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This paper addresses the development of accurate and efficient behavioral models of digital integrated circuits for the assessment of high-speed systems. Device models are based on suitable parametric expressions estimated from port transient responses and are effective at system level, where the quality of functional signals and the impact of supply noise need to be simulated. A potential limitation of some state-of-the-art modeling techniques resides in hidden instabilities manifesting themselves in the use of models, without being evident in the building phase of the same models. This contribution compares three recently-proposed model structures, and selects the local-linear state-space modeling technique as an optimal candidate for the signal integrity assessment of data links. In fact, this technique combines a simple verification of the local stability of models with a limited model size and an easy implementation in commercial simulation tools. An application of the proposed methodology to a real problem involving commercial devices and a data-link of a wireless device demonstrates the validity of this approach. [ABSTRACT FROM AUTHOR]

Modern packaging design requires extensive signal integrity simulations in order to assess the electrical performance of the system. The feasibility of such simulations is granted only when accurate and efficient models are available for all system parts and components having a significant influence on the signals. Unfortunately, model derivation is still a challenging task, despite the extensive research that has been devoted to this topic. In fact, it is a common experience that modeling or simulation tasks sometimes fail, often without a clear understanding of the main reason. This paper presents the, fundamental properties of causality, stability, and passivity that electrical interconnect models must satisfy in order to be physically consistent. All basic definitions are reviewed in time domain, Laplace domain, and frequency domain, and all significant interrelations between these properties are outlined. This background material is used to interpret several common situations where either model derivation or model use in a computer-aided design environment fails dramatically. We show that the root cause for these difficulties can always be traced back to the lack of stability, causality, or passivity in the data providing the structure characterization and/or in the model itself. [ABSTRACT FROM AUTHOR]

This paper addresses the impact of device macro-models on the accuracy of signal integrity and performance predictions for critical digital interconnecting systems. It exploits nonlinear parametric models for both single-ended and differential devices, including the effects of power supply fluctuations and receiver bit detection. The analysis demonstrates that the use of well-designed macromodels dramatically speeds up the simulation as well it preserves timing accuracy even for long bit sequences. [ABSTRACT FROM AUTHOR]

This paper addresses the modeling of differential drivers and receivers for the analog simulation of high-speed interconnection systems. The proposed models are based on mathematical expressions, whose parameters can be estimated from the transient responses of the modeled devices. The advantages of this macromodeling approach are: improved accuracy with respect to models based on simplified equivalent circuits of devices; improved numerical efficiency with respect to detailed transistor-level models of devices; hiding of the internal structure of devices; straightforward circuit interpretation; or implementations in analog mixed-signal simulators. The proposed methodology is demonstrated on example devices and is applied to the prediction of transient waveforms and eye diagrams of a typical low-voltage differential signaling (LVDS) data link. [ABSTRACT FROM AUTHOR]

This paper addresses the development of computational models of digital integrated circuit input and output buffers via the identification of nonlinear parametric models. The obtained models run in standard circuit simulation environments, offer improved accuracy and good numerical efficiency, and do not disclose information on the structure of the modeled devices. The paper reviews the basics of the parametric identification approach and illustrates its most recent extensions to handle temperature and supply voltage variations as well as power supply ports and tristate devices. [ABSTRACT FROM AUTHOR]

Focuses on the development of macromodels for input and output ports of a digital device. Characterization of transistor-level models of commercial devices; Advantages of the parametric approach to behavioral modeling; Utilization of the discrete-time parametric models in automatic controls.

A foreword to "IEEE Transactions on Advanced Packaging" vol. 31 is presented.