Production processes, Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Complementary metal oxide semiconductors -- Production processes, Semiconductor industry, Standard IC, Business, Business, international
Abstract

New Tanner Based Process Design Kit Includes Complete Set of High-Voltage Devices, Model Files and IO Libraries Optimized for High-Voltage CMOS Product Design UNTERPREMSTAETTEN, Austria & ERLANGEN, Germany -- Fraunhofer [...]

Published
2008

7. TRADE NEWS: Agilent Technologies Offers First Commercial Package to Extract Device Models from Semiconductor Process Targets

Subjects
Agilent Technologies Inc. -- Production processes, Semiconductor industry -- Production processes, Integrated circuits -- Production processes, Circuit components -- Production processes, Semiconductor chips -- Production processes, Instrument industry -- Production processes, Complementary metal oxide semiconductors -- Production processes, Semiconductor industry, Standard IC, Semiconductor device, Business, Business, international
Abstract

Target Modeling Package for IC-CAP Enables Faster IC Design SANTA CLARA, Calif. -- Agilent Technologies Inc. (NYSE:A) today announced the first commercially available package that extracts models from semiconductor manufacturing [...]

Published
2008

8. Solido Integrates New Transistor-Level Statistical Design and Verification Technology with Cadence Virtuoso Analog Design Environment and Cadence Spectre Circuit Simulator

Subjects
Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Circuit design, Circuit designer, Integrated circuit design, Standard IC, Business, Business, international
Abstract

Integration Brings Sophisticated Statistical Design and Verification to Analog and Custom IC Designers; Ensures That Nanometer Designs Work Despite Wide Variations within a Given Manufacturing Process SASKATOON, Canada -- Solido [...]

Published
2007

9. Solido Design Announces New Transistor-Level Statistical Design and Verification Technology for Analog/Mixed-Signal, Custom Digital and Memory IC Designs

Subjects
Semiconductor industry -- Production processes, Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Semiconductor industry, Standard IC, Business, Business, international
Abstract

New Technology Provides Framework to Ensure That Nanometer Designs Work Despite Wide Variations Within a Given Manufacturing Process SASKATOON, Saskatchewan -- Solido Design Automation today took the wraps off a [...]

Published
2007

10. UMC Fabricates World's Highest Frequency Silicon Circuit Using CMOS - 192-GHz Voltage-Controlled Oscillator; Push-push Voltage-Controlled Oscillator (VCO) designed by the University of Florida reaches 192-GHz Operating Frequency

Subjects
Circuit design, Semiconductor industry -- Production processes, Integrated circuits -- Production processes, Semiconductor chips -- Production processes, Semiconductor industry, Standard IC, Integrated circuit design, Circuit designer, Business, Business, international
Abstract

HSINCHU, Taiwan -- UMC (NYSE:UMC)(TSE:2303), a world leading semiconductor foundry, today announced that it has fabricated a push-push Voltage-Controlled Oscillator (VCO) with an operating frequency of 192-GHz using its 0.13um [...]

Published
2006

11. X-FAB Offers IP Blocks for RF Designs; Speeds up Implementation of RF Circuitry into Working Silicon

Subjects
X-Fab Semiconductor Foundries AG -- Production processes, Circuit design, Semiconductor industry -- Production processes, Integrated circuits -- Production processes, Circuit components -- Production processes, Semiconductor chips -- Production processes, Semiconductor industry, Standard IC, Integrated circuit design, Semiconductor device, Circuit designer, Business, Business, international
Abstract

ERFURT, Germany -- X-FAB Semiconductor Foundries AG, one of the world's leading analog mixed-signal semiconductor foundries, has extended its IP offering to include RF building blocks for its 0.6 micrometer [...]

Published
2006

12. Pyxis Technology Announces Plan to Enter DFM Routing Space; EDA Startup Comes out of Stealth Mode; Announces Plans for New IC Routing Architecture Optimized for the Challenges Of Sub-100 nm Technology Nodes

Subjects
Integrated circuits -- Production processes, Integrated circuits -- Planning, Integrated circuits -- Technology application, Semiconductor chips -- Production processes, Semiconductor chips -- Planning, Semiconductor chips -- Technology application, Submarine boats -- Production processes, Submarine boats -- Planning, Submarine boats -- Technology application, Software -- Production processes, Software -- Planning, Software -- Technology application, Company business management, Company business planning, Standard IC, Technology application, Software quality, Company process management, Business, Business, international
Abstract

SANTA CLARA, Calif. -- New Software Promises to Optimize Designs for the Manufacturing Process, Simplify the Post-Tapeout Flow and Improve Design Yield Pyxis Technology, an electronic design automation (EDA) company [...]

Published
2005

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