1. High aspect ratio silicon etch: a review
- Author
-
Banqiu Wu, Kumar, Ajay, and Pamarthy, Sharma
- Subjects
Chemical etching -- Analysis ,Integrated circuits -- Design and construction ,Semiconductor chips -- Design and construction ,Microelectromechanical systems -- Usage ,Silicon -- Electric properties ,Silicon -- Mechanical properties ,Standard IC ,Physics - Abstract
The different technological methods, critical challenges and main theories of the technologies of the high aspect ratio (HAR) silicon etch are analyzed. HAR silicon etch is an application associated with microelectromechanical systems and the application for three-dimensional integrated circuit required HAR etch with high and stable throughput, controllable profile and surface properties.
- Published
- 2010