Search

By controlling the sputtering power, rotational speed of the substrate and sputtering time, Ni–Cr thin films with appropriate composition were fabricated by double-target magnetron co-sputtering techniques. The homogeneity and oxidation of Ni–Cr thin film has been studied by Auger electron spectroscopy (AES). The structures of Ni–Cr thin films were determined by an X-ray diffractometer (XRD). The oxidation and the resistance stability of the Ni–Cr thin film after rapid thermal process (RTP) have been studied. The relations between TCR and RTP techniques of Ni–Cr thin films were discussed. [ABSTRACT FROM AUTHOR]

The electromechanical properties of nichrome (Ni–Cr 80/20 wt.%) used as a common material for application in thin film strain gauges have been studied. The surface topography and chemical composition of Ni–Cr thin films grown on the glass substrate by magnetron sputtering have been analyzed by atomic force microscope (AFM) and energy dispersive spectroscopy (EDS), respectively. The temperature coefficient of resistance (TCR) has been determined by a Nano-volt/Micro ohm meter. The gauge factor (FG) has been determined by the cantilever method. Low stable TCR values (22 ppm to 46 ppm in the 50–150°C temperature range) have been obtained. Resistance stability is achieved by rapid thermal annealing (RTA) at 300°C for 10 min combined with a 24 h thermal annealing (TA) at 150°C. The desired 45 Ω/m sheet resistance and a gauge factor of 2.6 have been attained for 40-nm-thickness films. The films have very small roughness of 2.1~4.4 nm. [ABSTRACT FROM AUTHOR]

By controlling the sputtering power, rotated speed of substrate and sputtering time, Ni–Cr films with appropriate composition were fabricated by double-target magnetron co-sputtering techniques. The cross-sectional micrograph and element diffusion of Ni–Cr films deposited on stainless steel substrates by magnetron sputtering have been analyzed by scanning electron microscope (SEM) and energy dispersive spectroscope (EDS). The results indicate that the according compositions of Ni–Cr films are 58 wt.% Ni and 42 wt.% Cr when the sputtering powers of Ni and Cr targets are 288 W and 280 W, respectively. In the same time, the diffusions of Ni, Fe and Cr were revealed and the diffusion distances of Ni and Cr are calculated by Fick's second law with a Pile-Up law model. The largest diffusion distance is about 885 nm, beyond which the content of Ni and Cr detected by EDS is the same as the substrate. [ABSTRACT FROM AUTHOR]

Ni–Al intermetallic compounds nanocrystalline thin films were deposited by direct current magnetron co-sputtering from elemental Ni and Al targets. The integrity of the thin films and their elemental compositions were assessed using a scanning electron microscope (SEM) equipped with an energy dispersive spectroscope analyzer. The morphologies of thin alloy films are density and smoothing characterized by atomic force microscope and SEM. The preferred (111) orientation in both as-deposited and annealed films are identified using X-ray diffractometer (XRD). The electrical properties of the alloy films were studied, and show good metallic conduction characteristics. From room temperature to 200°C, the resistance of the thin films are assumed to be linear as a function of varying temperature. All the thin films show a positive temperature coefficient of resistance (TCR). As 1% O2 was introduced into the vacuum chamber during sputtering, the root mean square roughness of the films increased, grain size turned out to be smaller, and the crystallization process was blocked. The amorphous Al2O3 phase was found in XRD patterns. The results of TCR measurement show a different electric conduction mechanism compared with alloy films. [ABSTRACT FROM AUTHOR]