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The annual output value of Taiwan’s wafer foundry and IC packaging test ranks first worldwide. The electronics industry has a complete industrial ecological chain in the supply chain system of global information and communication technology. In order to increase market competitiveness and increase the operational flexibility, manufacturing process outsourcing has become a trend in the business model of the electronics industry. The quality of the outsourcing affects the quality and function of the final product, the outsourcer selection is crucial to ensure the quality of the final product. This article takes the wire bonding process as an example, and proposes a fuzzy selection model of quality-based IC packaging process outsourcers. Then, this article selects the six standard deviation indicator that can fully reflect the process yield and quality level as the evaluation tool. Since the indicator contains unknown parameter, in order to improve the accuracy of estimation and overcome the uncertainty of measurement data, this paper applies mathematical programming to derive the confidence interval of six sigma quality index, and proposes a confidence-interval-based fuzzy testing meth as a green outsourcer selection tool to reduce the risk of misjudgment due to sampling errors and improve the accuracy of the selection. [ABSTRACT FROM AUTHOR]

This paper presents a method of modeling bondwires of arbitrary shapes using lumped element models. As an example, a semi-circular multi-wire configuration is presented. Effects of wire angles and dielectric thicknesses are taken into account. A fixture containing three- and five-wire networks is fabricated, assembled, and tested with a vector network analyzer which extracts the S-parameters of each two-port network. These measurements are compared to the proposed model and two benchmark models from a widely used design software package. As a comparison, mean absolute error and root mean square error are used to analyze results showing that the proposed model is better at tracking the measured physical data compared to the two benchmark models. Although semicircular bondwires is presented as an example, any geometry is supported using the proposed model. As an illustration of the easy-use of this proposed bondwire model in a system design, the performance of a high-frequency amplifier is given with and without the bondwire model. The results clearly demonstrate the compatibility of the model with widely used circuit simulators and the importance of including the effects of bondwires when determining circuit performance. [ABSTRACT FROM AUTHOR]

In order to investigate the electrical characteristics of microprobe in integrated circuit testing, a wafer probe admittance testing system with motion control and admittance measurement instruments was organized by using pogo microprobe whose impedance characteristics are automatically measured and analyzed. The probe’s admittance characteristics under different loading frequency were explored based on voltammetry. The results show that the probe was resistive when loading frequency was less than 100 kHz, and being inductive when the frequency was larger than 100 kHz. Furthermore, the probe’s admittance was the least when the frequency was between 200 and 400 kHz. Meanwhile, the conductivity of tipped needle is smaller than claw pin when the frequency is between 1 and 500 kHz, whereas the susceptance and resistance of tipped needle is larger than claw pin, which mainly due to the change of contact between probe and the solder. [ABSTRACT FROM PUBLISHER]

We present a method for quantifying a risk for killer defects at layer level and estimating yield for substrate packages using information from design files. To calculate risk ranks and predicted yield, we define a risk distance that is a key parameter extracted from designs using image processing techniques. In order to validate our model, we analyze two different designs, each having multiple layers, and compare with data from baseline lots. It is shown that there is an inverse correlation between risk layer ranks and yield. Estimated yield based on our model is compared with baseline yield for four layers of the second design. The model-to-baseline yield difference is less than 1% for three layers we tested. [ABSTRACT FROM PUBLISHER]