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The reduction of the nominal supply voltage of CMOS technologies with scaling comes with the decrease of the maximum tolerable voltage of the devices. This poses challenges in implementing circuit blocks that are compliant with standardized communication protocols or deal with off-chip signals in voltage domains larger than the nominal supply (e.g., 1.8 V, 3.3 V, 5 V). Design techniques such as cascoding, voltage shifting and adaptive biasing are effective at removing the need for customized voltage resistant input/output (I/O) devices since they prevent intolerable voltage drops. However, at the input of multiple-channel blocks, the design of switches of multiplexers results critical as the input and the output nodes can assume values beyond the signal range, causing harmful biasing configurations. This paper presents the architecture of a switch for input channel multiplexers able to handle signals up to twice the nominal supply voltage of the employed devices. Its effectiveness has been proved by implementing a 1.6V switch with the core MOS transistors of the 28nm CMOS technology with 0.96V nominal supply voltage. The comparison with a benchmark switch based on 1.8V I/O devices showed that both a larger area (slightly more than twice) and static current consumption ($40\mu \text{A}$) are required. [ABSTRACT FROM AUTHOR]

Memristors are being explored as a potential technology to replace CMOS for logic-in-memory systems that exploit the memristive non-volatility. Memristors are two-terminal, non-volatile device that exhibit a variable resistance that is dependent on the applied voltage history of the device, providing the capability to store and process information within the same structure. The ability of memristors to perform logic has been previously demonstrated, but previous analyses of memristor logic efficiency have not included the overhead CMOS circuitry that is required to control memristor logic operations. In this paper, the required overhead CMOS circuitry for implementing logic with memristors is evaluated for standard logic gates and a one-bit full adder to enable an analysis of the overall system efficiency. The results show that the number of CMOS devices in the overhead circuitry can be upwards of 50 times that of a conventional CMOS implementation, and that the power-delay product of the memristor logic with overhead circuitry is roughly one billion times greater than for conventional CMOS circuits. These results enable the conclusion that the overhead circuit requirements for stateful memristor logic threaten to negate any efficiency improvements that are achieved by the memristors themselves. [ABSTRACT FROM AUTHOR]

This paper, split into Parts I and II, reviews recent innovations in circuit design that have accelerated the miniaturization of sensor nodes. Design techniques for key building blocks, such as sensor interfaces, timing reference, data communication, energy harvesting, and power management are reviewed. In particular, Part I introduces analog circuit techniques and sensor interfaces for miniaturized sensor nodes. The energy budget of such system is highly restricted due to the small battery volume. Therefore, ultra-low power design techniques are critical enablers and are reviewed. Design techniques for compact monolithic integration are also discussed. [ABSTRACT FROM PUBLISHER]

This paper proposes a novel boosted voltage sensing (BVS) scheme that substantially improves the resiliency of STT-MRAMs against variations in read accesses based on bitline voltage sensing, and on a wide range of voltages. The BVS scheme mitigates the impact of variations in the senseamp and the reference voltage generation, and is based on switched-capacitor voltage boosters. The related area-performance-energy-resiliency tradeoff is explored, and design guidelines are derived to improve the read margin at minimum overhead. [ABSTRACT FROM PUBLISHER]

Essential design requirements for a sense amplifier (SA) used in the resistance monitoring write termination (RM-WT) scheme are suggested to reduce the write energy of spin-transfer-torque random access memory (STT-RAM) while achieving a write pass yield comparable to that of a conventional write operation. In addition, a self-referenced single-ended RM-WT (SS-RM-WT) scheme is proposed. To reduce the offset voltage, a single-ended sensing circuit (SE-SC) is used in the SA. A data-aware input voltage-transfer method is also adopted in the SE-SC to maximize the input voltage difference. By adopting a capacitor between the output of the SE-SC and the input of an inverter generating a logical output used for the write termination, the conflict between maintaining and changing the output of the SE-SC is resolved. The simulation results using the industry-compatible 65-nm technology HSPICE model parameters show that the proposed SS-RM-WT scheme achieves a 44% write energy saving on average without increasing the write error rate. Area overhead is only 11.8% for a 256-kb STT-RAM array, whereas that of the previous self-referenced RM-WT schemes is up to 42.5%. [ABSTRACT FROM AUTHOR]

This overview article describes Magnetoresistive Random Access Memory (MRAM) from a circuits and systems perspective. We discuss various tradeoffs and design challenges of MRAM in three broad application areas: 1) embedded non-volatile memory (eNVMs), 2) crossbar-based analog in-memory computing, and 3) stochastic computing. Certain MRAM characteristics, such as high retention, high endurance and fast read and write operations, make them ideal for replacing the standard CMOS memories for last-level cache applications with future scaling. However, various tradeoffs in power, performance and area pose conflicting requirements on MRAM design. We explore these challenges and various circuit techniques that have been developed to mitigate them. Further, we present various requirements of memristive crossbar arrays for accelerating matrix-vector-multiplication (MVM) operations in light of MRAM devices, and highlight various challenges, design considerations, and applicability of MRAM as crossbar arrays. Finally, we will elaborate on how inherent stochasticity of MRAM devices can be leveraged for implementing energy-efficient true random number generators (TRNGs) and stochastic units for performing certain tasks, such as developing fast solvers for combinatorial optimization, and stochastic neural networks. [ABSTRACT FROM AUTHOR]

In the upcoming internet of things (IoT) era, spin transfer torque magnetic tunnel junction (STT-MTJ) based non-volatile (NV) memory and circuits for IoT nodes and normally-off electronics will need to meet constraints in speed, energy and robustness. This study focuses on NV logic-in-memory (LIM) architecture. Supply voltage ( Vdd ) scaling in MTJ based NV-LIM is evaluated on FD-SOI 28 nm node. In order to overcome Vdd scaling bottleneck, an efficient framework for Vdd scaling in NV circuits is proposed with design strategies, e.g., back-bias (BB), poly biasing (PB), and approximate computing. The design vector ( Vdd , VBB ,PB) generated power-delay curves can provide user-defined LIM circuit aiming for dynamic/leakage power saving, power/speed efficiency and process variation resilient. The design space is explored in near-threshold regime around 0.5 V supply. Simulations of NV-logic, full adder (NV-FA) and flip-flop (NV-FF) are performed, along with insights for circuit design and practical implementation of NV-LIM circuits with FD-SOI technology. [ABSTRACT FROM AUTHOR]