40 results on '"Kuroda, Tadahiro"'
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2. A 7-nm FinFET 1.2-TB/s/mm$^{2}$ 3D-Stacked SRAM Module With 0.7-pJ/b Inductive Coupling Interface Using Over-SRAM Coil and Manchester-Encoded Synchronous Transceiver
3. A 7-nm FinFET 1.2-TB/s/mm2 3D-Stacked SRAM Module With 0.7-pJ/b Inductive Coupling Interface Using Over-SRAM Coil and Manchester-Encoded Synchronous Transceiver
4. QUEST: Multi-Purpose Log-Quantized DNN Inference Engine Stacked on 96-MB 3-D SRAM Using Inductive Coupling Technology in 40-nm CMOS
5. BRein Memory: A Single-Chip Binary/Ternary Reconfigurable in-Memory Deep Neural Network Accelerator Achieving 1.4 TOPS at 0.6 W
6. A 6 Gb/s 6 pJ/b 5 mm-Distance Non-Contact Interface for Modular Smartphones Using Two-Fold Transmission Line Coupler and High EMC Tolerant Pulse Transceiver
7. A 0.15-mm-Thick Noncontact Connector for MIPI Using a Vertical Directional Coupler
8. Highlights of the ISSCC 2013 Processors and High Performance Digital Sessions
9. A 0.5-V 5.2-fJ/Conversion-Step Full Asynchronous SAR ADC With Leakage Power Reduction Down to 650 pW by Boosted Self-Power Gating in 40-nm CMOS
10. A 12-Gb/s Non-Contact Interface With Coupled Transmission Lines
11. An Inductively Powered Wireless Solid-State Drive System With Merged Error Correction of High-Speed Wireless Data Links and NAND Flash Memories.
12. 1-W 3.3–16.3-V Boosting Wireless Power Transfer Circuits With Vector Summing Power Controller
13. Rotary Coding for Power Reduction and S/N Improvement in Inductive-Coupling Data Communication
14. A 0.025–0.45 W 60%-Efficiency Inductive-Coupling Power Transceiver With 5-Bit Dual-Frequency Feedforward Control for Non-Contact Memory Cards
15. Simultaneous 6-Gb/s Data and 10-mW Power Transmission Using Nested Clover Coils for Noncontact Memory Card
16. A 10-Bit 80-MS/s Decision-Select Successive Approximation TDC in 65-nm CMOS
17. A 0.5 V 1.1 MS/sec 6.3 fJ/Conversion-Step SAR-ADC With Tri-Level Comparator in 40 nm CMOS
18. A 30 Gb/s/Link 2.2 Tb/s/mm$^{2}$ Inductively-Coupled Injection-Locking CDR for High-Speed DRAM Interface
19. A 0.55 V 10 fJ/bit Inductive-Coupling Data Link and 0.7 V 135 fJ/Cycle Clock Link With Dual-Coil Transmission Scheme
20. An Inductive-Coupling DC Voltage Transceiver for Highly Parallel Wafer-Level Testing
21. 3-D System Integration of Processor and Multi-Stacked SRAMs Using Inductive-Coupling Link
22. 2 Gb/s 15 pJ/b/chip Inductive-Coupling Programmable Bus for NAND Flash Memory Stacking
23. A High-Speed Inductive-Coupling Link With Burst Transmission
24. A 750 Mb/s, 12 pJ/b, 6-to-10 GHz CMOS IR-UWB Transmitter With Embedded On-Chip Antenna
25. A 2 Gb/s Bi-Directional Inter-Chip Data Transceiver With Differential Inductors for High Density Inductive Channel Array
26. 20-GHz Quadrature Injection-Locked LC Dividers With Enhanced Locking Range
27. A 0.14 pJ/b Inductive-Coupling Transceiver With Digitally-Controlled Precise Pulse Shaping
28. A 40–44 Gb/s 3$\times$ Oversampling CMOS CDR/1:16 DEMUX
29. A 0.79-${\hbox {mm}}^{2}$ 29-mW Real-Time Face Detection Core
30. A 20-Gb/s Simultaneous Bidirectional Transceiver Using a Resistor-Transconductor Hybrid in 0.11-$\mu{\hbox {m}}$ CMOS
31. Crosstalk Countermeasures for High-Density Inductive-Coupling Channel Array
32. A 1 Tb/s 3 W Inductive-Coupling Transceiver for 3D-Stacked Inter-Chip Clock and Data Link
33. A 0.79-mm2 29-mW Real-Time Face Detection Core.
34. A CMOS Ultra-Wideband Impulse Radio Transceiver for 1-Mb/s Data Communications and +2.5-cm Range Finding.
35. A 195-Gb/s 1.2-W Inductive Inter-Chip Wireless Superconnect With Transmit Power Control Scheme for 3-D-Stacked System in a Package.
36. A 40-Gb/s CMOS Clocked Comparator With Bandwidth Modulation Technique.
37. A 10-Gb/s Receiver With Series Equalizer and On-Chip ISI Monitor in 0.11-μm CMOS.
38. Analysis and Design of Inductive Coupling and Transceiver Circuit for Inductive Inter-Chip Wireless Superconnect.
39. Introduction to the Special Issue on the 2005 Symposium on VLSI Circuits.
40. Introduction to the Special Issue.
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