Search

This paper presents novel radiation hardening design techniques to substantially reduce the single event effects (SEE) on high-frequency receivers subject to various radiations when operating in space. A W-band (75-110 GHz) receiver front-end implemented in Global Foundry’s 90 nm SiGe BiCMOS technology is used for studying SEE and investigating the effectiveness of the proposed techniques. Specifically, the mixer is modified to allow for different modes of operation, in addition to introducing matching considerations between the mixer’s gain and switching stages. The receiver includes integrated high frequency signal sources to provide the input radio frequency (RF) and local oscillator (LO) signals for full operation of the proposed millimeter-wave (mmW) receiver. Measurements are taken while the receiver is in normal operation (RF and LO are applied.) The design techniques are carefully analyzed via extensive simulations using equivalent transient current pulses obtained from calibrated Technology Computer-Aided Design (TCAD) simulations. A two-photon-absorption (TPA) pulsed laser experiment is used to induce transient currents in the silicon–germanium heterojunction bipolar transistor (SiGe HBT) circuit. Various devices within the mixer are hit from the back side through a hole in the designed printed circuit board (PCB.) The propagated transients are then captured using a high-speed oscilloscope at the output of the receiver. The measurement results, supported by simulations and analysis, validate the robustness of the proposed radiation hardened receiver to SEE.

A method to carry out a priori simulations of pulsed-laser-induced single-event effects experiments is reported. Nonlinear optical simulations are conducted to model the 3-D distributions of charge from a laser pulse. These pulsed-laser-induced charge distributions are then incorporated into a charge transport solver to model the movement of charge as the device returns to a steady state. The output of the simulation infrastructure is a current transient from which collected charge and the temporal characteristics of the transient can be determined. This complete approach to modeling, which includes full device structure information, nonlinear optical energy deposition, and the subsequent movement of optically generated charge in a device and measurement circuit, allows for direct comparison between experimental and simulated current transients. A large-area silicon diode was used as the test vehicle, and good agreement was found between simulations and experiments in both total injected charge as well as temporal characteristics. Importantly, the a priori simulation approach does not require knowledge from prior heavy-ion testing, making it a predictive tool with broad versatility and minimal reliance on approximations.

By scanning the charge-deposition profile produced by a pulsed laser throughout a device, the spatially dependent charge-collection efficiency (CCE) can be determined. This is demonstrated by extracting the depth-dependent CCE in two photodiodes. The resulting collection efficiency curves are found to be consistent with their device structures and the expected charge-collection mechanisms. By applying the efficiency curves to the charge-deposition curves for both heavy ions and pulsed X-rays, the calculated collected charge values show very good agreement with experimental results. This suggests that the profiles extracted using the laser can help predict charge-collection data from other excitation sources and could improve modeling efforts by determining sensitive volumes.

Optical single-event transients (OSETs) were measured for the first time in integrated silicon-photonic waveguides. A custom test fixture and novel experimental setup were used at the U.S. Naval Research Laboratory to induce a dense cloud of electron–hole pairs (EHPs) in a waveguide by the two-photon absorption process. Experimental data showed that the fractional (or percent) extinction of the optical power in the waveguide due to an OSET is dependent on the number of injected EHPs. This fractional extinction was also shown to be constant regardless of the optical power level in the waveguide. These OSETs are a direct result of a reduction in the optical transmission ratio due to transient free-carrier absorption. The peak of the largest measured OSET degraded the transmission ratio by 15%, which, according to simulations, corresponds to roughly $9\times 10^{19}$ cm−3 peak EHP generation. Simulation results suggest that the EHP density levels generated by heavy ions in space could potentially cause up to 100% fractional extinction of light in the waveguide, that is, total loss of the optical signal. A simulation technique to predict the OSET effects in any arbitrary photonic circuit is shown. Here, an electrooptic modulator was used as an example. The results of this study pose concerns for use of integrated silicon photonics for radiation-intensive applications.

Heavy-ion, focused X-ray, and pulsed laser single-event transient (SET) experiments are performed on a silicon epitaxial diode. Collected charge, transient rise times, and transient fall times are calculated and compared between different sources. The transient shape characteristics depend on the source (ion, X-ray, or laser), even when similar amounts of charge are generated. The observed differences are examined and explained in terms of basic charge collection mechanisms.

Low-noise amplifiers (LNAs) are necessary components for any communications system. Single-event transients (SETs) induced by energetic particles in space can corrupt the data in an RF receiver. Using p-n-p silicon–germanium (SiGe) heterojunction bipolar transistors (HBTs), instead of their more common n-p-n counterparts, has been shown to be an effective mitigation technique in digital, analog, and RF circuits. Since p-n-p SiGe HBTs tend to have lower performance than n-p-n SiGe HBTs, in this article, the tradeoffs between performance and SET robustness have been evaluated through the use of simulations. Two LNAs were designed using an algorithmic design technique: one using only n-p-n SiGe HBTs, and the other using only p-n-p devices. The n-p-n LNA had higher peak gain and lower noise figure at the center frequency of 5 GHz when compared to the p-n-p LNA, by 3.2 and 0.4 dB, respectively. However, the n-p-n LNA also produced transients with amplitudes larger than the p-n-p LNA across all simulated linear energy transfers. Although the p-n-p LNA has lower overall performance, it is also more robust to SETs. Thus, the choice between using n-p-n and p-n-p SiGe HBTs for an RF design will depend on application requirements.

A novel approach for two-photon absorption (TPA) pulsed-laser testing produces extended charge deposition profiles that are analogous to those produced by heavy ions. In this approach, which utilizes an axicon rather than a spherical lens, the conventional Gaussian beam is replaced by a quasi-Bessel beam. The key feature of a quasi-Bessel beam, relevant to pulsed-laser single-event effects (PL-SEE) studies, is that its radial size ( $\sim 1~\mu \text{m}$ ) remains constant over the axial length of the beam (several 100 s of $\mu \text{m}$ ) resulting in a charge-deposition profile that more closely mimics that produced by a heavy ion. This elongated charge distribution directly lends itself to a simple and intuitive description in terms of linear-energy transfer (LET), facilitating laser/ion correlation studies. Experimental results comparing a conventional TPA PL-SEE focusing geometry and the axicon focusing geometry are presented for three different test vehicles: a 45-nm silicon-on-insulator (SOI) nFET, a bulk silicon photodiode, and an LM124 operational amplifier. By using the axicon approach, strong laser/ion correlation is observed in the silicon photodiode for single-event transients (SET) across a wide range of LETs. The correlation is achieved by “tuning” the laser to the desired LET rather than relying on preexisting heavy-ion data, and therefore, this approach holds promise as a predictive tool.

The propagation of single-event transients from the electrical to the photonic domain in a segmented Mach–Zehnder modulator was investigated using pulsed-laser measurements and lumerical simulations. Although electrical transients can heavily degrade the input data to the modulator, almost all of the degradation can be suppressed once it is converted into the optical domain. The mitigation of transients is primarily accomplished by increasing $V_\pi $ of each segment, making electrical transients up to 6 V essentially negligible. A “folding” effect of the optical transient is also explained in relation to $V_\pi $ . Two radiation-hardening-by-design (RHBD) approaches are suggested to mitigate transient effects.

A sensitive volume is developed using pulsed laser-induced collected charge for two bias conditions in an epitaxial silicon diode. These sensitive volumes show good agreement with the experimental two-photon absorption laser-induced collected charge at a variety of focal positions and pulse energies. When compared to ion-induced collected charge, the laser-based sensitive volume overpredicts the experimental collected charge at low bias and agrees at high bias. A sensitive volume based on ion-induced collected charge adequately describes the ion experimental results at both biases. Differences in the amount of potential modulation explain the differences between the ion- and laser-based sensitive volumes at the lower bias. Truncation of potential modulation by the highly doped substrate, at the higher bias, results in similar sensitive volumes.

A comparison of heavy-ion-induced single-event transients (SETs) in silicon–germanium heterojunction bipolar transistors (SiGe HBTs) fabricated on both bulk and silicon-on-insulator (SOI) substrates is presented. Experimental heavy-ion data show a reduction of sensitive volume of $\approx 350\times $ for the SiGe HBTs fabricated on SOI compared to those on a bulk substrate. Furthermore, the results indicate that the sensitive volume of the SOI SiGe HBTs is confined to the intrinsic device. These results have been confirmed using pulsed laser data and TCAD simulations. Limiting the charge collection depth of SiGe HBTs by fabricating them on SOI facilitates correlation of ion and laser results. The improved ease of correlation is a result of suppressing diffusive charge collection mechanisms that are difficult to replicate with the charge deposition profile generated by two-photon absorption using a tightly focused laser beam. However, a potential issue with pulsed laser testing is determining the loss of the pulse energy through the buried oxide, which requires detailed knowledge of the semiconductor platform. Overall, the reduction of sensitive volume for the SOI SiGe HBTs compared to those on a bulk substrate is a clear advantage from a single-event upset vulnerability perspective.

A focused pulsed X-ray beam is used to determine how the redistribution of the electric field by the gate-connected field plate affects single-event transient (SET) susceptibility of an AlGaN/GaN Schottky-gate HEMT on SiC. SETs generated by scanning the X-ray beam across the HEMT depend strongly on the presence of the field plate, radiation strike location, bias conditions, and X-ray photon energy. For the particular HEMT we tested, the gate-connected field plate reduces the electric-field strength near the edge of the gate by a factor of approximately 2, which results in faster decaying transients and less collected charge.

We provide “best practices” for single-event transient (SET) mitigation using electrostatic discharge (ESD) protection techniques. We investigate the correlation between SET suppression and RF performance when ESD protection circuits for SET mitigation are combined with various RF switches. The three different single-pole single-throw (SPST) switch configurations (conventional design, floating body, and floating body/n-well) were implemented to provide insight on how to best apply dc ESD protection techniques for also achieving robust SET mitigation. Based on two-photon absorption laser experiments and RF measurements, a conventional SPST switch configuration shows relatively poor RF performance but is effective for SET mitigation due to the SET discharge current path provided by ESD protection circuit. On the other hand, the combination of the SPST switch and the ESD circuit, which exhibits the best RF performance among the three configurations, is relatively vulnerable to SETs. Based on these results, strategies and methodologies for ESD protection techniques to effectively mitigate SET are proposed.

Focused, pulsed X-rays are used to generate single-event transients (SETs) in metal–insulator–semiconductor (MIS)-gate AlGaN/GaN high-electron-mobility transistors (HEMTs) in order to investigate the mechanisms responsible for SETs. Unlike Schottky-gate GaN HEMTs, where current flows between gate and drain when the device is biased “OFF,” for the MIS-gate HEMTs, current flows between the source and drain. The presence of the SiNx insulating layer under the gate effectively blocks electrons on the gate from moving into the semiconductor. Short-duration SETs at the gate are caused by the collection of holes injected by the X-rays. SETs collected at the source and drain have an initial short-duration component, followed by a long-duration tail that can last for hundreds of nanoseconds. The long tails are due to positive charges (holes) that are less mobile than the electrons and so take longer to exit the HEMT, and to holes that become trapped at defects in the material. The holes lower the potential barrier between the source and the region under the gate, allowing for the injection of electrons that flow from the source to the drain. The durations of the SET tails are determined by the lifetimes of the trapped holes that are found to vary with X-ray photon energy and electrical bias.

An approach for determining the optimal laser parameters (i.e., pulse energy, focused spot size, wavelength, and pulse duration) for correlating single-event transients induced via two-photon absorption (TPA) and heavy ions is presented. The approach focuses on identification and extraction of waveform characteristics, or “features,” and minimizing the error between features produced by TPA and ions. Modifying optical parameters can directly impact the waveform features of the TPA-induced transients. Consequently, optimal laser parameters that minimize the error between features extracted for laser- and ion-induced waveforms can be determined. In this paper, the laser pulse energy and spot size were varied, while maintaining a fixed pulse duration and wavelength, and the resulting transients were compared to ion-induced transients. When the optimized optical parameters are used, excellent agreement was achieved between laser- and ion-induced transient waveforms in a silicon-germanium heterojunction bipolar transistor (SiGe HBT). In addition, a one-to-one correlation between heavy-ion linear energy transfer (LET) and laser pulse energy was obtained for a particular spot size ( $\omega _{0} = 1.89\,\,\mu \text{m}$ (HW $1/e^{2}$ )). These results show that a correlation between LET and pulse energy is achievable when the remaining optical parameters are selected appropriately. Although the results presented are for SiGe HBTs, the generality of the approach should allow it to be extended to other semiconductor platforms.

Using a laser-equivalent linear energy transfer (LET) approach, strong correlation is found for collected charge following heavy-ion and pulsed-laser excitation in a bulk diode device. By significantly modifying the size of the charge distribution generated by one- and two-photon absorption compared to the depth of the sensitive region, charge deposition in a large variety of device technologies is mimicked. Nearly one-to-one correlation is found with heavy-ion charge collection, independent of the laser focusing geometry or magnitude of LET. Finally, this approach is applied to the previous studies where empirical laser-ion correlations on highly scaled technologies were proposed. These correlations are reproduced through direct calculation of the laser-equivalent LET, and outstanding observations are explained despite the sensitive areas of these devices being up to 1000 times smaller than the laser-deposited charge profile. In total, these studies suggest that this quantitative methodology for laser-ion correlation is broadly applicable for a range of complex device technologies.

The doping profile of silicon-germanium heterojunction bipolar transistors (SiGe HBTs) is modified to enhance inverse-mode (IM) device operation. Device improvements are presented in this paper, along with the impact the alterations have on the radiation effects response. This investigation represents the first published occurrence of a radiation-hardening-by-process approach in a SiGe HBT technology. Results show that improving IM performance can degrade the radiation tolerance of the structure. Total ionizing dose and single-event transient (SET) results are provided along with an analysis that utilizes TCAD simulation. An additional profile modification using an implanted vertical superjunction is included in this paper to expand upon how nonradiation specific device modifications can impact SETs.

This paper demonstrates the use of an RF power detector to sense the occurrence of single-event transients (SETs) in RF circuits and systems. The detector was connected to a low-noise amplifier (LNA), and the relationship between the detector output and the LNA transients was investigated via two-photon absorption, pulsed-laser testing, together with mixed-mode TCAD simulations. The response of the detector shows a strong correlation with the RF power of the generated SET. An analytical expression for the detector output is derived and utilized to fit the data. The effects of parameters affecting circuit performance on the detector response to SETs are explored using calibrated TCAD mixed-mode simulations, and design tradeoffs are presented. Finally, a solution to distinguish between transients generated in the detector from those generated in the circuit being monitored is proposed and verified in simulation. The use of detectors to monitor SETs in RF systems could lead to judicious deployment of detection-driven SET mitigation techniques.